Lin; Tsung-Shu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Tsung-Shu.The latest application filed is for "package structure".
Company Profile
38.74.93
- Lin; Tsung-Shu - Hsinchu City TW
- Lin; Tsung-Shu - New Taipei City TW
- Lin; Tsung-Shu - New Taipei TW
- LIN; Tsung-Shu - Yonghe City TW
- Lin; Tsung-Shu - Yonghe TW
- Lin; Tsung-Shu - Taipei TW
- Lin; Tsung-Shu - Taipei City TW
- - New Taipei TW
- Lin; Tsung-Shu - Taipei County TW
Patent Activity
| Patent | Date |
|---|---|
| Package Structure App 20220216123 - Wang; Shih-Hui ; et al. | 2022-07-07 |
| Semiconductor Device And Manufacturing Method Thereof App 20220189844 - Hung; Wensen ; et al. | 2022-06-16 |
| Package Structure App 20220149030 - Lin; Tsung-Shu ; et al. | 2022-05-12 |
| Semiconductor device and manufacturing method thereof Grant 11,302,600 - Hung , et al. April 12, 2 | 2022-04-12 |
| Semiconductor Device And Manufacturing Method Thereof App 20220102288 - Hung; Wensen ; et al. | 2022-03-31 |
| Package structure and manufacturing method thereof Grant 11,289,398 - Wang , et al. March 29, 2 | 2022-03-29 |
| Semiconductor Package With Redistribution Structure And Manufacturing Method Thereof App 20220093526 - Wu; Wei-Cheng ; et al. | 2022-03-24 |
| Package structure Grant 11,282,825 - Lin , et al. March 22, 2 | 2022-03-22 |
| Integrated fan-out structure and method of forming Grant 11,276,656 - Chen , et al. March 15, 2 | 2022-03-15 |
| Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof Grant 11,195,802 - Wu , et al. December 7, 2 | 2021-12-07 |
| Package Structure App 20210375769 - CHENG; Chih-Kai ; et al. | 2021-12-02 |
| Semiconductor Structure App 20210366805 - WU; CHI-HSI ; et al. | 2021-11-25 |
| Package Structure App 20210366889 - Lin; Tsung-Shu ; et al. | 2021-11-25 |
| Package Structure And Method Of Manufacturing The Same App 20210343675 - Lin; Tsung-Shu ; et al. | 2021-11-04 |
| Package Structure and Method and Equipment for Forming the Same App 20210343619 - Hung; Wensen ; et al. | 2021-11-04 |
| Semiconductor Package And Manufacturing Method Thereof App 20210305122 - Lai; Wei-Chih ; et al. | 2021-09-30 |
| Package with bridge die for interconnection and method forming same Grant 11,133,258 - Yu , et al. September 28, 2 | 2021-09-28 |
| Heat Spreading Device and Method App 20210280491 - Lin; Tsung-Shu ; et al. | 2021-09-09 |
| Integrated Circuit Package and Method App 20210272875 - Chiu; Yuan Sheng ; et al. | 2021-09-02 |
| Semiconductor structure Grant 11,088,048 - Wu , et al. August 10, 2 | 2021-08-10 |
| Package structure having line connected via portions Grant 11,088,079 - Cheng , et al. August 10, 2 | 2021-08-10 |
| Semiconductor Device and Method of Manufacture App 20210233833 - Ku; Shih-Chang ; et al. | 2021-07-29 |
| Package structure and method of manufacturing the same Grant 11,069,642 - Lin , et al. July 20, 2 | 2021-07-20 |
| Package structure and method and equipment for forming the same Grant 11,062,971 - Hung , et al. July 13, 2 | 2021-07-13 |
| Semiconductor Device And Manufacturing Method Thereof App 20210193550 - Hung; Wensen ; et al. | 2021-06-24 |
| Contact Pad for Semiconductor Device App 20210175191 - Huang; Chang-Chia ; et al. | 2021-06-10 |
| Routing design of dummy metal cap and redistribution line Grant 11,031,352 - Yu , et al. June 8, 2 | 2021-06-08 |
