Lin; Wei Hung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Wei Hung.The latest application filed is for "keyboards with haptic outputs".
Company Profile
49.142.155
- Lin; Wei Hung - Taipei City TW
- LIN; Wei-Hung - Xinfeng Township TW
- LIN; WEI-HUNG - HSINCHU COUNTY TW
- LIN; WEI-HUNG - New Taipei City TW
- Lin; Wei-Hung - New Taipei TW
- Lin; Wei-Hung - Hsinchu TW
- Lin; Wei-Hung - Hsin-Chu TW
- Lin; Wei-Hung - Xinfeng N/A TW
- - Xinfeng Township TW
- Lin; Wei-Hung - Jhubei TW
- Lin; Wei-Hung - Miaoli County TW
- Lin; Wei-Hung - Gueishan Township Taoyuan County TW
- Lin; Wei-Hung - Taoyuan County TW
Patent Activity
| Patent | Date |
|---|---|
| Keyboards With Haptic Outputs App 20220283641 - Chen; Hung-Ming ; et al. | 2022-09-08 |
| Apparatus And Method For Forming A Package Structure App 20220278071 - ZHAN; Kai Jun ; et al. | 2022-09-01 |
| Packages with Multiple Encapsulated Substrate Blocks App 20220262694 - Chen; Chen-Shien ; et al. | 2022-08-18 |
| Method Of Manufacturing Semiconductor Structure App 20220246435 - HU; YU-HSIANG ; et al. | 2022-08-04 |
| Method of manufacturing semiconductor structure Grant 11,322,360 - Hu , et al. May 3, 2 | 2022-05-03 |
| Package on package structure and method for forming the same Grant 11,264,342 - Yu , et al. March 1, 2 | 2022-03-01 |
| Package structures and methods for forming the same Grant 11,211,261 - Meng , et al. December 28, 2 | 2021-12-28 |
| Wafer etching process and methods thereof Grant 11,177,137 - Lu , et al. November 16, 2 | 2021-11-16 |
| Semiconductor device structure with protected bump and method of forming the same Grant 11,171,100 - Huang , et al. November 9, 2 | 2021-11-09 |
| Semiconductor packaging structure and method Grant 11,158,605 - Lin , et al. October 26, 2 | 2021-10-26 |
| Package-on-package structure having polymer-based material for warpage control Grant 11,133,285 - Chen , et al. September 28, 2 | 2021-09-28 |
| Substrate and Package Structure App 20210288012 - Lin; Wei-Hung ; et al. | 2021-09-16 |
| Multi-Layer Structures and Methods of Forming App 20210265165 - Hsueh; Chang-Jung ; et al. | 2021-08-26 |
| Package-on-package structures and methods for forming the same Grant 11,101,261 - Huang , et al. August 24, 2 | 2021-08-24 |
| Semiconductor structure and method for forming the same Grant 11,094,655 - Lu , et al. August 17, 2 | 2021-08-17 |
| Wafer Etching Process And Methods Thereof App 20210225658 - Lu; Wen-Hsiung ; et al. | 2021-07-22 |
| Semiconductor Package Structure App 20210217728 - HUNG; JENG-NAN ; et al. | 2021-07-15 |
| Semiconductor package, semiconductor device and method of forming the same Grant 11,056,474 - Yu , et al. July 6, 2 | 2021-07-06 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20210202335 - Yu; Chen-Hua ; et al. | 2021-07-01 |
| Luminous Safety Ball App 20210197032 - LIN; WEI-HUNG | 2021-07-01 |
| Substrate and package structure Grant 11,024,594 - Lin , et al. June 1, 2 | 2021-06-01 |
| Semiconductor Device Structure With Protected Bump And Method Of Forming The Same App 20210159197 - HUANG; Hui-Min ; et al. | 2021-05-27 |
| Multi-layer structures and methods of forming Grant 11,004,685 - Hsueh , et al. May 11, 2 | 2021-05-11 |
| Semiconductor package structure Grant 10,971,475 - Hung , et al. April 6, 2 | 2021-04-06 |
| Package Structure And Method For Manufacturing The Same App 20210098384 - TSAI; Yi-Da ; et al. | 2021-04-01 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 10,950,514 - Yu , et al. March 16, 2 | 2021-03-16 |
