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Patent applications and USPTO patent grants for Lin; Yushun.The latest application filed is for "integrated circuit package and method of forming same".
Patent | Date |
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Photonic package and method forming same Grant 11,150,404 - Huang , et al. October 19, 2 | 2021-10-19 |
Integrated Circuit Package And Method Of Forming Same App 20210320097 - Hou; Shang-Yun ;   et al. | 2021-10-14 |
Method of forming a dummy die of an integrated circuit having an embedded annular structure Grant 11,101,260 - Hou , et al. August 24, 2 | 2021-08-24 |
Chip package structure with dummy bump and method for forming the same Grant 10,872,871 - Huang , et al. December 22, 2 | 2020-12-22 |
Chip Package Structure With Dummy Bump And Method For Forming The Same App 20200203299 - HUANG; Sung-Hui ;   et al. | 2020-06-25 |
Photonic Package and Method Forming Same App 20190369329 - Huang; Sung-Hui ;   et al. | 2019-12-05 |
Photonic package and method forming same Grant 10,459,159 - Huang , et al. Oc | 2019-10-29 |
Photonic Package and Method Forming Same App 20190250327 - Huang; Sung-Hui ;   et al. | 2019-08-15 |
Integrated Circuit Package And Method Of Forming Same App 20190237454 - Hou; Shang-Yun ;   et al. | 2019-08-01 |
Photonic package and method forming same Grant 10,267,988 - Huang , et al. | 2019-04-23 |
Photonic Package and Method Forming Same App 20190004247 - Huang; Sung-Hui ;   et al. | 2019-01-03 |
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