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Patent applications and USPTO patent grants for Lin; Ya-Mei.The latest application filed is for "copper foil structure having blackened ultra-thin foil and manufacturing method thereof".
Patent | Date |
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Copper foil structure having blackened ultra-thin foil and manufacturing method thereof Grant 9,258,900 - Tzou , et al. February 9, 2 | 2016-02-09 |
Copper foil structure having blackened ultra-thin foil and manufacturing method thereof Grant 9,078,353 - Tzou , et al. July 7, 2 | 2015-07-07 |
Copper Foil Structure Having Blackened Ultra-thin Foil And Manufacturing Method Thereof App 20150068912 - TZOU; MING-JEN ;   et al. | 2015-03-12 |
Copper Foil Structure Having Blackened Ultra-thin Foil And Manufacturing Method Thereof App 20140141274 - TZOU; MING-JEN ;   et al. | 2014-05-22 |
Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method Grant 8,329,315 - Tzou , et al. December 11, 2 | 2012-12-11 |
Ultra Thin Copper Foil With Very Low Profile Copper Foil As Carrier And Its Manufacturing Method App 20120196144 - Tzou; Ming Jen ;   et al. | 2012-08-02 |
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