| Heat spreading device and method Grant 11,018,073 - Lin , et al. May 25, 2 | 2021-05-25 |
| Integrated circuit package and method Grant 11,011,451 - Chiu , et al. May 18, 2 | 2021-05-18 |
| Device and Method for UBM/RDL Routing App 20210143131 - Lee; Meng-Tsan ; et al. | 2021-05-13 |
| Semiconductor device methods of manufacture Grant 10,978,373 - Ku , et al. April 13, 2 | 2021-04-13 |
| Semiconductor Package And Manufacturing Method Thereof App 20210098391 - Wu; Wei-Cheng ; et al. | 2021-04-01 |
| Package Structure And Manufacturing Method Thereof App 20210098330 - Wang; Shih-Hui ; et al. | 2021-04-01 |
| Semiconductor Device and Method of Manufacture App 20210082845 - Hsieh; Cheng-Hsien ; et al. | 2021-03-18 |
| Contact pad for semiconductor device Grant 10,930,605 - Huang , et al. February 23, 2 | 2021-02-23 |
| Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same App 20210035953 - Yu; Chen-Hua ; et al. | 2021-02-04 |
| Package with Bridge Die For Interconnection and Method Forming Same App 20210020574 - Yu; Chen-Hua ; et al. | 2021-01-21 |
| Package Structure And Method For Forming The Same App 20200411440 - CHENG; Chih-Kai ; et al. | 2020-12-31 |
| Semiconductor package for wafer level packaging and manufacturing method thereof Grant 10,879,201 - Chiu , et al. December 29, 2 | 2020-12-29 |
| Semiconductor Package And Manufacturing Method Thereof App 20200381382 - Chiu; Ming-Yen ; et al. | 2020-12-03 |
| Semiconductor device and method of manufacture Grant 10,833,030 - Hsieh , et al. November 10, 2 | 2020-11-10 |
| Semiconductor Package and Method of Forming the Same App 20200343193 - Hsieh; Cheng-Hsien ; et al. | 2020-10-29 |
| Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,811,394 - Yu , et al. October 20, 2 | 2020-10-20 |
| Integrated Fan-Out Structure and Method of Forming App 20200303332 - Chen; Hsien-Wei ; et al. | 2020-09-24 |
| Semiconductor Package And Manufacturing Method Thereof App 20200273828 - Chiu; Ming-Yen ; et al. | 2020-08-27 |
| Semiconductor package and manufacturing method thereof Grant 10,756,038 - Chiu , et al. A | 2020-08-25 |
| Semiconductor package and method of forming the same Grant 10,714,426 - Hsieh , et al. | 2020-07-14 |
| Package Structure and Method and Equipment for Forming the Same App 20200219786 - Hung; Wensen ; et al. | 2020-07-09 |
| Packaging device and method of making the same Grant 10,700,033 - Huang , et al. | 2020-06-30 |
| Package Structure And Method Of Manufacturing The Same App 20200203303 - Lin; Tsung-Shu ; et al. | 2020-06-25 |
| Integrated Circuit Package And Method App 20200185304 - Chiu; Yuan Sheng ; et al. | 2020-06-11 |
| Integrated fan-out structure and method of forming Grant 10,679,953 - Chen , et al. | 2020-06-09 |
| Semiconductor Structure App 20200135610 - WU; CHI-HSI ; et al. | 2020-04-30 |
| Semiconductor Device And Package Assembly Including The Same App 20200098712 - CHUANG; Chita ; et al. | 2020-03-26 |
| Contact Pad for Semiconductor Device App 20200051936 - Huang; Chang-Chia ; et al. | 2020-02-13 |
| Heat Spreading Device And Method App 20200051888 - Lin; Tsung-Shu ; et al. | 2020-02-13 |
| Device and Method for UBM/RDL Routing App 20190393195 - Lee; Meng-Tsan ; et al. | 2019-12-26 |
