LIN; TZU-HAN
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIN; TZU-HAN.The latest application filed is for "uv led package having encapsulating extraction layer".
Company Profile
0.32.40
- LIN; TZU-HAN - Zhubei City TW
- Lin; Tzu-Han - Zhubei TW
- Lin; Tzu-Han - Hsinchu TW
- LIN; Tzu-Han - Hsinchu City TW
- Lin; Tzu-Han - Hsinchu County N/A TW
- Lin; Tzu-Han - Hshinchu TW
- Lin; Tzu-Han - Hsin-Chu City TW
- Lin; Tzu-Han - Hsin-Chu TW
Patent Activity
| Patent | Date |
|---|---|
| UV LED Package Having Encapsulating Extraction Layer App 20220131056 - LIN; TZU-YING ; et al. | 2022-04-28 |
| Uv Led Package App 20210111318 - LIN; TZU-YING ; et al. | 2021-04-15 |
| Light emitting device Grant 10,256,217 - Lee , et al. | 2019-04-09 |
| Light Emitting Device App 20180342486 - Lee; Po-Wei ; et al. | 2018-11-29 |
| Method for fabricating an image sensor package Grant 9,484,385 - Weng , et al. November 1, 2 | 2016-11-01 |
| Method For Fabricating An Image Sensor Package App 20160079304 - WENG; Jui-Ping ; et al. | 2016-03-17 |
| Image sensor package Grant 9,231,012 - Weng , et al. January 5, 2 | 2016-01-05 |
| Method for making wafer level image module Grant 8,524,521 - Lee , et al. September 3, 2 | 2013-09-03 |
| Light-emitting diode package Grant 8,502,257 - Chang , et al. August 6, 2 | 2013-08-06 |
| Led Light Device App 20130141917 - Lin; Tzy-Ying ; et al. | 2013-06-06 |
| Chip package and fabricating method thereof Grant 8,399,969 - Chang , et al. March 19, 2 | 2013-03-19 |
| Light-emitting Diode Device App 20120205695 - Lin; Tzu-Han ; et al. | 2012-08-16 |
| Image sensing devices and methods for fabricating the same Grant 8,153,458 - Weng , et al. April 10, 2 | 2012-04-10 |
| Chip Package And Fabricating Method Thereof App 20120025387 - CHANG; Kuo-Ching ; et al. | 2012-02-02 |
| Electronic assembly for image sensor device Grant 7,994,598 - Weng , et al. August 9, 2 | 2011-08-09 |
| White-light light emitting diode chips and fabrication methods thereof Grant 7,994,531 - Lin , et al. August 9, 2 | 2011-08-09 |
| Electronic device package with electromagnetic compatibility (EMC) coating thereon Grant 7,964,936 - Shiung , et al. June 21, 2 | 2011-06-21 |
| Light-emitting Diode Package App 20110101405 - CHANG; Kuo-Ching ; et al. | 2011-05-05 |
| Light-emitting diode device and method for fabricating the same Grant 7,932,529 - Lin , et al. April 26, 2 | 2011-04-26 |
| Light-emitting diode device and method for fabricating the same Grant 7,928,655 - Lin , et al. April 19, 2 | 2011-04-19 |
| Light-emitting diode device and method for fabricating the same Grant 7,928,458 - Lin , et al. April 19, 2 | 2011-04-19 |
| Image sensor package and fabrication method thereof Grant 7,898,070 - Weng , et al. March 1, 2 | 2011-03-01 |
| White Light-emitting Diode Packages With Tunable Color Temperature App 20110037081 - Kuo; Wu-Cheng ; et al. | 2011-02-17 |
| Electronic Assembly For Image Sensor Device App 20110018082 - WENG; Jui-Ping ; et al. | 2011-01-27 |
| Optoelectronic device chip having a composite spacer structure and method making same Grant 7,860,357 - Lee , et al. December 28, 2 | 2010-12-28 |
| Method of fabricating isolation structures for CMOS image sensor chip scale packages Grant 7,833,810 - Lin , et al. November 16, 2 | 2010-11-16 |
| Electronic assembly for image sensor device Grant 7,829,966 - Weng , et al. November 9, 2 | 2010-11-09 |
| White-light Light Emitting Diode Chips And Fabrication Methods Thereof App 20100252845 - Lin; Chun-Chi ; et al. | 2010-10-07 |
| Light-emitting diode device and method for fabricating the same Grant 7,807,484 - Wang , et al. October 5, 2 | 2010-10-05 |
| Light Emitting Diode Package Structure And Fabrication Thereof App 20100237378 - LIN; Tzu-Han ; et al. | 2010-09-23 |
| Light Emitting Device App 20100237379 - KUO; Wu-Cheng ; et al. | 2010-09-23 |
| Method for forming light-transmitting regions Grant 7,732,244 - Cheng , et al. June 8, 2 | 2010-06-08 |
