Lin; Tsui Yee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Tsui Yee.The latest application filed is for "multiple leadframe laminated ic package".
- Lin; Tsui Yee - Kowloon HK
| Patent | Date |
|---|---|
| Multiple leadframe laminated IC package Grant 7,449,771 - Fan , et al. November 11, 2 | 2008-11-11 |
| Leadless plastic chip carrier and method of fabricating same Grant 7,410,830 - Fan , et al. August 12, 2 | 2008-08-12 |
| Multiple leadframe laminated IC package Grant 6,734,044 - Fan , et al. May 11, 2 | 2004-05-11 |
| Leadless plastic chip carrier with partial etch die attach pad Grant 6,585,905 - Fan , et al. July 1, 2 | 2003-07-01 |
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