LIN; Wen Yi
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIN; Wen Yi.The latest application filed is for "metal backplate and foldable display using the same".
Company Profile
5.52.43
- LIN; Wen Yi - HSINCHU COUNTY TW
- LIN; Wen-Yi - New Taipei City TW
- Lin; Wen-Yi - New Taipei TW
- Lin; Wen-Yi - Tainan TW
- LIN; WEN-YI - Taoyuan TW
- Lin; Wen-Yi - Taichung TW
- LIN; Wen-Yi - Tainan City TW
- Lin; Wen-Yi - Taipei TW
- Lin; Wen-Yi - Wugu Township N/A TW
- LIN; Wen-Yi - Taipei City TW
- Lin; Wen Yi - Changhua TW
- Lin; Wen-Yi - Taichung City TW
- Lin; Wen-Yi - Tao Yuan Hsien TW
- Lin; Wen-Yi - Changhua City TW
- Lin; Wen-Yi - Hsinan Chuang Fushan Li TW
- Lin; Wen-Yi - Yuan Hsien TW
- Lin; Wen-Yi - Ellington CT
- Lin, Wen-Yi - Chu Tung Town TW
- Lin; Wen-Yi - Doraville GA
Patent Activity
| Patent | Date |
|---|---|
| Metal Backplate And Foldable Display Using The Same App 20220300039 - TAO; Ching Wen ; et al. | 2022-09-22 |
| Method For Forming Semiconductor Package App 20210272869 - WANG; Chin-Hua ; et al. | 2021-09-02 |
| Semiconductor package and method for forming the same Grant 11,011,447 - Wang , et al. May 18, 2 | 2021-05-18 |
| Method for forming package structure Grant 10,790,164 - Lin , et al. September 29, 2 | 2020-09-29 |
| Semiconductor Package And Method For Forming The Same App 20200058571 - WANG; Chin-Hua ; et al. | 2020-02-20 |
| Standard cell circuitries Grant 10,361,190 - Dia , et al. | 2019-07-23 |
| Voltage generating circuit and ESD protecting method Grant 10,305,480 - Lin | 2019-05-28 |
| Wafer warpage inspection system and method using the same Grant 10,269,602 - Lin , et al. | 2019-04-23 |
| Protective Film And Method For Making The Same App 20190055435 - LIN; WEN-YI | 2019-02-21 |
| Display Grant D834,575 - Su , et al. Nov | 2018-11-27 |
| Flip-flop circuit and scan chain using the same Grant 10,126,363 - Lin , et al. November 13, 2 | 2018-11-13 |
| Display Grant D832,839 - Su , et al. November 6, 2 | 2018-11-06 |
| Flip-flop Circuit And Scan Chain Using The Same App 20180224505 - LIN; Wen-Yi ; et al. | 2018-08-09 |
| Ring structure for chip packaging Grant 9,887,144 - Lin , et al. February 6, 2 | 2018-02-06 |
| Integrated fan-out package on package structure and methods of forming same Grant 9,881,908 - Lin , et al. January 30, 2 | 2018-01-30 |
| Semiconductor package assembly, semiconductor package and forming method thereof Grant 9,748,156 - Yeh , et al. August 29, 2 | 2017-08-29 |
| Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate Grant 9,721,868 - Lin , et al. August 1, 2 | 2017-08-01 |
| Integrated Fan-Out Package on Package Structure and Methods of Forming Same App 20170207204 - Lin; Wen-Yi ; et al. | 2017-07-20 |
| Voltage Generating Circuit And Esd Protecting Method App 20170170830 - Lin; Wen-Yi | 2017-06-15 |
| Package on packaging structure and methods of making same Grant 9,583,474 - Lin , et al. February 28, 2 | 2017-02-28 |
| Standard Cell Circuitries App 20170018572 - DIA; Kin-Hooi ; et al. | 2017-01-19 |
| Electrical connection for chip scale packaging Grant 9,548,281 - Yew , et al. January 17, 2 | 2017-01-17 |
| 3D packages and methods for forming the same Grant 9,543,284 - Yew , et al. January 10, 2 | 2017-01-10 |
| Method of forming encapsulated semiconductor device package Grant 9,502,323 - Lin , et al. November 22, 2 | 2016-11-22 |
| 3D Packages and Methods for Forming the Same App 20160111409 - Yew; Ming-Chih ; et al. | 2016-04-21 |
| 3D packages and methods for forming the same Grant 9,252,076 - Yew , et al. February 2, 2 | 2016-02-02 |
| Package on Packaging Structure and Methods of Making Same App 20150200190 - Lin; Wen-Yi ; et al. | 2015-07-16 |
| Thermally Enhanced Heat Spreader App 20150179617 - LIN; Po-Yao ; et al. | 2015-06-25 |
| Semiconductor Device Package and Method App 20150123257 - Lin; Wen-Yi ; et al. | 2015-05-07 |
| Lid design for reliability enhancement in flip chip package Grant 8,976,529 - Lin , et al. March 10, 2 | 2015-03-10 |
| Thermally enhanced heat spreader for flip chip packaging Grant 8,970,029 - Lin , et al. March 3, 2 | 2015-03-03 |
| 3D Packages and Methods for Forming the Same App 20150041987 - Yew; Ming-Chih ; et al. | 2015-02-12 |
| Package on packaging structure and methods of making same Grant 8,946,888 - Lin , et al. February 3, 2 | 2015-02-03 |
| Semiconductor device package and method Grant 8,941,248 - Lin , et al. January 27, 2 | 2015-01-27 |
| Semiconductor device package and method Grant 8,901,732 - Yew , et al. December 2, 2 | 2014-12-02 |
| Packaging structures and methods for semiconductor devices Grant 8,847,369 - Yew , et al. September 30, 2 | 2014-09-30 |