| Light-emitting Diode Devices And Methods For Fabricating The Same App 20100127288 - KUO; Wu-Cheng ; et al. | 2010-05-27 |
| Light-emitting Diode Device And Method For Fabricating The Same App 20100117530 - LIN; Tzu-Han ; et al. | 2010-05-13 |
| Image sensor module having precise image-projection control Grant 7,703,997 - Lee , et al. April 27, 2 | 2010-04-27 |
| Light-emitting Diode Device And Method For Fabricating The Same App 20100090235 - WANG; Wei-Ko ; et al. | 2010-04-15 |
| Electronic assembly for image sensor device and fabrication method thereof Grant 7,679,167 - Chen , et al. March 16, 2 | 2010-03-16 |
| Light-emitting Diode Device And Method For Fabricating The Same App 20100051982 - Lin; Tzu-Han ; et al. | 2010-03-04 |
| Light-emitting Diode Device And Method For Fabricating The Same App 20100012957 - LIN; Tzu-Han ; et al. | 2010-01-21 |
| Electronic Device Package With Electromagnetic Compatibility (emc) Coating Thereon App 20100006965 - Shiung; Shin-Chang ; et al. | 2010-01-14 |
| Semiconductor Devices And Fabrication Methods Thereof App 20100001305 - LIN; Chun-Chi ; et al. | 2010-01-07 |
| Image Sensor Package And Fabrication Method Thereof App 20090309178 - Weng; Jui-Ping ; et al. | 2009-12-17 |
| Wafer Level Image Module App 20090294639 - LEE; Hsiao-Wen ; et al. | 2009-12-03 |
| Isolation Structures For Cmos Image Sensor Chip Scale Packages App 20090263927 - LIN; Tzu-Han ; et al. | 2009-10-22 |
| Image sensor package and fabrication method thereof Grant 7,595,220 - Weng , et al. September 29, 2 | 2009-09-29 |
| Wafer level image module Grant 7,592,680 - Lee , et al. September 22, 2 | 2009-09-22 |
| Isolation structures for CMOS image sensor chip scale packages Grant 7,569,409 - Lin , et al. August 4, 2 | 2009-08-04 |
| Image Sensing Devices And Methods For Fabricating The Same App 20090181490 - Weng; Jui-Ping ; et al. | 2009-07-16 |
| Method for forming light-transmitting regions App 20090162967 - Cheng; Chieh-Yuan ; et al. | 2009-06-25 |
| Electronic Assembly For Image Sensor Device App 20090134483 - Weng; Jui-Ping ; et al. | 2009-05-28 |
| Image sensing devices and methods for fabricating the same Grant 7,528,420 - Weng , et al. May 5, 2 | 2009-05-05 |
| Image sensor package and fabrication method thereof App 20090032893 - Weng; Jui-Ping ; et al. | 2009-02-05 |
| Image sensor package and fabrication method thereof App 20090001495 - Weng; Jui-Ping ; et al. | 2009-01-01 |
| Optoelectronic device chip having a composite spacer structure and method making same App 20080303109 - Lee; Hsiao-Wen ; et al. | 2008-12-11 |
| Image Sensing Devices And Methods For Fabricating The Same App 20080290438 - Weng; Jui-Peng ; et al. | 2008-11-27 |
| Optoelectronic device chip having a composite spacer structure and method making same Grant 7,433,555 - Lee , et al. October 7, 2 | 2008-10-07 |
| Isolation structures for CMOS image sensor chip scale packages App 20080164553 - Lin; Tzu-Han ; et al. | 2008-07-10 |
| Electronic assembly for image sensor device and fabrication method thereof App 20080164550 - Chen; Teng-Sheng ; et al. | 2008-07-10 |
| Optoelectronic device chip having a composite spacer structure and method making same App 20070267647 - Lee; Hsiao-Wen ; et al. | 2007-11-22 |
| Image sensor module having precise image-projection control App 20070166029 - Lee; Hsiao-Wen ; et al. | 2007-07-19 |
| Wafer level image module App 20070070511 - Lee; Hsiao-Wen ; et al. | 2007-03-29 |
| Bump structure Grant 7,187,078 - Lin , et al. March 6, 2 | 2007-03-06 |
| Stack-type image sensor module App 20060289733 - Zung; Peter ; et al. | 2006-12-28 |
| Method for fabricating pad redistribution layer Grant 7,122,458 - Cheng , et al. October 17, 2 | 2006-10-17 |
| Bump structure App 20060055035 - Lin; Tzu-Han ; et al. | 2006-03-16 |
| Method for reducing lead precipitation during wafer processing App 20060046434 - Su; Boe ; et al. | 2006-03-02 |
| Method for fabricating pad redistribution layer App 20060019480 - Cheng; Chia-Jen ; et al. | 2006-01-26 |
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