Lin; Yih-Hsiung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Yih-Hsiung.The latest application filed is for "surface treatment of metal interconnect lines".
- Lin; Yih-Hsiung - Sanchung TW
| Patent | Date |
|---|---|
| Surface treatment of metal interconnect lines Grant 8,053,894 - Wan , et al. November 8, 2 | 2011-11-08 |
| Integration film scheme for copper / low-k interconnect Grant 7,244,673 - Huang , et al. July 17, 2 | 2007-07-17 |
| Surface treatment of metal interconnect lines App 20060001160 - Wan; Wen-Kai ; et al. | 2006-01-05 |
| Surface treatment of metal interconnect lines Grant 6,955,984 - Wan , et al. October 18, 2 | 2005-10-18 |
| Integration film scheme for copper / low-k interconnect App 20050098896 - Huang, Tai-Chun ; et al. | 2005-05-12 |
| Surface treatment of metal interconnect lines App 20040229460 - Wan, Wen-Kai ; et al. | 2004-11-18 |
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