| Advanced INFO POP and Method of Forming Thereof App 20210020611 - Tsai; Yi-Da ; et al. | 2021-01-21 |
| Semiconductor Structure And Method For Forming The Same App 20200395323 - LU; Wen-Hsiung ; et al. | 2020-12-17 |
| Method for manufacturing package structure Grant 10,867,932 - Tsai , et al. December 15, 2 | 2020-12-15 |
| Luminous ball with remote activation capability Grant 10,857,428 - Lin December 8, 2 | 2020-12-08 |
| Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates Grant 10,832,999 - Huang , et al. November 10, 2 | 2020-11-10 |
| Advanced INFO POP and method of forming thereof Grant 10,797,025 - Tsai , et al. October 6, 2 | 2020-10-06 |
| Method Of Manufacturing Semiconductor Structure App 20200303200 - HU; YU-HSIANG ; et al. | 2020-09-24 |
| Semiconductor processing boat design with pressure sensor Grant 10,734,263 - Ang , et al. | 2020-08-04 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20200227331 - Yu; Chen-Hua ; et al. | 2020-07-16 |
| Method of manufacturing wafer level chip scale package Grant 10,707,084 - Hu , et al. | 2020-07-07 |
| Multi-layer Structures And Methods Of Forming App 20200176254 - Hsueh; Chang-Jung ; et al. | 2020-06-04 |
| Package On Package Structure And Method For Forming The Same App 20200152587 - Yu; Chen-Hua ; et al. | 2020-05-14 |
| Method For Manufacturing Package Structure App 20200152576 - TSAI; Yi-Da ; et al. | 2020-05-14 |
| Packaging Methods for Semiconductor Devices App 20200144171 - Huang; Kuei-Wei ; et al. | 2020-05-07 |
| Luminous Ball With Remote Activation Capability App 20200139203 - Lin; Wei-Hung | 2020-05-07 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 10,629,508 - Yu , et al. | 2020-04-21 |
| Bump-on-trace packaging structure and method for forming the same Grant 10,600,709 - Chen , et al. | 2020-03-24 |
| Package on package structure and method for forming the same Grant 10,559,546 - Yu , et al. Feb | 2020-02-11 |
| Semiconductor Bonding Structures and Methods App 20200035510 - Chen; Meng-Tse ; et al. | 2020-01-30 |
| Semiconductor Processing Boat Design With Pressure Sensor App 20200035529 - Ang; Ai-Tee ; et al. | 2020-01-30 |
| Package structure and method for forming the same Grant 10,535,609 - Tsai , et al. Ja | 2020-01-14 |
| Warpage control in package-on-package structures Grant 10,535,616 - Chen , et al. Ja | 2020-01-14 |
| Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates Grant 10,522,452 - Huang , et al. Dec | 2019-12-31 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 10,510,716 - Yu , et al. Dec | 2019-12-17 |
| Molding structure for wafer level package Grant 10,510,630 - Yu , et al. Dec | 2019-12-17 |
| Semiconductor Package Structure App 20190363066 - HUNG; JENG-NAN ; et al. | 2019-11-28 |
| Package-on-Package Structures and Methods for Forming the Same App 20190355710 - Huang; Kuei-Wei ; et al. | 2019-11-21 |
| Semiconductor processing boat design with pressure sensor Grant 10,475,679 - Ang , et al. Nov | 2019-11-12 |
| Molding Structure for Wafer Level Package App 20190259678 - Yu; Chen-Hua ; et al. | 2019-08-22 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20190252280 - Yu; Chen-Hua ; et al. | 2019-08-15 |
| Semiconductor package structure and method of manufacturing the same Grant 10,373,931 - Hung , et al. | 2019-08-06 |
| Package-on-package structures and methods for forming the same Grant 10,373,941 - Huang , et al. | 2019-08-06 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20190221544 - Chen; Meng-Tse ; et al. | 2019-07-18 |
| Molding structure for wafer level package Grant 10,283,427 - Yu , et al. | 2019-05-07 |
