| Patent | Date |
|---|
Apparatus And Method For Wafer Bonding
App 20220285156 - LIN; YEONG-JYH ; et al. | 2022-09-08 |
Wafer level transfer molding and apparatus for performing the same
Grant 11,390,000 - Jang , et al. July 19, 2 | 2022-07-19 |
Photolithography alignment process for bonded wafers
Grant 11,362,038 - Lin , et al. June 14, 2 | 2022-06-14 |
Apparatus and method for wafer bonding
Grant 11,348,790 - Lin , et al. May 31, 2 | 2022-05-31 |
3d Trench Capacitor For Integrated Passive Devices
App 20220115358 - Huang; Xin-Hua ; et al. | 2022-04-14 |
Mechanisms for forming bonding structures
Grant 11,233,032 - Lin , et al. January 25, 2 | 2022-01-25 |
3D trench capacitor for integrated passive devices
Grant 11,211,362 - Huang , et al. December 28, 2 | 2021-12-28 |
Photolithography Alignment Process For Bonded Wafers
App 20210375781 - Lin; Yeong-Jyh ; et al. | 2021-12-02 |
Method for alignment, process tool and method for wafer-level alignment
Grant 11,189,515 - Wang , et al. November 30, 2 | 2021-11-30 |
3d Trench Capacitor For Integrated Passive Devices
App 20210296283 - Huang; Xin-Hua ; et al. | 2021-09-23 |
Semiconductor structure and associated manufacturing method
Grant 11,127,725 - Liu , et al. September 21, 2 | 2021-09-21 |
Deposition System For High Accuracy Patterning
App 20210273167 - Liu; Ping-Yin ; et al. | 2021-09-02 |
Wafer-level underfill and over-molding
Grant 11,024,618 - Jang , et al. June 1, 2 | 2021-06-01 |
Methods for controlling warpage in packaging
Grant 10,985,135 - Hwang , et al. April 20, 2 | 2021-04-20 |
Semiconductor device having a boundary structure, a package on package structure, and a method of making
Grant 10,804,234 - Hwang , et al. October 13, 2 | 2020-10-13 |
Semiconductor wafer device and manufacturing method thereof
Grant 10,770,331 - Jang , et al. Sep | 2020-09-08 |
Apparatus And Method For Wafer Bonding
App 20200258743 - A1 | 2020-08-13 |
Packaging through pre-formed metal pins
Grant 10,734,345 - Yu , et al. | 2020-08-04 |
Method For Alignment, Process Tool And Method For Wafer-level Alignment
App 20200227298 - Wang; Ching-Hung ; et al. | 2020-07-16 |
Semiconductor Structure And Associated Manufacturing Method
App 20200185369 - LIU; PING-YIN ; et al. | 2020-06-11 |
Apparatus and method for wafer bonding
Grant 10,636,661 - Lin , et al. | 2020-04-28 |
Method for alignment, process tool and method for wafer-level alignment
Grant 10,636,688 - Wang , et al. | 2020-04-28 |
Methods for Controlling Warpage in Packaging
App 20200118969 - Hwang; Chien Ling ; et al. | 2020-04-16 |
Wafer Level Transfer Molding and Apparatus for Performing the Same
App 20200114556 - Jang; Bor-Ping ; et al. | 2020-04-16 |
Stacked LED structure and associated manufacturing method
Grant 10,622,342 - Liu , et al. | 2020-04-14 |
Mechanisms for Forming Bonding Structures
App 20200105710 - Lin; Yeong-Jyh ; et al. | 2020-04-02 |
Bond Alignment Method For High Accuracy And High Throughput
App 20190393067 - Wang; Ching-Hung ; et al. | 2019-12-26 |
Wafer level transfer molding and apparatus for performing the same
Grant 10,513,070 - Jang , et al. Dec | 2019-12-24 |
Methods for controlling warpage in packaging
Grant 10,510,712 - Hwang , et al. Dec | 2019-12-17 |
Mechanisms for forming bonding structures
Grant 10,504,870 - Lin , et al. Dec | 2019-12-10 |
Semiconductor Device Having A Boundary Structure, A Package On Package Structure, And A Method Of Making
