Lin; Yueh-Chiou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Yueh-Chiou.The latest application filed is for "pad structure for enhanced bondability".

Company Profile

1.14.13

Lin; Yueh-Chiou - Taichung County TW
Lin; Yueh-Chiou - Taichung TW
Lin; Yueh-Chiou - Longjing Shiang N/A TW
Lin; Yueh-Chiou - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pad Structure For Enhanced Bondability App 20220139838 - Huang; Ru-Ying ; et al.	2022-05-05
Pad structure for enhanced bondability Grant 11,227,836 - Huang , et al. January 18, 2	2022-01-18
Pad Structure For Enhanced Bondability App 20200126920 - Huang; Ru-Ying ; et al.	2020-04-23
Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Grant 10,535,696 - Lin , et al. Ja	2020-01-14
Pad Structure Exposed In An Opening Through Multiple Dielectric Layers In Bsi Image Sensor Chips App 20170250215 - Lin; Jeng-Shyan ; et al.	2017-08-31
Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Grant 9,653,508 - Lin , et al. May 16, 2	2017-05-16
Pad Structure Exposed in an Opening Through Multiple Dielectric Layers in BSI Image Sensor Chips App 20160260764 - Lin; Jeng-Shyan ; et al.	2016-09-08
Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips Grant 9,362,329 - Lin , et al. June 7, 2	2016-06-07
Pad structures formed in double openings in dielectric layers Grant 9,184,207 - Lin , et al. November 10, 2	2015-11-10
Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer in BSI Image Sensor Chips App 20150228690 - Lin; Jeng-Shyan ; et al.	2015-08-13
Pad Structures Formed in Double Openings in Dielectric Layers App 20150194465 - Lin; Jeng-Shyan ; et al.	2015-07-09
Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips Grant 9,013,022 - Lin , et al. April 21, 2	2015-04-21
Pad structures formed in double openings in dielectric layers Grant 8,987,855 - Lin , et al. March 24, 2	2015-03-24
Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same Grant 8,664,736 - Tsai , et al. March 4, 2	2014-03-04
Backside illumination sensor having a bonding pad structure and method of making the same Grant 8,435,824 - Tsai , et al. May 7, 2	2013-05-07
Pad Structures Formed in Double Openings in Dielectric Layers App 20130032920 - Lin; Jeng-Shyan ; et al.	2013-02-07
Pad Structures in BSI Image Sensor Chips App 20130032916 - Lin; Jeng-Shyan ; et al.	2013-02-07
Backside Illumination Sensor Having A Bonding Pad Structure And Method Of Making The Same App 20130009270 - Tsai; Shuang-Ji ; et al.	2013-01-10
Semiconductor Device Having a Bonding Pad and Method of Manufacturing The Same App 20120292730 - Tsai; Shuang-Ji ; et al.	2012-11-22
Shielding structures for preventing leakages in high voltage MOS devices Grant 7,521,741 - Jong , et al. April 21, 2	2009-04-21
Shielding structures for preventing leakages in high voltage MOS devices App 20080001189 - Jong; Yu-Chang ; et al.	2008-01-03

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