| Semiconductor structure and manufacturing method thereof Grant 10,515,867 - Wu , et al. Dec | 2019-12-24 |
| Semiconductor Device And Method Of Manufacture App 20190385929 - Ku; Shih-Chang ; et al. | 2019-12-19 |
| Packaging assembly and method of making the same Grant 10,483,225 - Chuang , et al. Nov | 2019-11-19 |
| Integrated Fan-Out Structure and Method of Forming App 20190348381 - Chen; Hsien-Wei ; et al. | 2019-11-14 |
| Routing Design of Dummy Metal Cap and Redistribution Line App 20190341360 - Yu; Chen-Hua ; et al. | 2019-11-07 |
| Heat spreading device and method Grant 10,461,014 - Lin , et al. Oc | 2019-10-29 |
| Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20190326259 - Yu; Chen-Hua ; et al. | 2019-10-24 |
| Contact pad for semiconductor device Grant 10,453,813 - Huang , et al. Oc | 2019-10-22 |
| Semiconductor Device and Method of Manufacture App 20190252334 - Hsieh; Cheng-Hsien ; et al. | 2019-08-15 |
| Integrated fan-out structure and method of forming Grant 10,366,959 - Chen , et al. July 30, 2 | 2019-07-30 |
| Routing design of dummy metal cap and redistribution line Grant 10,354,961 - Yu , et al. July 16, 2 | 2019-07-16 |
| Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 10,347,606 - Yu , et al. July 9, 2 | 2019-07-09 |
| Semiconductor Structure And Manufacturing Method Thereof App 20190148261 - WU; CHI-HSI ; et al. | 2019-05-16 |
| Semiconductor device and method of manufacture Grant 10,269,738 - Hsieh , et al. | 2019-04-23 |
| Heat Spreading Device and Method App 20190067157 - Lin; Tsung-Shu ; et al. | 2019-02-28 |
| Semiconductor Package and Method of Forming the Same App 20180366412 - Hsieh; Cheng-Hsien ; et al. | 2018-12-20 |
| Packaging Device And Method Of Making The Same App 20180350764 - Huang; Chang-Chia ; et al. | 2018-12-06 |
| Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20180277520 - Yu; Chen-Hua ; et al. | 2018-09-27 |
| Routing Design of Dummy Metal Cap and Redistribution Line App 20180261557 - Yu; Chen-Hua ; et al. | 2018-09-13 |
| Semiconductor package and method of forming the same Grant 10,062,648 - Hsieh , et al. August 28, 2 | 2018-08-28 |
| Packaging device and method of making the same Grant 10,050,001 - Huang , et al. August 14, 2 | 2018-08-14 |
| Semiconductor Device and Method of Manufacture App 20180218989 - Hsieh; Cheng-Hsien ; et al. | 2018-08-02 |
| Packaging Assembly And Method Of Making The Same App 20180182724 - CHUANG; Chita ; et al. | 2018-06-28 |
| Devices employing thermal and mechanical enhanced layers and methods of forming same Grant 9,984,998 - Yu , et al. May 29, 2 | 2018-05-29 |
| Mechanisms for forming fine-pitch copper bump structures Grant 9,978,656 - Lin , et al. May 22, 2 | 2018-05-22 |
| Routing design of dummy metal cap and redistribution line Grant 9,972,581 - Yu , et al. May 15, 2 | 2018-05-15 |
| Conductive pattern and integrated fan-out package having the same Grant 9,941,216 - Chiu , et al. April 10, 2 | 2018-04-10 |
| Semiconductor device and method of manufacture Grant 9,929,112 - Hsieh , et al. March 27, 2 | 2018-03-27 |
| Bump structures in semiconductor device and packaging assembly Grant 9,905,524 - Chuang , et al. February 27, 2 | 2018-02-27 |
| Ring structure for chip packaging Grant 9,887,144 - Lin , et al. February 6, 2 | 2018-02-06 |
