| Patent | Date |
|---|
Semiconductor Package Having A Stiffener Ring
App 20220262691 - Pan; Chi-Wen ; et al. | 2022-08-18 |
Semiconductor Package Structure And Method For Forming The Same
App 20220238446 - CHANG; Po-Hao ; et al. | 2022-07-28 |
Semiconductor package structure and method for forming the same
Grant 11,342,267 - Chang , et al. May 24, 2 | 2022-05-24 |
Semiconductor Package Structure
App 20220139848 - CHANG; Chia-Cheng ; et al. | 2022-05-05 |
Semiconductor package having a stiffener ring
Grant 11,302,592 - Pan , et al. April 12, 2 | 2022-04-12 |
Electronic Package With Rotated Semiconductor Die
App 20220108954 - Su; Yao-Chun ; et al. | 2022-04-07 |
Semiconductor package structure
Grant 11,264,337 - Chang , et al. March 1, 2 | 2022-03-01 |
Semiconductor Package Structure Having An Annular Frame With Truncated Corners
App 20220020726 - CHANG; Chia-Cheng ; et al. | 2022-01-20 |
Electronic package with rotated semiconductor die
Grant 11,222,850 - Su , et al. January 11, 2 | 2022-01-11 |
Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof
App 20210358824 - Jeng; Shin-Puu ; et al. | 2021-11-18 |
Semiconductor package structure having an annular frame with truncated corners
Grant 11,171,113 - Chang , et al. November 9, 2 | 2021-11-09 |
Semiconductor Package Structure
App 20210313271 - Tsai; Yi-Lin ; et al. | 2021-10-07 |
Semiconductor Package Structure
App 20210313299 - TSAI; Yi-Lin ; et al. | 2021-10-07 |
Integrated fan-out package, package-on-package structure, and manufacturing method thereof
Grant 11,075,132 - Jeng , et al. July 27, 2 | 2021-07-27 |
Interconnect structure for package-on-package devices
Grant 11,037,861 - Hung , et al. June 15, 2 | 2021-06-15 |
Semiconductor Package Structure
App 20210159177 - TSAI; Yi-Lin ; et al. | 2021-05-27 |
Semiconductor Chip Package And Fabrication Method Thereof
App 20210111090 - Tsai; Yi-Lin ; et al. | 2021-04-15 |
Electronic Package With Rotated Semiconductor Die
App 20200365515 - Su; Yao-Chun ; et al. | 2020-11-19 |
Semiconductor Package With Dummy Mim Capacitor Die
App 20200365572 - Su; Yao-Chun ; et al. | 2020-11-19 |
Semiconductor Package Structure And Method For Forming The Same
App 20200168548 - CHANG; Po-Hao ; et al. | 2020-05-28 |
Semiconductor Package Structure
App 20200105684 - CHANG; Chia-Cheng ; et al. | 2020-04-02 |
Interconnect Structure for Package-on-Package Devices
App 20200083145 - Hung; Jui-Pin ; et al. | 2020-03-12 |
Semiconductor Package Structure Having An Annular Frame With Truncated Corners
App 20200006289 - Chang; Chia-Cheng ; et al. | 2020-01-02 |
Interconnect structure for package-on-package devices
Grant 10,515,875 - Hung , et al. Dec | 2019-12-24 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20190252296 - Hung; Jui-Pin ; et al. | 2019-08-15 |
Using metal-containing layer to reduce carrier shock in package formation
Grant 10,354,988 - Jeng , et al. July 16, 2 | 2019-07-16 |
Fan-out package structure and method for forming the same
Grant 10,290,605 - Jeng , et al. | 2019-05-14 |
Stacked semiconductor device and method of manufacturing the same
Grant 10,290,590 - Jeng , et al. | 2019-05-14 |
Interconnect structure for package-on-package devices
Grant 10,269,685 - Hung , et al. | 2019-04-23 |
Semiconductor Package Having A Stiffener Ring
App 20190115269 - Pan; Chi-Wen ; et al. | 2019-04-18 |
Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof
App 20190067144 - Jeng; Shin-Puu ; et al. | 2019-02-28 |
Using Metal-Containing Layer to Reduce Carrier Shock in Package Formation
App 20190027469 - Jeng; Shin-Puu ; et al. | 2019-01-24 |
Fan-out Package Structure And Method For Forming The Same
App 20190006314 - Jeng; Shin-Puu ; et al. | 2019-01-03 |
Using metal-containing layer to reduce carrier shock in package formation
Grant 10,083,949 - Jeng , et al. September 25, 2 | 2018-09-25 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20180211901 - Hung; Jui-Pin ; et al. | 2018-07-26 |
Projector and projecting lens thereof
Grant 10,025,092 - Lin , et al. July 17, 2 | 2018-07-17 |
Stacked Semiconductor Device And Method Of Manufacturing The Same
App 20180151512 - JENG; SHIN-PUU ; et al. | 2018-05-31 |
Interconnect structure for package-on-package devices and a method of fabricating
Grant 9,922,903 - Hung , et al. March 20, 2 | 2018-03-20 |
Using Metal-containing Layer To Reduce Carrier Shock In Package Formation
App 20180033782 - Jeng; Shin-Puu ; et al. | 2018-02-01 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20170025397 - Hung; Jui-Pin ; et al. | 2017-01-26 |
Interconnect structure for package-on-package devices and a method of fabricating
Grant 9,460,987 - Hung , et al. October 4, 2 | 2016-10-04 |
Projector and projecting lens of the projector
Grant 9,448,464 - Lin , et al. September 20, 2 | 2016-09-20 |
Projector, projecting lens of the projector and method of projecting images
Grant 9,417,443 - Lin , et al. August 16, 2 | 2016-08-16 |
Projector And Projecting Lens Of The Projector
App 20160116830 - LIN; Yi-Jou ; et al. | 2016-04-28 |
Projector, Projecting Lens Of The Projector And Method Of Projecting Images
App 20150346469 - LIN; Yi-Jou ; et al. | 2015-12-03 |
Interconnect Structure for Package-on-Package Devices
App 20150255447 - Hung; Jui-Pin ; et al. | 2015-09-10 |
Method of fabricating interconnect structure for package-on-package devices
Grant 9,048,222 - Hung , et al. June 2, 2 | 2015-06-02 |
Packages with passive devices and methods of forming the same
Grant 9,040,381 - Yu , et al. May 26, 2 | 2015-05-26 |
Interconnect Structure for Package-on-Package Devices
App 20140252646 - Hung; Jui-Pin ; et al. | 2014-09-11 |
Packages with passive devices and methods of forming the same
Grant 8,680,647 - Yu , et al. March 25, 2 | 2014-03-25 |
Packages with Passive Devices and Methods of Forming the Same
App 20140073091 - Yu; Chen-Hua ; et al. | 2014-03-13 |
Packages with Passive Devices and Methods of Forming the Same
App 20130168805 - Yu; Chen-Hua ; et al. | 2013-07-04 |
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