App 20190237422 - Hwang; Chien Ling ; et al. | 2019-08-01 |
Semiconductor Structure And Associated Manufacturing Method
App 20190139949 - LIU; PING-YIN ; et al. | 2019-05-09 |
Semiconductor device having a boundary structure, a package on package structure, and a method of making
Grant 10,276,531 - Hwang , et al. | 2019-04-30 |
Methods for Controlling Warpage in Packaging
App 20190123018 - Hwang; Chien Ling ; et al. | 2019-04-25 |
Methods for controlling warpage in packaging
Grant 10,157,881 - Hwang , et al. Dec | 2018-12-18 |
Semiconductor Wafer Device And Manufacturing Method Thereof
App 20180358255 - JANG; BOR-PING ; et al. | 2018-12-13 |
Methods for stud bump formation
Grant 10,147,693 - Hwang , et al. De | 2018-12-04 |
Semiconductor wafer device and manufacturing method thereof
Grant 10,056,285 - Jang , et al. August 21, 2 | 2018-08-21 |
Packaging through Pre-Formed Metal Pins
App 20180204816 - Yu; Chen-Hua ; et al. | 2018-07-19 |
Wafer-Level Underfill and Over-Molding
App 20180175013 - Jang; Bor-Ping ; et al. | 2018-06-21 |
Packaging through pre-formed metal pins
Grant 9,929,118 - Yu , et al. March 27, 2 | 2018-03-27 |
Hybrid bonding system and cleaning method thereof
Grant 9,917,069 - Liu , et al. March 13, 2 | 2018-03-13 |
Wafer Level Transfer Molding and Apparatus for Performing the Same
App 20180043593 - Jang; Bor-Ping ; et al. | 2018-02-15 |
Semiconductor Wafer Device And Manufacturing Method Thereof
App 20180047611 - JANG; BOR-PING ; et al. | 2018-02-15 |
Wafer-level underfill and over-molding
Grant 9,893,044 - Jang , et al. February 13, 2 | 2018-02-13 |
Mechanisms For Forming Bonding Structures
App 20180005976 - Lin; Yeong-Jyh ; et al. | 2018-01-04 |
Structure and formation method of semiconductor device structure
Grant 9,834,435 - Liu , et al. December 5, 2 | 2017-12-05 |
Semiconductor wafer device and manufacturing method thereof
Grant 9,812,346 - Jang , et al. November 7, 2 | 2017-11-07 |
Wafer level transfer molding and apparatus for performing the same
Grant 9,802,349 - Jang , et al. October 31, 2 | 2017-10-31 |
Mechanisms for forming bonding structures
Grant 9,768,142 - Lin , et al. September 19, 2 | 2017-09-19 |
Semiconductor Device Having A Boundary Structure, A Package On Package Structure, And A Method Of Making
App 20170256513 - Hwang; Chien Ling ; et al. | 2017-09-07 |
Bonding System And Associated Apparatus And Method
App 20170207191 - HUANG; XIN-HUA ; et al. | 2017-07-20 |
Apparatus And Method For Wafer Bonding
App 20170207089 - LIN; YEONG-JYH ; et al. | 2017-07-20 |
Semiconductor device having a boundary structure, a package on package structure, and a method of making
Grant 9,659,891 - Hwang , et al. May 23, 2 | 2017-05-23 |
Method of forming interconnects for three dimensional integrated circuit
Grant 9,583,365 - Yu , et al. February 28, 2 | 2017-02-28 |
Methods for Controlling Warpage in Packaging
App 20170032980 - Hwang; Chien Ling ; et al. | 2017-02-02 |
Packaging through Pre-Formed Metal Pins
App 20160343681 - Yu; Chen-Hua ; et al. | 2016-11-24 |
Methods for forming apparatus for stud bump formation
Grant 9,498,851 - Lin , et al. November 22, 2 | 2016-11-22 |
Methods for controlling warpage in packaging
Grant 9,484,226 - Hwang , et al. November 1, 2 | 2016-11-01 |
Hybrid Bonding System And Cleaning Method Thereof
App 20160293567 - LIU; Ping-Yin ; et al. | 2016-10-06 |
Chip packages and methods of manufacture thereof
