Lindgren; Peter James
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lindgren; Peter James.The latest application filed is for "through substrate annular via including plug filler".
- Lindgren; Peter James - Essex Junction VT US
- Lindgren; Peter James - Burlington VT
| Patent | Date |
|---|---|
| Through substrate via including variable sidewall profile Grant 8,643,190 - Cooney, III , et al. February 4, 2 | 2014-02-04 |
| Metal adhesion by induced surface roughness Grant 8,039,314 - DeGraw , et al. October 18, 2 | 2011-10-18 |
| Through Substrate Annular Via Including Plug Filler App 20110129996 - Lindgren; Peter James ; et al. | 2011-06-02 |
| Through Substrate Via Including Variable Sidewall Profile App 20110068477 - Cooney, III; Edward Crandal ; et al. | 2011-03-24 |
| Through substrate annular via including plug filler Grant 7,898,063 - Lindgren , et al. March 1, 2 | 2011-03-01 |
| Through substrate via including variable sidewall profile Grant 7,863,180 - Cooney, III , et al. January 4, 2 | 2011-01-04 |
| Cobal disilicide structure Grant 7,696,586 - Agnello , et al. April 13, 2 | 2010-04-13 |
| Metal Adhesion By Induced Surface Roughness App 20100025825 - DeGraw; Danielle L. ; et al. | 2010-02-04 |
| Through Substrate Via Including Variable Sidewall Profile App 20090278237 - Cooney, III; Edward Crandal ; et al. | 2009-11-12 |
| Through Substrate Annular Via Including Plug Filler App 20090206488 - Lindgren; Peter James ; et al. | 2009-08-20 |
| Cobalt Disilicide Structure App 20080296706 - Agnello; David Paul ; et al. | 2008-12-04 |
| Cobalt disilicide structure Grant 7,411,258 - Agnello , et al. August 12, 2 | 2008-08-12 |
| Removal Of Etching Process Residual In Semiconductor Fabrication App 20080174015 - Herrin; Russell Thomas ; et al. | 2008-07-24 |
| Wet cleans for cobalt disilicide processing App 20020004303 - Agnello, David Paul ; et al. | 2002-01-10 |
| Wet cleans for cobalt disilicide processing Grant 6,335,294 - Agnello , et al. January 1, 2 | 2002-01-01 |
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