| Package On Package Structure And Method For Forming The Same App 20190131261 - Yu; Chen-Hua ; et al. | 2019-05-02 |
| Warpage Control in Package-on-Package Structures App 20190131254 - Chen; Wei-Yu ; et al. | 2019-05-02 |
| Package-on-package structure having polymer-based material for warpage control Grant 10,269,763 - Chen , et al. | 2019-04-23 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 10,269,673 - Yu , et al. | 2019-04-23 |
| Substrate and Package Structure App 20190096839 - Lin; Wei-Hung ; et al. | 2019-03-28 |
| Semiconductor Package, Semiconductor Device and Method of Forming the Same App 20190088635 - Yu; Chen-Hua ; et al. | 2019-03-21 |
| Bump-on-trace packaging structure and method for forming the same Grant 10,192,804 - Chen , et al. Ja | 2019-01-29 |
| Package on package structure and method for forming the same Grant 10,177,104 - Yu , et al. J | 2019-01-08 |
| Warpage control in package-on-package structures Grant 10,170,434 - Chen , et al. J | 2019-01-01 |
| Luminous ball Grant 10,159,874 - Lin Dec | 2018-12-25 |
| Molding structure for wafer level package Grant 10,163,804 - Yu , et al. Dec | 2018-12-25 |
| Semiconductor bonding structures and methods Grant 10,153,180 - Chen , et al. Dec | 2018-12-11 |
| Package Structures and Methods for Forming the Same App 20180342404 - Meng; Hsien-Liang ; et al. | 2018-11-29 |
| Substrate and package structure Grant 10,141,281 - Lin , et al. Nov | 2018-11-27 |
| Bump-on-trace Packaging Structure And Method For Forming The Same App 20180337106 - Chen; Meng-Tse ; et al. | 2018-11-22 |
| Semiconductor package, semiconductor device and method of forming the same Grant 10,134,717 - Yu , et al. November 20, 2 | 2018-11-20 |
| Package on-package process for applying molding compound Grant 10,134,703 - Chen , et al. November 20, 2 | 2018-11-20 |
| Semiconductor Bonding Structures and Methods App 20180330970 - Chen; Meng-Tse ; et al. | 2018-11-15 |
| Package Structure And Method For Forming The Same App 20180308800 - TSAI; Yi-Da ; et al. | 2018-10-25 |
| Package structures and methods for forming the same Grant 10,049,894 - Meng , et al. August 14, 2 | 2018-08-14 |
| Warpage Control in Package-on-Package Structures App 20180226363 - Chen; Wei-Yu ; et al. | 2018-08-09 |
| Package-on-Package Structures and Methods for Forming the Same App 20180197847 - Huang; Kuei-Wei ; et al. | 2018-07-12 |
| Molding Structure for Wafer Level Package App 20180190555 - Yu; Chen-Hua ; et al. | 2018-07-05 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20180190559 - Yu; Chen-Hua ; et al. | 2018-07-05 |
| Package structure and method for forming the same Grant 10,014,260 - Tsai , et al. July 3, 2 | 2018-07-03 |
| Semiconductor Processing Boat Design With Pressure Sensor App 20180166308 - Ang; Ai-Tee ; et al. | 2018-06-14 |
| Molding Structure For Wafer Level Package App 20180158780 - Yu; Chen-Hua ; et al. | 2018-06-07 |
| Semiconductor Package Structure And Method Of Manufacturing The Same App 20180151538 - HUNG; JENG-NAN ; et al. | 2018-05-31 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20180138147 - Yu; Chen-Hua ; et al. | 2018-05-17 |
| Package Structure And Method For Forming The Same App 20180130749 - TSAI; Yi-Da ; et al. | 2018-05-10 |
| Warpage control in package-on-package structures Grant 9,941,221 - Chen , et al. April 10, 2 | 2018-04-10 |
| Package-on-package structures and methods for forming the same Grant 9,935,091 - Huang , et al. April 3, 2 | 2018-04-03 |
