Lindgren; Joseph T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lindgren; Joseph T..The latest application filed is for "semiconductor device with copper wirebond sites and methods of making same".

Company Profile

0.22.22

Lindgren; Joseph T. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with copper wirebond sites and methods of making same Grant 9,054,099 - Lindgren June 9, 2	2015-06-09
Semiconductor Device With Copper Wirebond Sites And Methods Of Making Same App 20140054777 - Lindgren; Joseph T.	2014-02-27
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 8,592,254 - Lindgren , et al. November 26, 2	2013-11-26
Semiconductor device with copper wirebond sites and methods of making same Grant 8,569,161 - Lindgren October 29, 2	2013-10-29
Stable electroless fine pitch interconnect plating Grant 8,431,484 - Lindgren April 30, 2	2013-04-30
Microelectronic Devices With Improved Heat Dissipation And Methods For Cooling Microelectronic Devices App 20130003303 - Lindgren; Joseph T. ; et al.	2013-01-03
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 8,291,966 - Lindgren , et al. October 23, 2	2012-10-23
Semiconductor Device With Copper Wirebond Sites And Methods Of Making Same App 20110212578 - Lindgren; Joseph T.	2011-09-01
Stable Electroless Fine Pitch Interconnect Plating App 20110183514 - Lindgren; Joseph T.	2011-07-28
Semiconductor device with copper wirebond sites and methods of making same Grant 7,939,949 - Lindgren May 10, 2	2011-05-10
Semiconductor Device With Copper Wirebond Sites And Methods Of Making Same App 20090085209 - Lindgren; Joseph T.	2009-04-02
Nickel bonding cap over copper metalized bondpads Grant 7,485,565 - Gleason , et al. February 3, 2	2009-02-03
Selective passivation of exposed silicon Grant 7,312,164 - Lindgren December 25, 2	2007-12-25
Asymmetric plating Grant 7,256,115 - Farnworth , et al. August 14, 2	2007-08-14
Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings App 20070170551 - Lindgren; Joseph T.	2007-07-26
Microelectronic Devices With Improved Heat Dissipation And Methods For Cooling Microelectronic Devices App 20070075407 - Lindgren; Joseph T. ; et al.	2007-04-05
Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material Grant 7,190,052 - Lindgren March 13, 2	2007-03-13
Nickel bonding cap over copper metalized bondpads Grant 7,186,636 - Gleason , et al. March 6, 2	2007-03-06
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 7,183,133 - Lindgren , et al. February 27, 2	2007-02-27
Nickel bonding cap over copper metalized bondpads App 20060276016 - Gleason; Jeffery N. ; et al.	2006-12-07
Stable electroless fine pitch interconnect plating App 20060180461 - Lindgren; Joseph T.	2006-08-17
Nickel bonding cap over copper metalized bondpads Grant 7,067,924 - Gleason , et al. June 27, 2	2006-06-27
Stable electroless fine pitch interconnect plating Grant 7,052,922 - Lindgren May 30, 2	2006-05-30
Selective passivation of exposed silicon App 20050164500 - Lindgren, Joseph T.	2005-07-28
Selective passivation of exposed silicon Grant 6,905,953 - Lindgren June 14, 2	2005-06-14
Asymmetric plating App 20050032387 - Farnworth, Warren M. ; et al.	2005-02-10
Nickel bonding cap over copper metalized bondpads App 20050023685 - Gleason, Jeffery N. ; et al.	2005-02-03
Stable electroless fine pitch interconnect plating App 20050020064 - Lindgren, Joseph T.	2005-01-27
Nickel bonding cap over copper metalized bondpads App 20050020069 - Gleason, Jeffery N. ; et al.	2005-01-27
Asymmetric plating App 20040238952 - Farnworth, Warren M. ; et al.	2004-12-02
Nickel bonding cap over copper metalized bondpads Grant 6,825,564 - Gleason , et al. November 30, 2	2004-11-30
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices App 20040195677 - Lindgren, Joseph T. ; et al.	2004-10-07
Asymmetric plating Grant 6,767,817 - Farnworth , et al. July 27, 2	2004-07-27
Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Grant 6,710,442 - Lindgren , et al. March 23, 2	2004-03-23
Microelectronic Devices With Improved Heat Dissipation And Methods For Cooling Microelectronic Devices App 20040041255 - Lindgren, Joseph T. ; et al.	2004-03-04
Nickel bonding cap over copper metalized bondpads App 20040036137 - Gleason, Jeffery N. ; et al.	2004-02-26
Selective passivation of exposed silicon App 20040033682 - Lindgren, Joseph T.	2004-02-19
Selective passivation of exposed silicon App 20040033680 - Lindgren, Joseph T.	2004-02-19
Method and apparatus for protecting tooling in a lead-free bath App 20040026256 - Lindgren, Joseph T.	2004-02-12
Asymmetric plating App 20040007611 - Farnworth, Warren M. ; et al.	2004-01-15
Selective passivation of exposed silicon Grant 6,593,221 - Lindgren July 15, 2	2003-07-15

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