Lin; Wei-Ti
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Wei-Ti.The latest application filed is for "package carrier and manufacturing method thereof".
- Lin; Wei-Ti - Hsinchu County TW
- Lin; Wei-Ti - Hsinchu TW
- LIN; Wei-Ti - Taoyuan TW
| Patent | Date |
|---|---|
| Method of manufacturing chip packaging structure Grant 11,348,869 - Chen , et al. May 31, 2 | 2022-05-31 |
| Package Carrier And Manufacturing Method Thereof App 20220022316 - Chen; Po-Wei ; et al. | 2022-01-20 |
| Manufacturing Method Of Package Carrier App 20210398894 - Lin; Wei-Ti ; et al. | 2021-12-23 |
| Package carrier and manufacturing method thereof Grant 11,139,234 - Lin , et al. October 5, 2 | 2021-10-05 |
| Manufacturing Method Of Circuit Carrier Board App 20210282277 - Lin; Wei-Ti ; et al. | 2021-09-09 |
| Manufacturing Method Of Circuit Carrier Board App 20210219435 - Chien; Chun-Hsien ; et al. | 2021-07-15 |
| Package structure and preparation method thereof Grant 11,037,869 - Chen , et al. June 15, 2 | 2021-06-15 |
| Circuit carrier board and manufacturing method thereof Grant 11,032,917 - Lin , et al. June 8, 2 | 2021-06-08 |
| Circuit carrier board and manufacturing method thereof Grant 10,999,939 - Chien , et al. May 4, 2 | 2021-05-04 |
| Manufacturing method of substrate structure Grant 10,950,687 - Chen , et al. March 16, 2 | 2021-03-16 |
| Method Of Manufacturing Chip Packaging Structure App 20210074633 - CHEN; Chien-Chou ; et al. | 2021-03-11 |
| Manufacturing Method Of Circuit Carrier Board Structure App 20210076508 - Lin; Wei-Ti ; et al. | 2021-03-11 |
| Package Structure And Preparation Method Thereof App 20210057320 - Chen; Fu-Yang ; et al. | 2021-02-25 |
| Circuit carrier board structure and manufacturing method thereof Grant 10,888,001 - Lin , et al. January 5, 2 | 2021-01-05 |
| Manufacturing method of light-emitting diode package structure Grant 10,886,264 - Lin , et al. January 5, 2 | 2021-01-05 |
| Chip packaging structure and manufacturing method thereof Grant 10,879,167 - Chen , et al. December 29, 2 | 2020-12-29 |
| Manufacturing Method Of Substrate Structure App 20200273948 - Chen; Yu-Hua ; et al. | 2020-08-27 |
| Manufacturing Method Of Light-emitting Diode Package Structure App 20200266181 - Lin; Wei-Ti ; et al. | 2020-08-20 |
| Substrate structure and manufacturing method thereof Grant 10,700,161 - Chen , et al. | 2020-06-30 |
| Light-emitting diode package structure and manufacturing method thereof Grant 10,700,049 - Lin , et al. | 2020-06-30 |
| Chip Packaging Structure And Manufacturing Method Thereof App 20200144179 - CHEN; Chien-Chou ; et al. | 2020-05-07 |
| Substrate Structure And Manufacturing Method Thereof App 20200075711 - Chen; Yu-Hua ; et al. | 2020-03-05 |
| Light-emitting Diode Package Structure And Manufacturing Method Thereof App 20200075564 - Lin; Wei-Ti ; et al. | 2020-03-05 |
| Circuit Carrier Board And Manufacturing Method Thereof App 20190380211 - Lin; Wei-Ti ; et al. | 2019-12-12 |
| Circuit Carrier Board And Manufacturing Method Thereof App 20190380212 - Chien; Chun-Hsien ; et al. | 2019-12-12 |
| Circuit Carrier Board Structure And Manufacturing Method Thereof App 20190380210 - Lin; Wei-Ti ; et al. | 2019-12-12 |
| Circuit board structure and manufacturing method thereof Grant 10,123,418 - Lin , et al. November 6, 2 | 2018-11-06 |
| Circuit Board Element App 20180014404 - HSIEH; Yu-Chung ; et al. | 2018-01-11 |
| Circuit board element Grant 9,860,980 - Hsieh , et al. January 2, 2 | 2018-01-02 |
| Circuit board and method of manufacturing the same Grant 9,854,671 - Lin , et al. December 26, 2 | 2017-12-26 |
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