Lin; Ying-Ren

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Ying-Ren.The latest application filed is for "method for fabricating semiconductor packages, and structure and method for positioning semiconductor components".

Company Profile

0.7.8

Lin; Ying-Ren - Kaohsiung TW
Lin; Ying-Ren - Taichung Hsien TW
Lin; Ying-Ren - Taichung TW
Lin; Ying-Ren - Tantzu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked die package with stud spacers Grant 7,750,450 - Lin , et al. July 6, 2	2010-07-06
Method for fabricating semiconductor packages Grant 7,348,211 - Lin , et al. March 25, 2	2008-03-25
Bump structure of semiconductor package and method for fabricating the same Grant 7,271,483 - Lin , et al. September 18, 2	2007-09-18
Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components App 20070141761 - Lin; Ying-Ren ; et al.	2007-06-21
Method For Fabricating Semiconductor Packages App 20070054484 - Lin; Ying-Ren ; et al.	2007-03-08
Semiconductor device with reinforced under-support structure and method of fabricating the same Grant 7,180,183 - Tsai , et al. February 20, 2	2007-02-20
Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure Grant 7,173,828 - Lin , et al. February 6, 2	2007-02-06
Method for fabricating semiconductor packages Grant 7,129,119 - Lin , et al. October 31, 2	2006-10-31
Bump structure of semiconductor package and method for fabricating the same App 20060051954 - Lin; Ying-Ren ; et al.	2006-03-09
Method for fabricating semiconductor packages App 20050287713 - Lin, Ying-Ren ; et al.	2005-12-29
Method for fabricating semiconductor packages App 20050287707 - Lin, Ying-Ren ; et al.	2005-12-29
Thermally enhanced semiconductor package with EMI shielding Grant 6,865,084 - Lin , et al. March 8, 2	2005-03-08
Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure App 20050023704 - Lin, Ying-Ren ; et al.	2005-02-03
Thermally Enhanced Semicoductor Package With Emi Shielding App 20040156172 - Lin, Ying-Ren ; et al.	2004-08-12
Semiconductor device with reinforced under-support structure and method of fabricating the same App 20040080043 - Tsai, Ho-Yi ; et al.	2004-04-29

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