| Method Of Manufacturing Wafer Level Chip Scale Package App 20180090331 - Hu; Yu-Hsiang ; et al. | 2018-03-29 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 9,911,675 - Yu , et al. March 6, 2 | 2018-03-06 |
| Molding structure for wafer level package Grant 9,911,674 - Yu , et al. March 6, 2 | 2018-03-06 |
| Semiconductor processing boat design with pressure sensor Grant 9,911,633 - Ang , et al. March 6, 2 | 2018-03-06 |
| Semiconductor Packaging Structure and Method App 20180047708 - Lin; Chun-Cheng ; et al. | 2018-02-15 |
| Molding structure for wafer level package Grant 9,887,162 - Yu , et al. February 6, 2 | 2018-02-06 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 9,871,018 - Yu , et al. January 16, 2 | 2018-01-16 |
| Alignment in the packaging of integrated circuits Grant 9,865,574 - Huang , et al. January 9, 2 | 2018-01-09 |
| Package structure and method for forming the same Grant 9,859,229 - Tsai , et al. January 2, 2 | 2018-01-02 |
| Wafer level chip scale package and method of manufacturing the same Grant 9,837,278 - Hu , et al. December 5, 2 | 2017-12-05 |
| Advanced INFO POP and Method of Forming Thereof App 20170338202 - Tsai; Yi-Da ; et al. | 2017-11-23 |
| Luminous ball Grant 9,821,196 - Lin November 21, 2 | 2017-11-21 |
| Package Structure And Method For Forming The Same App 20170317038 - TSAI; Yu-Peng ; et al. | 2017-11-02 |
| Semiconductor packaging structure and method Grant 9,799,631 - Lin , et al. October 24, 2 | 2017-10-24 |
| Package On Package Structure And Method For Forming The Same App 20170287865 - Yu; Chen-Hua ; et al. | 2017-10-05 |
| Light releasing sphere structure Grant 9,776,048 - Lin October 3, 2 | 2017-10-03 |
| Solder joint structure for ball grid array in wafer level package Grant 9,761,551 - Hu , et al. September 12, 2 | 2017-09-12 |
| Package on package structure and method for forming the same Grant 9,711,470 - Yu , et al. July 18, 2 | 2017-07-18 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20170194289 - Chen; Meng-Tse ; et al. | 2017-07-06 |
| Semiconductor Packaging Structure and Method App 20170179083 - Lin; Chun-Cheng ; et al. | 2017-06-22 |
| Package on package bonding structure and method for forming the same Grant 9,673,182 - Huang , et al. June 6, 2 | 2017-06-06 |
| Package-on-package structure having polymer-based material for warpage control Grant 9,627,355 - Chen , et al. April 18, 2 | 2017-04-18 |
| Flash drive Grant 9,612,630 - Lin April 4, 2 | 2017-04-04 |
| Semiconductor Package, Semiconductor Device and Method of Forming the Same App 20170092634 - YU; CHEN-HUA ; et al. | 2017-03-30 |
| Warpage Control in Package-on-Package Structures App 20170084549 - Chen; Wei-Yu ; et al. | 2017-03-23 |
| Luminous Ball App 20170065856 - Lin; Wei-Hung | 2017-03-09 |
| Semiconductor packaging structure and method Grant 9,583,464 - Lin , et al. February 28, 2 | 2017-02-28 |
| Electrical connector Grant D779,438 - Chung , et al. February 21, 2 | 2017-02-21 |
| Methods of packaging and dicing semiconductor devices and structures thereof Grant 9,559,005 - Tsai , et al. January 31, 2 | 2017-01-31 |
| Warpage control in package-on-package structures Grant 9,559,064 - Chen , et al. January 31, 2 | 2017-01-31 |
| Packaging process tools and systems, and packaging methods for semiconductor devices Grant 9,543,185 - Lin , et al. January 10, 2 | 2017-01-10 |
| Semiconductor package and method of forming the same Grant 9,536,818 - Lin , et al. January 3, 2 | 2017-01-03 |
| Semiconductor package, semiconductor device and method of forming the same Grant 9,530,762 - Yu , et al. December 27, 2 | 2016-12-27 |
