LIN; Yi-Hang

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIN; Yi-Hang.The latest application filed is for "chip package structure with ring structure and method for forming the same".

Company Profile

2.13.12

LIN; Yi-Hang - Hsinchu City TW
Lin; Yi-Hang - Hsinchu TW
Lin; Yi-Hang - Hsin-Chu TW
Lin; Yi-Hang - New Taipei TW
LIN; Yi-Hang - New Taipei City TW
Lin; Yi-Hang - Banqiao N/A TW
Lin; Yi-Hang - Banqiao City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Package Structure With Ring Structure And Method For Forming The Same App 20210217676 - YEH; Shu-Shen ; et al.	2021-07-15
Methods of packaging semiconductor devices including placing semiconductor devices into die caves Grant 10,964,594 - Lin , et al. March 30, 2	2021-03-30
Methods Of Packaging Semiconductor Devices And Structures Thereof App 20190122929 - Lin; Jing-Cheng ; et al.	2019-04-25
Methods of packaging semiconductor devices including placing semiconductor devices into die caves Grant 10,163,711 - Lin , et al. Dec	2018-12-25
Method for forming chip package structure with adhesive layer Grant 10,163,875 - Cheng , et al. Dec	2018-12-25
Method For Forming Chip Package Structure With Adhesive Layer App 20180308825 - CHENG; Li-Hui ; et al.	2018-10-25
Chip package structure with adhesive layer Grant 9,929,128 - Cheng , et al. March 27, 2	2018-03-27
Methods of Packaging Semiconductor Devices and Structures Thereof App 20170271209 - Lin; Jing-Cheng ; et al.	2017-09-21
Methods of packaging semiconductor devices and structures thereof Grant 9,673,098 - Lin , et al. June 6, 2	2017-06-06
Methods of Packaging Semiconductor Devices and Structures Thereof App 20160343615 - Lin; Jing-Cheng ; et al.	2016-11-24
Methods of packaging semiconductor devices and structures thereof Grant 9,406,581 - Lin , et al. August 2, 2	2016-08-02
Methods of Packaging Semiconductor Devices and Structures Thereof App 20150364395 - Lin; Jing-Cheng ; et al.	2015-12-17
Chip package and method for forming the same Grant 9,196,594 - Lin , et al. November 24, 2	2015-11-24
Methods of packaging semiconductor devices and structures thereof Grant 9,117,682 - Lin , et al. August 25, 2	2015-08-25
Chip package and method for forming the same Grant 9,030,011 - Lin , et al. May 12, 2	2015-05-12
Adhesion between post-passivation interconnect structure and polymer Grant 8,916,972 - Lin , et al. December 23, 2	2014-12-23
Chip Package And Method For Forming The Same App 20140328523 - LIN; Chao-Yen ; et al.	2014-11-06
Adhesion between Post-Passivation Interconnect Structure and Polymer App 20140264853 - Lin; Jing-Cheng ; et al.	2014-09-18
Chip Package And Method For Forming The Same App 20130320532 - LIN; Chao-Yen ; et al.	2013-12-05
Chip package and method for forming the same Grant 8,507,321 - Lin , et al. August 13, 2	2013-08-13
Methods of Packaging Semiconductor Devices and Structures Thereof App 20130087916 - Lin; Jing-Cheng ; et al.	2013-04-11
Chip Package And Method For Forming The Same App 20110278724 - LIN; Chao-Yen ; et al.	2011-11-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.