| Semiconductor Device Package and Method App 20140264813 - Lin; Wen-Yi ; et al. | 2014-09-18 |
| Semiconductor Device Package and Method App 20140264815 - Yew; Ming-Chih ; et al. | 2014-09-18 |
| Compliant heat spreader for flip chip packaging having thermally-conductive element with different metal material areas Grant 8,779,582 - Lin , et al. July 15, 2 | 2014-07-15 |
| Packaging Structures and Methods for Semiconductor Devices App 20140021594 - Yew; Ming-Chih ; et al. | 2014-01-23 |
| Board-level package with tuned mass damping structure Grant 8,462,510 - Lin , et al. June 11, 2 | 2013-06-11 |
| Semiconductor Device Having Lid Structure And Method Of Making Same App 20130119529 - LIN; Wen-Yi ; et al. | 2013-05-16 |
| Electrical Connection for Chip Scale Packaging App 20130087892 - Yew; Ming-Chih ; et al. | 2013-04-11 |
| Package on Packaging Structure and Methods of Making Same App 20130082372 - Lin; Wen-Yi ; et al. | 2013-04-04 |
| Active device array substrate and method for fabricating the same Grant 8,399,891 - Lai , et al. March 19, 2 | 2013-03-19 |
| Ring Structure For Chip Packaging App 20130062752 - LIN; Wen-Yi ; et al. | 2013-03-14 |
| Board-Level Package With Tuned Mass Damping Structure App 20120287579 - Lin; Wen-Yi ; et al. | 2012-11-15 |
| Compressive ring structure for flip chip packaging Grant 8,283,777 - Lin , et al. October 9, 2 | 2012-10-09 |
| Lid Design for Reliability Enhancement in Flip Chip Package App 20120182694 - Lin; Wen-Yi ; et al. | 2012-07-19 |
| Compliant Heat Spreader For Flip Chip Packaging App 20120098118 - LIN; Wen-Yi ; et al. | 2012-04-26 |
| Check valve Grant 8,146,617 - Lin April 3, 2 | 2012-04-03 |
| Active Device Array Substrate And Method For Fabricating The Same App 20120043558 - Lai; Po-Lin ; et al. | 2012-02-23 |
| Compressive Ring Structure For Flip Chip Packaging App 20110215463 - LIN; Po-Yao ; et al. | 2011-09-08 |
| Optical device and method for making the same Grant 7,956,964 - Yu , et al. June 7, 2 | 2011-06-07 |
| Thermally Enhanced Heat Spreader For Flip Chip Packaging App 20110024892 - LIN; Po-Yao ; et al. | 2011-02-03 |
| Check Valve App 20110005618 - Lin; Wen-Yi | 2011-01-13 |
| Showerhead Grant 7,766,260 - Lin August 3, 2 | 2010-08-03 |
| Showerhead App 20090200400 - Lin; Wen-Yi | 2009-08-13 |
| Optical Device and Method for Making the Same App 20090190086 - Yu; Tsai-An ; et al. | 2009-07-30 |
| Optical device and method for making the same Grant 7,532,284 - Yu , et al. May 12, 2 | 2009-05-12 |
| Anti-Glare Device and Method for Making the Same App 20070285788 - Yeh; Cheng-Hsin ; et al. | 2007-12-13 |
| Optical compensator for a liquid crystal display Grant 7,301,594 - Yu , et al. November 27, 2 | 2007-11-27 |
| Epitaxial thin films App 20070178227 - Hunt; Andrew Tye ; et al. | 2007-08-02 |
| Epitaxial thin films Grant 7,033,637 - Hunt , et al. April 25, 2 | 2006-04-25 |
| Optical device and method for making the same App 20060068517 - Yu; Tsai-An ; et al. | 2006-03-30 |
| Optical compensator for a liquid crystal display App 20060055854 - Yu; Tsai-An ; et al. | 2006-03-16 |
| Epitaxial thin films App 20050019594 - Hunt, Andrew Tye ; et al. | 2005-01-27 |
| Resistive material App 20040257193 - Allen, Craig S. ; et al. | 2004-12-23 |
| Formation of thin film capacitors Grant 6,728,092 - Hunt , et al. April 27, 2 | 2004-04-27 |
| Nanolaminated thin film circuitry materials Grant 6,632,591 - Hunt , et al. October 14, 2 | 2003-10-14 |
| Resistors App 20030016117 - Senk, David D. ; et al. | 2003-01-23 |
| Formation of thin film resistors Grant 6,500,350 - Hunt , et al. December 31, 2 | 2002-12-31 |
| Formation of thin film capacitors App 20020145845 - Hunt, Andrew T. ; et al. | 2002-10-10 |
| Formation of thin film capacitors Grant 6,433,993 - Hunt , et al. August 13, 2 | 2002-08-13 |
| Resistors for electronic packaging Grant 6,396,387 - Hunt , et al. May 28, 2 | 2002-05-28 |
| Formation of thin film resistors Grant 6,329,899 - Hunt , et al. December 11, 2 | 2001-12-11 |
| Nanolaminated thin film circuitry materials App 20010012600 - Hunt, Andrew T. ; et al. | 2001-08-09 |
| Nanolaminated thin film circuitry materials Grant 6,212,078 - Hunt , et al. April 3, 2 | 2001-04-03 |
| Formation of thin film capacitors Grant 6,207,522 - Hunt , et al. March 27, 2 | 2001-03-27 |
| Precursor solution compositions for electronic devices using CCVD Grant 6,193,911 - Hunt , et al. February 27, 2 | 2001-02-27 |
| Supporting device for toilet tissue Grant 5,215,274 - Lin June 1, 1 | 1993-06-01 |
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