Lin; Wen-Ti

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Wen-Ti.The latest application filed is for "inspection machine, inspecting method and inspecting system".

Company Profile

0.7.5

Lin; Wen-Ti - Hsinchu TW
Lin; Wen Ti - Taichung TW
Lin; Wen Ti - Taichung City TW
Lin, Wen-Ti - Hsinchu city TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inspection machine, inspecting method and inspecting system Grant 8,421,858 - Hsieh , et al. April 16, 2	2013-04-16
Inspection Machine, Inspecting Method And Inspecting System App 20120140059 - Hsieh; Hsiao-Liang ; et al.	2012-06-07
Fault detection system and method for managing the same Grant 7,595,467 - Yang , et al. September 29, 2	2009-09-29
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive Grant 7,300,865 - Hsieh , et al. November 27, 2	2007-11-27
Fault detection system and method for managing the same App 20070126568 - Yang; Cheng Jer ; et al.	2007-06-07
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive App 20050250303 - Hsieh, Yu-Te ; et al.	2005-11-10
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed Grant 6,919,642 - Hsieh , et al. July 19, 2	2005-07-19
Vertical nanotube transistor and process for fabricating the same Grant 6,830,981 - Lee , et al. December 14, 2	2004-12-14
Vertical nanotube transistor and process for fabricating the same App 20040004235 - Lee, Chun-Tao ; et al.	2004-01-08
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed App 20040004292 - Hsieh, Yu-Te ; et al.	2004-01-08
Method for bonding IC chips to substrates with non-conductive adhesive Grant 6,605,491 - Hsieh , et al. August 12, 2	2003-08-12

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.