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name:-0.0037918090820312
name:-0.00055193901062012
Lindner; Paul Patent Filings

Lindner; Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lindner; Paul.The latest application filed is for "device and method for bonding substrates".

Company Profile
0.3.4
  • Lindner; Paul - Oakland CA
  • Lindner; Paul - Scharding AT
  • Lindner; Paul - Scharding/Inn AT
  • Lindner; Paul - Henndorf AT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Aggregating online activities
Grant 9,720,495 - Jordan , et al. August 1, 2
2017-08-01
Device And Method For Bonding Substrates
App 20150210057 - Wagenleithner; Thomas ;   et al.
2015-07-30
Device And Method For Loosening A Polymer Layer From A Surface Of A Substrate
App 20110265822 - Crowder; Matt ;   et al.
2011-11-03
Transport System For Accommodating And Transporting Flexible Substrates
App 20110114450 - Lindner; Paul ;   et al.
2011-05-19
Take-up device for web-shaped materials, especially plastic films
Grant 7,028,944 - Lindner April 18, 2
2006-04-18
Take-up device for web-shaped materials, especially plastic films
App 20040108405 - Lindner, Paul
2004-06-10
Transport device and associated guiding rail
Grant 5,924,180 - Lindner , et al. July 20, 1
1999-07-20

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