loadpatents
name:-0.047719955444336
name:-0.04411506652832
name:-0.024436950683594
Lin; Shih-Yen Patent Filings

Lin; Shih-Yen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Shih-Yen.The latest application filed is for "semiconductor device and manufacturing method thereof".

Company Profile
23.37.40
  • Lin; Shih-Yen - Tainan TW
  • LIN; Shih-Yen - Tainan City TW
  • Lin; Shih-Yen - New Taipei TW
  • Lin; Shih-Yen - Hsinchu TW
  • Lin; Shih-Yen - Hsin-Chu TW
  • Lin; Shih-Yen - New Taipei City TW
  • Lin; Shih-Yen - Hsinchu City TW
  • Lin; Shih-Yen - Taipei TW
  • LIN; SHIH-YEN - Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
2D crystal hetero-structures and manufacturing methods thereof
Grant 11,211,460 - Lin , et al. December 28, 2
2021-12-28
Semiconductor device and method of formation
Grant 11,171,212 - Lin , et al. November 9, 2
2021-11-09
Forming semiconductor structures with two-dimensional materials
Grant 11,152,209 - Lin , et al. October 19, 2
2021-10-19
Source/drain contact with 2-D material
Grant 11,121,214 - Lin , et al. September 14, 2
2021-09-14
Method of forming a semiconductor device using layered etching and repairing of damaged portions
Grant 10,985,019 - Lin , et al. April 20, 2
2021-04-20
Semiconductor Device And Manufacturing Method Thereof
App 20210057524 - LIN; Shih-Yen ;   et al.
2021-02-25
2d Crystal Hetero-structures And Manufacturing Methods Thereof
App 20210005719 - LIN; Shih-Yen ;   et al.
2021-01-07
System and method for bonding package lid
Grant 10,879,140 - Lin , et al. December 29, 2
2020-12-29
Semiconductor structures with two-dimensional materials
Grant 10,872,973 - Lin , et al. December 22, 2
2020-12-22
Semiconductor packaging structure and process
Grant 10,867,835 - Ho , et al. December 15, 2
2020-12-15
2D crystal hetero-structures and manufacturing methods thereof
Grant 10,784,351 - Lin , et al. Sept
2020-09-22
Method Of Forming A Semiconductor Device Using Layered Etching And Repairing Of Damaged Portions
App 20200266059 - LIN; Shih-Yen ;   et al.
2020-08-20
Forming Semiconductor Structures With Two-dimensional Materials
App 20200194258 - Lin; Shih-Yen ;   et al.
2020-06-18
Method of forming a semiconductor device using layered etching and repairing of damaged portions
Grant 10,636,652 - Lin , et al.
2020-04-28
Forming semiconductor structures with two-dimensional materials
Grant 10,541,132 - Lin , et al. Ja
2020-01-21
Semiconductor Structures With Two-dimensional Materials
App 20200006541 - Lin; Shih-Yen ;   et al.
2020-01-02
Forming Semicondcutor Structures With Two-dimensional Materials
App 20190378715 - Lin; Shih-Yen ;   et al.
2019-12-12
Semiconductor device with transition metal dichalocogenide hetero-structure
Grant 10,505,052 - Lin , et al. Dec
2019-12-10
Semiconductor Device And Method Of Formation
App 20190319101 - Lin; Meng-Yu ;   et al.
2019-10-17
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
Grant 10,403,744 - Lin , et al. Sep
2019-09-03
Method Of Forming A Semiconductor Device Using Layered Etching And Repairing Of Damaged Portions
App 20190237328 - LIN; Shih-Yen ;   et al.
2019-08-01
Semiconductor Packaging Structure and Process
App 20190139817 - Ho; Kuan-Lin ;   et al.
2019-05-09
System and Method for Bonding Package Lid
App 20190122946 - Lin; Shih-Yen ;   et al.
2019-04-25
Semiconductor Device with Transition Metal Dichalocogenide Hetero-Structure
App 20190123211 - Lin; Shih-Yen ;   et al.
2019-04-25
Method of forming a semiconductor device using layered etching and repairing of damaged portions
Grant 10,269,564 - Lin , et al.
2019-04-23
Semiconductor device and method of formation
Grant 10,269,902 - Lin , et al.
2019-04-23
System and method for bonding package lid
Grant 10,269,668 - Lin , et al.
2019-04-23
Semiconductor device with transition metal dichalocogenide hetero-structure
Grant 10,164,122 - Lin , et al. Dec
2018-12-25
Semiconductor packaging structure and process
Grant 10,157,772 - Ho , et al. Dec
2018-12-18
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
Grant 10,157,737 - Lin , et al. Dec
2018-12-18
Method of manufacturing a FET using a two dimensional transition metal dichalcogenide including a low power oxygen plasma treatment
Grant 10,147,603 - Lin , et al. De
2018-12-04
Method Of Forming A Semiconductor Device Using Layered Etching And Repairing Of Damaged Portions
App 20180269059 - LIN; Shih-Yen ;   et al.
2018-09-20
2d Crystal Hetero-structures And Manufacturing Methods Thereof
App 20180269291 - LIN; Shih-Yen ;   et al.
2018-09-20
Semiconductor Device with Transition Metal Dichalocogenide Hetero-Structure
App 20180151752 - Lin; Shih-Yen ;   et al.
2018-05-31
Semiconductor Device And Method Of Formation
App 20180122909 - LIN; Meng-Yu ;   et al.
2018-05-03
