Lin; Yan-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Yan-Fu.The latest application filed is for "fan-out package having a main die and a dummy die".

Company Profile

5.10.8

Lin; Yan-Fu - Zhubei City TW
Lin; Yan-Fu - Zhubei TW
Lin; Yan-Fu - Hsinchu County TW
- Zhubei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fan-Out Package Having a Main Die and a Dummy Die App 20210375775 - Lin; Yan-Fu ; et al.	2021-12-02
Fan-out package having a main die and a dummy die Grant 11,094,641 - Lin , et al. August 17, 2	2021-08-17
Fan-Out Package Having a Main Die and a Dummy Die, and Method of Forming App 20200111749 - Lin; Yan-Fu ; et al.	2020-04-09
Fan-out package having a main die and a dummy die, and method of forming Grant 10,510,674 - Lin , et al. Dec	2019-12-17
Fan-Out Package Having a Main Die and a Dummy Die, and Method of Forming App 20190148305 - Lin; Yan-Fu ; et al.	2019-05-16
Fan-out package having a main die and a dummy die, and method of forming Grant 10,163,802 - Lin , et al. Dec	2018-12-25
Fan-Out Package Having a Dummy Die and Method of Forming App 20180151502 - Lin; Yan-Fu ; et al.	2018-05-31
Testing, manufacturing, and packaging methods for semiconductor devices Grant 9,852,957 - Huang , et al. December 26, 2	2017-12-26
Testing, Manufacturing, and Packaging Methods for Semiconductor Devices App 20170345726 - Huang; Li-Hsien ; et al.	2017-11-30
Integrated fan-out package, semiconductor device, and method of fabricating the same Grant 9,812,426 - Wang , et al. November 7, 2	2017-11-07
Copper bump structures having sidewall protection layers Grant 9,093,314 - Lin , et al. July 28, 2	2015-07-28
Copper Bump Structures Having Sidewall Protection Layers App 20150111342 - Lin; Jing-Cheng ; et al.	2015-04-23
Copper bump structures having sidewall protection layers Grant 08922004 -	2014-12-30
Copper bump structures having sidewall protection layers Grant 8,922,004 - Lin , et al. December 30, 2	2014-12-30
Semiconductor device cover mark Grant 8,629,568 - Lin , et al. January 14, 2	2014-01-14
Semiconductor Device Cover Mark App 20120025368 - Lin; Yan-Fu ; et al.	2012-02-02
Copper Bump Structures Having Sidewall Protection Layers App 20110304042 - Lin; Jing-Cheng ; et al.	2011-12-15

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