| Storage device and producing method of the same Grant 9,526,186 - Lin , et al. December 20, 2 | 2016-12-20 |
| Sphere structure Grant 9,518,728 - Lin December 13, 2 | 2016-12-13 |
| Semiconductor Processing Boat Design with Pressure Sensor App 20160358797 - Ang; Ai-Tee ; et al. | 2016-12-08 |
| Substrate and Package Structure App 20160358878 - LIN; WEI-HUNG ; et al. | 2016-12-08 |
| Package-on-Package Structures and Methods for Forming the Same App 20160351554 - Huang; Kuei-Wei ; et al. | 2016-12-01 |
| Semiconductor Packaging Structure and Method App 20160343692 - Lin; Chun-Cheng ; et al. | 2016-11-24 |
| Molding Structure for Wafer Level Package App 20160336247 - Yu; Chen-Hua ; et al. | 2016-11-17 |
| Package on Package Bonding Structure and Method for Forming the Same App 20160322339 - Huang; Kuei-Wei ; et al. | 2016-11-03 |
| Flash Drive App 20160306398 - Lin; Wei-Hung | 2016-10-20 |
| Flash drive with transforming mechanism Grant 9,460,043 - Chung , et al. October 4, 2 | 2016-10-04 |
| Sphere Structure App 20160271458 - LIN; WEI-HUNG | 2016-09-22 |
| Solder joint structure for ball grid array in wafer level package Grant 9,449,934 - Hu , et al. September 20, 2 | 2016-09-20 |
| Package Structures and Methods for Forming the Same App 20160268145 - Meng; Hsien-Liang ; et al. | 2016-09-15 |
| Semiconductor processing boat design with pressure sensor Grant 9,427,818 - Ang , et al. August 30, 2 | 2016-08-30 |
| Semiconductor structure and manufacturing method thereof Grant 9,431,360 - Kuo , et al. August 30, 2 | 2016-08-30 |
| Alignment in the Packaging of Integrated Circuits App 20160247790 - Huang; Kuei-Wei ; et al. | 2016-08-25 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20160247782 - Chen; Meng-Tse ; et al. | 2016-08-25 |
| Substrate and package structure Grant 9,425,157 - Lin , et al. August 23, 2 | 2016-08-23 |
| Storage device Grant 9,425,569 - Lin August 23, 2 | 2016-08-23 |
| Molding structure for wafer level package Grant 9,401,337 - Yu , et al. July 26, 2 | 2016-07-26 |
| Package on package bonding structure and method for forming the same Grant 9,397,062 - Huang , et al. July 19, 2 | 2016-07-19 |
| Method of manufacturing a semiconductor device Grant 9,385,040 - Tsai , et al. July 5, 2 | 2016-07-05 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20160190096 - Yu; Chen-Hua ; et al. | 2016-06-30 |
| Solder Joint Structure for Ball Grid Array in Wafer Level Package App 20160181219 - Hu; Yu-Hsiang ; et al. | 2016-06-23 |
| Package structures and methods for forming the same Grant 9,362,236 - Meng , et al. June 7, 2 | 2016-06-07 |
| Package-on-package structure having polymer-based material for warpage control Grant 9,349,663 - Chen , et al. May 24, 2 | 2016-05-24 |
| Alignment in the packaging of integrated circuits Grant 9,343,386 - Huang , et al. May 17, 2 | 2016-05-17 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20160133538 - Yu; Chen-Hua ; et al. | 2016-05-12 |
| Device packaging Grant 9,331,023 - Liu , et al. May 3, 2 | 2016-05-03 |
| Package On Package Structure And Method For Forming The Same App 20160111385 - Yu; Chen-Hua ; et al. | 2016-04-21 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 9,299,688 - Yu , et al. March 29, 2 | 2016-03-29 |
| Connector and storage device using the same Grant 9,281,631 - Lin , et al. March 8, 2 | 2016-03-08 |
| Packaging methods and packaged semiconductor devices Grant 9,269,687 - Chen , et al. February 23, 2 | 2016-02-23 |