Semiconductor Devices Comprising 2D-Materials and Methods of Manufacture Thereof
App 20180068851 - Lin; Meng-Yu ;   et al.
2018-03-08
Semiconductor device with transition metal dichalocogenide hetero-structure
Grant 9,899,537 - Lin , et al. February 20, 2
2018-02-20
Method of manufacturing a chip package
Grant 9,893,043 - Chen , et al. February 13, 2
2018-02-13
A Field Effect Transistor Using Transition Metal Dichalcogenide And A Method For Forming The Same
App 20180005824 - LIN; Shih-Yen ;   et al.
2018-01-04
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
Grant 9,859,115 - Lin , et al. January 2, 2
2018-01-02
Semiconductor device and method of formation
Grant 9,853,105 - Lin , et al. December 26, 2
2017-12-26
Semiconductor Device with Transition Metal Dichalocogenide Hetero-Structure
App 20170345944 - Lin; Shih-Yen ;   et al.
2017-11-30
Semiconductor Packaging Structure and Process
App 20170345708 - Ho; Kuan-Lin ;   et al.
2017-11-30
Packaging methods for semiconductor devices with encapsulant ring
Grant 9,805,997 - Liu , et al. October 31, 2
2017-10-31
Semiconductor device and manufacturing method thereof
Grant 9,786,520 - Liu , et al. October 10, 2
2017-10-10
System and Method for Bonding Package Lid
App 20170271223 - Lin; Shih-Yen ;   et al.
2017-09-21
Semiconductor packaging structure and process
Grant 9,735,043 - Ho , et al. August 15, 2
2017-08-15
System and method for bonding package lid
Grant 9,673,119 - Lin , et al. June 6, 2
2017-06-06
Semiconductor Device And Method Of Formation
App 20170098693 - Lin; Meng-Yu ;   et al.
2017-04-06
Semiconductor device structure and method for forming the same
Grant 9,577,049 - Lin , et al. February 21, 2
2017-02-21
Semiconductor Devices Comprising 2D-Materials and Methods of Manufacture Thereof
App 20160379901 - Lin; Shih-Yen ;   et al.
2016-12-29
Semiconductor device and method of formation
Grant 9,525,072 - Lin , et al. December 20, 2
2016-12-20
Semiconductor Devices Comprising 2D-Materials and Methods of Manufacture Thereof
App 20160240719 - Lin; Meng-Yu ;   et al.
2016-08-18
Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device
Grant 9,415,501 - Ho , et al. August 16, 2
2016-08-16
Adhesive pattern for advance package reliability improvement
Grant 9,287,233 - Chen , et al. March 15, 2
2016-03-15
Semiconductor Device And Manufacturing Method Thereof
App 20160071744 - LIU; YU-CHIH ;   et al.
2016-03-10
Semiconductor Device And Method Of Formation
App 20160043235 - Lin; Meng-Yu ;   et al.
2016-02-11
Method Of Manufacturing A Chip Package
App 20150357318 - Chen; Chin-Liang ;   et al.
2015-12-10
Semiconductor device and manufacturing method thereof
Grant 9,209,046 - Liu , et al. December 8, 2
2015-12-08
Semiconductor device and manufacturing method thereof
Grant 9,142,523 - Liu , et al. September 22, 2
2015-09-22
Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices
App 20150214074 - Liu; Yu-Chih ;   et al.
2015-07-30
System and Method for Bonding Package Lid
App 20150214128 - Lin; Shih-Yen ;   et al.
2015-07-30
Semiconductor Packaging Structure and Process
App 20150179607 - Ho; Kuan-Lin ;   et al.
2015-06-25
Adhesive Pattern For Advance Package Reliability Improvement
App 20150155221 - Chen; Chin-Liang ;   et al.
2015-06-04
Emiconductor Device And Manufacturing Method Thereof
App 20150145115 - LIU; YU-CHIH ;   et al.
2015-05-28
Method for manufacturing graphene film and graphene channel of transistor
Grant 9,029,190 - Lin , et al. May 12, 2
2015-05-12
Semiconductor Device And Manufacturing Method Thereof
App 20150093856 - LIU; YU-CHIH ;   et al.
2015-04-02
Apparatus For Manufacturing A Semiconductor Device And Method Of Manufacturing A Semiconductor Device
App 20150059159 - HO; KUAN-LIN ;   et al.
2015-03-05
Method For Manufacturing Graphene Film And Graphene Channel Of Transistor
App 20140273414 - LIN; SHIH-YEN ;   et al.
2014-09-18
Process For Forming Carbon Film Or Inorganic Material Film On Substrate By Physical Vapor Deposition
App 20130266739 - LIN; Shih-Yen ;   et al.
2013-10-10
Vertical organic transistor and method of fabricating the same
Grant 7,560,728 - Lin , et al. July 14, 2
2009-07-14
Vertical Organic Transistor And Method Of Fabricating The Same
App 20070176166 - Lin; Shih-Yen ;   et al.
2007-08-02
Quantum-dot infrared photodetector
App 20060138396 - Lin; Shih-Yen ;   et al.
2006-06-29
Structure of quantum dot light emitting diode and method of fabricating the same
Grant 6,909,108 - Tang , et al. June 21, 2
2005-06-21
[structure Of Quantum Dot Light Emitting Diode And Method Of Fabricating The Same]
App 20040183062 - TANG, SHIANG-FENG ;   et al.
2004-09-23
Quantum dot infrared photodetector and method for fabricating the same
App 20020094597 - Lin, Shih-Yen ;   et al.
2002-07-18

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed