loadpatents
Patent applications and USPTO patent grants for Ling; Jianbo.The latest application filed is for "package".
Patent | Date |
---|---|
Package App 20210354872 - Ling; Jianbo ;   et al. | 2021-11-18 |
IC test information management system based on industrial internet Grant 11,042,680 - Luo , et al. June 22, 2 | 2021-06-22 |
Optimization Method For Integrated Circuit Wafer Test App 20200309845 - Wang; Hua ;   et al. | 2020-10-01 |
Configuration and testing method and system for FPGA chip using bumping process Grant 10,613,145 - Luo , et al. | 2020-04-07 |
Ic Test Information Management System Based On Industrial Internet App 20200089820 - LUO; Bin ;   et al. | 2020-03-19 |
Configuration And Testing Method And System For Fpga Chip Using Bumping Process App 20180024194 - LUO; Bin ;   et al. | 2018-01-25 |
Ieee 1149.1 Standard Based Testing Methods Used In Packaging App 20160223612 - YE; Shouyin ;   et al. | 2016-08-04 |
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