Lin; Tzu-Bin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Tzu-Bin.The latest application filed is for "package structure and fabrication process thereof".
- Lin; Tzu-Bin - Kaohsiung TW
- Lin; Tzu-Bin - Kaohsiung City TW
| Patent | Date |
|---|---|
| Method for die attaching Grant 7,498,202 - Hsu , et al. March 3, 2 | 2009-03-03 |
| Package Structure And Fabrication Process Thereof App 20070045863 - Hsieh; Ya-Yu ; et al. | 2007-03-01 |
| Method for die attaching App 20060121644 - Hsu; Hung-Ta ; et al. | 2006-06-08 |
| Flip chip package structure Grant 7,005,749 - Hsu , et al. February 28, 2 | 2006-02-28 |
| Semiconductor package App 20050139994 - Hsu, Hung-Ta ; et al. | 2005-06-30 |
| Chip package structure App 20050139974 - Huang, Ya-Ling ; et al. | 2005-06-30 |
| Chip package structure App 20050140005 - Huang, Ya-Ling ; et al. | 2005-06-30 |
| Flip chip package structure App 20050029672 - Hsu, Hung-Ta ; et al. | 2005-02-10 |
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