Grant 9,425,179 - Hwang , et al. August 23, 2 | 2016-08-23 |
Packaging through pre-formed metal pins
Grant 9,418,953 - Yu , et al. August 16, 2 | 2016-08-16 |
Semiconductor Wafer Device And Manufacturing Method Thereof
App 20160099165 - JANG; BOR-PING ; et al. | 2016-04-07 |
Chip Packages And Methods Of Manufacture Thereof
App 20160064367 - Hwang; Chien Ling ; et al. | 2016-03-03 |
Semiconductor wafer device
Grant 9,236,351 - Jang , et al. January 12, 2 | 2016-01-12 |
Methods for Controlling Warpage in Packaging
App 20150262845 - Hwang; Chien Ling ; et al. | 2015-09-17 |
Methods for Stud Bump Formation and Apparatus for Performing the Same
App 20150235975 - Hwang; Chien Ling ; et al. | 2015-08-20 |
Methods for controlling warpage in packaging
Grant 9,093,337 - Hwang , et al. July 28, 2 | 2015-07-28 |
Packaging through Pre-Formed Metal Pins
App 20150200171 - Yu; Chen-Hua ; et al. | 2015-07-16 |
Wafer-Level Underfill and Over-Molding
App 20150130111 - Jang; Bor-Ping ; et al. | 2015-05-14 |
Apparatus for stud bump formation
Grant 9,021,682 - Hwang , et al. May 5, 2 | 2015-05-05 |
Methods for Forming Apparatus for Stud Bump Formation
App 20150102091 - Lin; Yeong-Jyh ; et al. | 2015-04-16 |
Semiconductor Device And Manufacturing Method Thereof
App 20150097272 - JANG; BOR-PING ; et al. | 2015-04-09 |
Methods for Controlling Warpage in Packaging
App 20150093858 - Hwang; Chien Ling ; et al. | 2015-04-02 |
Semiconductor Device Having A Boundary Structure, A Package On Package Structure, And A Method Of Making
App 20150069604 - HWANG; Chien Ling ; et al. | 2015-03-12 |
Wafer-level underfill and over-molding
Grant 8,951,037 - Jang , et al. February 10, 2 | 2015-02-10 |
Mechanisms For Forming Bonding Structures
App 20150021760 - LIN; Yeong-Jyh ; et al. | 2015-01-22 |
Methods for forming apparatus for stud bump formation
Grant 8,936,730 - Lin , et al. January 20, 2 | 2015-01-20 |
Wafer Level Transfer Molding And Apparatus For Performing The Same
App 20140291881 - Jang; Bor-Ping ; et al. | 2014-10-02 |
Methods for Forming Apparatus for Stud Bump Formation
App 20140061153 - Lin; Yeong-Jyh ; et al. | 2014-03-06 |
Method of Forming Interconnects for Three Dimensional Integrated Circuit
App 20130313121 - Yu; Chun Hui ; et al. | 2013-11-28 |
Methods for stud bump formation and apparatus for performing the same
Grant 8,540,136 - Lin , et al. September 24, 2 | 2013-09-24 |
Wafer-Level Underfill and Over-Molding
App 20130228951 - Jang; Bor-Ping ; et al. | 2013-09-05 |
Methods for Stud Bump Formation and Apparatus for Performing the Same
App 20130167373 - Hwang; Chien Ling ; et al. | 2013-07-04 |
Zigzag-stacked package structure
Grant 7,781,878 - Chen , et al. August 24, 2 | 2010-08-24 |
COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
Grant 7,642,639 - Huang , et al. January 5, 2 | 2010-01-05 |
High frequency IC package and method for fabricating the same
Grant 7,554,197 - Huang , et al. June 30, 2 | 2009-06-30 |
Zigzag-stacked package structure
App 20080174000 - CHEN; Yu-Ren ; et al. | 2008-07-24 |
Fabrication processes of a MEMS alloy probe
App 20080124828 - Huang; Hsiang-Ming ; et al. | 2008-05-29 |
COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
App 20070262439 - Huang; Hsiang-Ming ; et al. | 2007-11-15 |
High frequency IC package and method for fabricating the same
App 20070235871 - Huang; Hsiang-Ming ; et al. | 2007-10-11 |
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