| Integrated Fan-Out Structure and Method of Forming App 20180026001 - Chen; Hsien-Wei ; et al. | 2018-01-25 |
| Conductive Pattern And Integrated Fan-out Package Having The Same App 20170345762 - Chiu; Ming-Yen ; et al. | 2017-11-30 |
| Device and Method for UBM/RDL Routing App 20170338204 - Lee; Meng-Tsan ; et al. | 2017-11-23 |
| Reinforcement structure and method for controlling warpage of chip mounted on substrate Grant 9,806,038 - Yu , et al. October 31, 2 | 2017-10-31 |
| Contact Pad For Semiconductor Device App 20170301637 - Huang; Chang-Chia ; et al. | 2017-10-19 |
| Integrated fan-out structure and method of forming Grant 9,786,614 - Chen , et al. October 10, 2 | 2017-10-10 |
| Semiconductor Package And Method Of Forming The Same App 20170250138 - Hsieh; Cheng-Hsien ; et al. | 2017-08-31 |
| Devices Employing Thermal and Mechanical Enhanced Layers and Methods of Forming Same App 20170194292 - Yu; Chen-Hua ; et al. | 2017-07-06 |
| Contact pad for semiconductor device Grant 9,691,686 - Huang , et al. June 27, 2 | 2017-06-27 |
| Integrated Fan-Out Structure and Method of Forming App 20170141053 - Chen; Hsien-Wei ; et al. | 2017-05-18 |
| Fan-out stacked system in package (SIP) having dummy dies and methods of making the same Grant 9,613,931 - Lin , et al. April 4, 2 | 2017-04-04 |
| Semiconductor Device and Method of Manufacture App 20170092604 - Hsieh; Cheng-Hsien ; et al. | 2017-03-30 |
| Bumps for chip scale packaging including under bump metal structures with different diameters Grant 9,553,065 - Lin , et al. January 24, 2 | 2017-01-24 |
| Package redistribution layer structure and method of forming same Grant 9,548,283 - Lin , et al. January 17, 2 | 2017-01-17 |
| Packaging Device And Method Of Making The Same App 20170005060 - Huang; Chang-Chia ; et al. | 2017-01-05 |
| Fan-out Stacked System In Package (sip) Having Dummy Dies And Methods Of Making The Same App 20160322330 - Lin; Tsung-Shu ; et al. | 2016-11-03 |
| Reinforcement Structure and Method for Controlling Warpage of Chip Mounted on Substrate App 20160315057 - Yu; Chen-Hua ; et al. | 2016-10-27 |
| Packaging device and method of making the same Grant 9,449,933 - Huang , et al. September 20, 2 | 2016-09-20 |
| Chip packages and methods of manufacturing the same Grant 9,443,806 - Jeng , et al. September 13, 2 | 2016-09-13 |
| Reinforcement structure and method for controlling warpage of chip mounted on substrate Grant 9,385,091 - Yu , et al. July 5, 2 | 2016-07-05 |
| Contact Pad for Semiconductor Device App 20150348877 - Huang; Chang-Chia ; et al. | 2015-12-03 |
| Scribe line structure for wafer dicing and method of making the same Grant 9,190,359 - Wu , et al. November 17, 2 | 2015-11-17 |
| Chip Packages And Methods Of Manufacturing The Same App 20150325536 - Jeng; Shin-Puu ; et al. | 2015-11-12 |
| Elongated bump structure in semiconductor device Grant 9,053,989 - Kuo , et al. June 9, 2 | 2015-06-09 |
| Lid design for reliability enhancement in flip chip package Grant 8,976,529 - Lin , et al. March 10, 2 | 2015-03-10 |
| Extending metal traces in bump-on-trace structures Grant 8,970,033 - Chen , et al. March 3, 2 | 2015-03-03 |
| Die carrier for package on package assembly Grant 8,927,333 - Lin , et al. January 6, 2 | 2015-01-06 |
| Elongated bumps in integrated circuit devices Grant 08922006 - | 2014-12-30 |