| Packaging methods and packaged semiconductor devices Grant 9,263,412 - Lin , et al. February 16, 2 | 2016-02-16 |
| Flash drive Grant 9,257,777 - Lin February 9, 2 | 2016-02-09 |
| Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20160035667 - Huang; Chih-Fan ; et al. | 2016-02-04 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 9,252,135 - Yu , et al. February 2, 2 | 2016-02-02 |
| Flash Drive App 20160013578 - Lin; Wei-Hung | 2016-01-14 |
| Package on package structures and methods for forming the same Grant 9,219,030 - Yu , et al. December 22, 2 | 2015-12-22 |
| Packaging process tools and packaging methods for semiconductor devices Grant 9,218,999 - Lu , et al. December 22, 2 | 2015-12-22 |
| Semiconductor Structure And Manufacturing Method Thereof App 20150348927 - KUO; HSUAN-TING ; et al. | 2015-12-03 |
| Flash drive and operating method thereof Grant 9,192,063 - Lin , et al. November 17, 2 | 2015-11-17 |
| Connector And Storage Device Using The Same App 20150280378 - Lin; Wei-Hung ; et al. | 2015-10-01 |
| Storage Device App 20150270668 - Lin; Wei-Hung | 2015-09-24 |
| Storage device Grant 9,136,661 - Lin September 15, 2 | 2015-09-15 |
| Connecting part of storage device Grant 9,122,421 - Chen , et al. September 1, 2 | 2015-09-01 |
| Storage Device App 20150244125 - Lin; Wei-Hung | 2015-08-27 |
| Wafer Level Chip Scale Package And Method Of Manufacturing The Same App 20150243573 - HU; YU-HSIANG ; et al. | 2015-08-27 |
| Substrate And Package Structure App 20150243620 - LIN; WEI-HUNG ; et al. | 2015-08-27 |
| Method Of Manufacturing A Semiconductor Device App 20150235902 - TSAI; TSAI-TSUNG ; et al. | 2015-08-20 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20150228632 - Yu; Chen-Hua ; et al. | 2015-08-13 |
| Methods of Packaging and Dicing Semiconductor Devices and Structures Thereof App 20150214077 - Tsai; Yu-Peng ; et al. | 2015-07-30 |
| Semiconductor Processing Boat Design With Pressure Sensor App 20150206779 - Ang; Ai-Tee ; et al. | 2015-07-23 |
| Semiconductor Package, Semiconductor Device And Method Of Forming The Same App 20150200188 - YU; CHEN-HUA ; et al. | 2015-07-16 |
| Packaging methods and structures for semiconductor devices Grant 9,082,636 - Lin , et al. July 14, 2 | 2015-07-14 |
| Methods for forming 3DIC package Grant 9,073,158 - Chen , et al. July 7, 2 | 2015-07-07 |
| Package on Package Bonding Structure and Method for Forming the Same App 20150187723 - Huang; Kuei-Wei ; et al. | 2015-07-02 |
| Molding Structure for Wafer Level Package App 20150171055 - Yu; Chen-Hua ; et al. | 2015-06-18 |
| Molding Structure for Wafer Level Package App 20150170937 - Yu; Chen-Hua ; et al. | 2015-06-18 |
| Contact structure Grant 9,059,148 - Chen , et al. June 16, 2 | 2015-06-16 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20150162316 - Yu; Chen-Hua ; et al. | 2015-06-11 |
| Sphere Structure App 20150159858 - LIN; WEI HUNG | 2015-06-11 |
| Solder Joint Structure for Ball Grid Array in Wafer Level Package App 20150155249 - Hu; Yu-Hsiang ; et al. | 2015-06-04 |
| Warpage Control in Package-on-Package Structures App 20150155243 - Chen; Wei-Yu ; et al. | 2015-06-04 |
| Flash Drive And Operating Method Thereof App 20150109725 - Lin; Wei-Hung ; et al. | 2015-04-23 |
| Semiconductor Bonding Structures and Methods App 20150091193 - Chen; Meng-Tse ; et al. | 2015-04-02 |
| Connecting Part Of Storage Device App 20150087167 - Chen; Chang-Chih ; et al. | 2015-03-26 |
| Storage interface module Grant 8,979,596 - Lin March 17, 2 | 2015-03-17 |
| Storage device and method for producing the same Grant 8,976,533 - Lin , et al. March 10, 2 | 2015-03-10 |
