Lin; Yuan-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Yuan-Fu.The latest application filed is for "operation member and electronic devices having the same".

Company Profile

0.7.8

Lin; Yuan-Fu - Santa Clara CA
Lin; Yuan-Fu - New Taipei TW
LIN; YUAN-FU - NEW TAIPEI CITY TW
Lin; Yuan-Fu - Yingge Township TW
Lin, Yuan-Fu - Taichung TW
Lin, Yuan-Fu - Ta-Li City TW
Lin, Yuan-Fu - Da-Li City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Clock data recovery for automotive vision system Grant 10,749,664 - Wang , et al. A	2020-08-18
Operation member and electronic devices having the same Grant 10,008,794 - Ho , et al. June 26, 2	2018-06-26
Operation Member And Electronic Devices Having The Same App 20170222343 - HO; CHUN-LUNG ; et al.	2017-08-03
Operation member and electronic devices having the same Grant 9,684,330 - Ho , et al. June 20, 2	2017-06-20
Mounting mechanism Grant 9,444,231 - Ho , et al. September 13, 2	2016-09-13
Inverter Grant D755,123 - Ho , et al. May 3, 2	2016-05-03
Mounting Mechanism App 20160021776 - HO; CHUN-LUNG ; et al.	2016-01-21
Inverter Grant D745,847 - Ho , et al. December 22, 2	2015-12-22
Operation Member And Electronic Devices Having The Same App 20150331441 - HO; CHUN-LUNG ; et al.	2015-11-19
Colored, transparent coating layer for golf club head and golf club head members App 20080076598 - Lin; Yuan-Fu	2008-03-27
Golf club head and surface finishing tool and method for forming pattern thereon App 20070135229 - Lo; Chih-Wei ; et al.	2007-06-14
Method for making a precision molding glass and molding device implementing for the method App 20050132751 - Lin, Yuan-Fu ; et al.	2005-06-23
Delamination-preventing substrate and semiconductor package with the same Grant 6,608,388 - Lin , et al. August 19, 2	2003-08-19
Delamination-preventing substrate and semiconductor package with the same App 20030080439 - Lin, Yuan-Fu ; et al.	2003-05-01
Method of eliminating silicon residual from wafer after dicing saw process App 20020076905 - Lin, Yuan-Fu ; et al.	2002-06-20

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