| Elongated bumps in integrated circuit devices Grant 8,922,006 - Lin , et al. December 30, 2 | 2014-12-30 |
| Electrical connection structure Grant 8,883,628 - Chuang , et al. November 11, 2 | 2014-11-11 |
| Package Device Including An Opening In A Flexible Substrate And Methods Of Forming The Same App 20140264803 - Lin; Tsung-Shu ; et al. | 2014-09-18 |
| Package device including an opening in a flexible substrate and methods of forming the same Grant 8,836,094 - Lin , et al. September 16, 2 | 2014-09-16 |
| Reinforcement Structure And Method For Controlling Warpage Of Chip Mounted On Substrate App 20140252591 - Yu; Chen-Hua ; et al. | 2014-09-11 |
| Bumps for Chip Scale Packaging App 20140191394 - Lin; Chun-Hung ; et al. | 2014-07-10 |
| Scribe line structure for wafer dicing and method of making the same App 20140054750 - Wu; Ping-Chang ; et al. | 2014-02-27 |
| Package Redistribution Layer Structure and Method of Forming Same App 20140008785 - Lin; Tsung-Shu ; et al. | 2014-01-09 |
| Scribe line structure for wafer dicing Grant 8,610,252 - Wu , et al. December 17, 2 | 2013-12-17 |
| Electrical Connection Structure App 20130288473 - Chuang; Yao-Chun ; et al. | 2013-10-31 |
| Methods and Apparatus for bump-on-trace Chip Packaging App 20130277828 - Huang; Chang-Chia ; et al. | 2013-10-24 |
| Packaging Device And Method Of Making The Same App 20130256870 - HUANG; Chang-Chia ; et al. | 2013-10-03 |
| Elongated Bumps in Integrated Circuit Devices App 20130256874 - Lin; Yen-Liang ; et al. | 2013-10-03 |
| Method and structure for controlling package warpage Grant 8,519,535 - Lin , et al. August 27, 2 | 2013-08-27 |
| Electrical connection structure Grant 8,476,759 - Chuang , et al. July 2, 2 | 2013-07-02 |
| Electrical Connection Structure App 20130134563 - Chuang; Yao-Chun ; et al. | 2013-05-30 |
| Mechanisms For Forming Fine-pitch Copper Bump Structures App 20130127045 - LIN; Tsung-Shu ; et al. | 2013-05-23 |
| Die Carrier For Package On Package Assembly App 20130127040 - Lin; Tsung-Shu ; et al. | 2013-05-23 |
| Bumps for Chip Scale Packaging App 20130119532 - Lin; Chun-Hung ; et al. | 2013-05-16 |
| Elongated Bump Structure In Semiconductor Device App 20130062755 - Kuo; Chen-Cheng ; et al. | 2013-03-14 |
| Ring Structure For Chip Packaging App 20130062752 - LIN; Wen-Yi ; et al. | 2013-03-14 |
| Bump Structures In Semiconductor Device And Packaging Assembly App 20130026622 - CHUANG; Chita ; et al. | 2013-01-31 |
| Method And Structure For Controlling Package Warpage App 20120286417 - Lin; Tsung-Shu ; et al. | 2012-11-15 |
| Extending Metal Traces in Bump-on-Trace Structures App 20120217632 - Chen; Yu-Feng ; et al. | 2012-08-30 |
| Lid Design for Reliability Enhancement in Flip Chip Package App 20120182694 - Lin; Wen-Yi ; et al. | 2012-07-19 |
| Scribe line structure for wafer dicing App 20110278701 - Wu; Ping-Chang ; et al. | 2011-11-17 |
| Scribe line structure for wafer dicing and method of making the same Grant 8,013,425 - Wu , et al. September 6, 2 | 2011-09-06 |
| Method of semiconductor packaging Grant 7,871,860 - Pu , et al. January 18, 2 | 2011-01-18 |
| Scribe line structure for wafer dicing and method of making the same App 20090283869 - Wu; Ping-Chang ; et al. | 2009-11-19 |
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