| Packaging Methods and Structures for Semiconductor Devices App 20150044819 - Lin; Chih-Wei ; et al. | 2015-02-12 |
| Package-on-Package Process for Applying Molding Compound App 20150008581 - Chen; Meng-Tse ; et al. | 2015-01-08 |
| Package-on-package process for applying molding compound Grant 8,927,391 - Chen , et al. January 6, 2 | 2015-01-06 |
| Package on package bonding structure and method for forming the same Grant 8,928,134 - Huang , et al. January 6, 2 | 2015-01-06 |
| Alignment in the Packaging of Integrated Circuits App 20140374922 - Huang; Kuei-Wei ; et al. | 2014-12-25 |
| Packaging Methods and Packaged Semiconductor Devices App 20140367867 - Lin; Wei-Hung ; et al. | 2014-12-18 |
| Flash Drive App 20140337555 - Chung; Hung-I ; et al. | 2014-11-13 |
| Packaging Process Tools and Packaging Methods for Semiconductor Devices App 20140331462 - Lu; Wen-Hsiung ; et al. | 2014-11-13 |
| Packaging methods and structures for semiconductor devices Grant 8,884,431 - Lin , et al. November 11, 2 | 2014-11-11 |
| Warpage control in a package-on-package structure Grant 8,846,448 - Chen , et al. September 30, 2 | 2014-09-30 |
| Package-on-Package Structures and Methods for Forming the Same App 20140264856 - Huang; Kuei-Wei ; et al. | 2014-09-18 |
| Package Structures and Methods for Forming the Same App 20140252594 - Meng; Hsien-Liang ; et al. | 2014-09-11 |
| Storage Interface Module App 20140256164 - Lin; Wei-Hung | 2014-09-11 |
| Packaging Methods and Packaged Semiconductor Devices App 20140231988 - Chen; Meng-Tse ; et al. | 2014-08-21 |
| Packaging process tools and packaging methods for semiconductor devices Grant 8,809,117 - Lu , et al. August 19, 2 | 2014-08-19 |
| Package On Package Bonding Structure And Method For Forming The Same App 20140183732 - Huang; Kuei-Wei ; et al. | 2014-07-03 |
| Methods for Forming 3DIC Package App 20140091509 - Chen; Meng-Tse ; et al. | 2014-04-03 |
| Storage Device And Producing Method Of The Same App 20140078662 - Lin; Wei-Hung ; et al. | 2014-03-20 |
| Warpage Control In A Package-on-package Structure App 20140045300 - Chen; Meng-Tse ; et al. | 2014-02-13 |
| Bump-on-trace Packaging Structure And Method For Forming The Same App 20140008786 - Chen; Meng-Tse ; et al. | 2014-01-09 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20140001652 - CHEN; Meng-Tse ; et al. | 2014-01-02 |
| Forming low stress joints using thermal compress bonding Grant 8,616,433 - Huang , et al. December 31, 2 | 2013-12-31 |
| Forming low stress joints using thermal compress bonding Grant 08616433 - | 2013-12-31 |
| Contact and Method of Formation App 20130334710 - Chen; Meng-Tse ; et al. | 2013-12-19 |
| Methods for forming 3DIC package Grant 8,609,462 - Chen , et al. December 17, 2 | 2013-12-17 |
| Process for forming packages Grant 8,603,860 - Chen , et al. December 10, 2 | 2013-12-10 |
| Contact and method of formation Grant 8,586,408 - Chen , et al. November 19, 2 | 2013-11-19 |
| Package On Package Structures And Methods For Forming The Same App 20130270700 - YU; Chen-Hua ; et al. | 2013-10-17 |
| Thermal compress bonding Grant 8,556,158 - Jang , et al. October 15, 2 | 2013-10-15 |
| Packaging Methods and Packaged Semiconductor Devices App 20130234317 - Chen; Meng-Tse ; et al. | 2013-09-12 |
| Semiconductor Packaging Structure and Method App 20130187268 - Lin; Chun-Cheng ; et al. | 2013-07-25 |
| Method of manufacturing storage apparatus Grant 8,476,110 - Lin , et al. July 2, 2 | 2013-07-02 |
| Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices App 20130143361 - Lin; Wei-Hung ; et al. | 2013-06-06 |
| Method Of Manufacturing Storage Apparatus App 20130133191 - Lin; Wei-Hung ; et al. | 2013-05-30 |
| Forming Low Stress Joints Using Thermal Compress Bonding App 20130128486 - Huang; Kuei-Wei ; et al. | 2013-05-23 |
| Thermal Compress Bonding App 20130126591 - Jang; Bor-Ping ; et al. | 2013-05-23 |
| Contact and Method of Formation App 20130113116 - Chen; Meng-Tse ; et al. | 2013-05-09 |
| Storage Device And Method For Producing The Same App 20130107440 - Lin; Wei-Hung ; et al. | 2013-05-02 |
| Process for Forming Packages App 20130102112 - Chen; Meng-Tse ; et al. | 2013-04-25 |
| Semiconductor Package And Method Of Forming The Same App 20130093076 - LIN; Wei-Hung ; et al. | 2013-04-18 |
| Methods for Forming 3DIC Package App 20130095608 - Chen; Meng-Tse ; et al. | 2013-04-18 |
| Packaging Methods for Semiconductor Devices App 20130095611 - Huang; Kuei-Wei ; et al. | 2013-04-18 |
| Packaging Process Tools and Packaging Methods for Semiconductor Devices App 20130089952 - Lu; Wen-Hsiung ; et al. | 2013-04-11 |
| Packaging Methods and Structures for Semiconductor Devices App 20130062761 - Lin; Chih-Wei ; et al. | 2013-03-14 |
| Storage apparatus and method of manufacturing the same Grant 8,393,907 - Lin , et al. March 12, 2 | 2013-03-12 |
| Thermal compress bonding Grant 8,381,965 - Jang , et al. February 26, 2 | 2013-02-26 |
| Forming low stress joints using thermal compress bonding Grant 8,360,303 - Huang , et al. January 29, 2 | 2013-01-29 |
| Package-on-Package Process for Applying Molding Compound App 20120299181 - Chen; Meng-Tse ; et al. | 2012-11-29 |
| Methods and Apparatus for Thin Die Processing App 20120267423 - Huang; Kuei-Wei ; et al. | 2012-10-25 |
| Flash drive and housing assembly thereof Grant 8,254,132 - Lin August 28, 2 | 2012-08-28 |
| Storage apparatus Grant 8,120,903 - Lin , et al. February 21, 2 | 2012-02-21 |
| Thermal Compress Bonding App 20120018494 - Jang; Bor-Ping ; et al. | 2012-01-26 |
| Storage Apparatus And Method Of Manufacturing The Same App 20120020151 - Lin; Wei-Hung ; et al. | 2012-01-26 |
| Forming Low Stress Joints Using Thermal Compress Bonding App 20120021183 - Huang; Kuei-Wei ; et al. | 2012-01-26 |
| Warpage-proof circuit board structure Grant 7,875,805 - Lin January 25, 2 | 2011-01-25 |
| Method for manufacturing coreless packaging substrate Grant 7,754,598 - Lin , et al. July 13, 2 | 2010-07-13 |
| Data storage apparatus Grant 7,740,494 - Lin , et al. June 22, 2 | 2010-06-22 |
| Flash Drive And Housing Assembly Thereof App 20100110643 - Lin; Wei-Hung | 2010-05-06 |
| Storage Apparatus App 20100091469 - Lin; Wei-Hung | 2010-04-15 |
| Flash memory disk with rotatable and telescopic protection structure and method using the same Grant 7,672,122 - Lin , et al. March 2, 2 | 2010-03-02 |
| Flash Memory Disk With Rotatable And Telescopic Protection Structure And Method Using The Same App 20090122478 - Lin; Wei-Hung ; et al. | 2009-05-14 |
| Data storage apparatus App 20090061696 - Lin; Wei Hung ; et al. | 2009-03-05 |
| Warpage-proof Circuit Board Structure App 20080210459 - Lin; Wei-Hung | 2008-09-04 |
| Coreless packaging substrate and method for manufacturing the same App 20080191326 - Lin; Wei-Hung ; et al. | 2008-08-14 |
| Coaxial cable connecting apparatus Grant 7,351,067 - Chen , et al. April 1, 2 | 2008-04-01 |
| Coaxial Cable Connecting Apparatus App 20080038940 - Chen; Li-Sen ; et al. | 2008-02-14 |
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