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Package Structure And Manufacturing Method Thereof
App 20220262745 - Tsai; Tsung-Fu ; et al. | 2022-08-18 |
Package structure and method of fabricating the same
Grant 11,417,606 - Lin , et al. August 16, 2 | 2022-08-16 |
Piezoelectric sensing system and piezoelectric sensing circuit
Grant 11,411,161 - Lin , et al. August 9, 2 | 2022-08-09 |
Spindle Shaft Device With Torque Sensor
App 20220187149 - YEH; Chien-Nan ; et al. | 2022-06-16 |
Package structure and manufacturing method thereof
Grant 11,355,454 - Tsai , et al. June 7, 2 | 2022-06-07 |
Laser Inspection System
App 20220131326 - Lee; Yi-Chi ; et al. | 2022-04-28 |
Integrated fan-out structure with rugged interconnect
Grant 11,282,793 - Lin , et al. March 22, 2 | 2022-03-22 |
Integrated Circuit Package and Method
App 20220068856 - Chiou; Wen-Chih ; et al. | 2022-03-03 |
Manufacturing Method For Micro-needle Device
App 20220047857 - Chern; Ming-Kai ; et al. | 2022-02-17 |
Package Structure And Manufacturing Method Thereof
App 20220037266 - Tsai; Tsung-Fu ; et al. | 2022-02-03 |
Package structure and method of fabricating the same
Grant 11,205,629 - Tsai , et al. December 21, 2 | 2021-12-21 |
Method Of Fabricating Semiconductor Device Having Dummy Micro Bumps Between Stacking Dies
App 20210384044 - TSAI; Tsung-Fu ; et al. | 2021-12-09 |
Semiconductor package and manufacturing method of semiconductor package having plurality of encapsulating materials
Grant 11,133,289 - Tsai , et al. September 28, 2 | 2021-09-28 |
Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material
Grant 11,101,145 - Tsai , et al. August 24, 2 | 2021-08-24 |
Package-on-package structure and manufacturing method thereof
Grant 11,101,252 - Lin , et al. August 24, 2 | 2021-08-24 |
Package Structure With Underfill
App 20210242177 - TSAI; Chen-Hsuan ; et al. | 2021-08-05 |
Package Structure And Method Of Fabricating The Same
App 20210225791 - Tsai; Tsung-Fu ; et al. | 2021-07-22 |
Integrated Circuit Package And Method
App 20210225666 - Lin; Shih Ting ; et al. | 2021-07-22 |
Piezoelectric Sensing System And Piezoelectric Sensing Circuit
App 20210202822 - LIN; Chih-Hsiou ; et al. | 2021-07-01 |
Package Structure And Method Of Manufacturing The Same
App 20210193577 - Lin; Shih-Ting ; et al. | 2021-06-24 |
Package Structure And Method For Forming The Same
App 20210167024 - TSAI; Tsung-Fu ; et al. | 2021-06-03 |
Method of Diagnosis with Point-of-Care Ultrasound Devices
App 20210145401 - Lin; Chia-Hsin ; et al. | 2021-05-20 |
Device and method of analyzing transistor and non-transitory computer readable medium
Grant 11,009,551 - Lin May 18, 2 | 2021-05-18 |
Structure and formation method of package structure with underfill
Grant 10,985,140 - Tsai , et al. April 20, 2 | 2021-04-20 |
Electronic Device And Manufacturing Method Thereof
App 20210098386 - Tsai; Tsung-Fu ; et al. | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210098382 - Lin; Shih-Ting ; et al. | 2021-04-01 |
Package structure and method for forming the same
Grant 10,923,438 - Tsai , et al. February 16, 2 | 2021-02-16 |
Electronic device and manufacturing method thereof
Grant 10,867,919 - Tsai , et al. December 15, 2 | 2020-12-15 |
Solution for reducing poor contact in InFO package
Grant 10,861,835 - Lin , et al. December 8, 2 | 2020-12-08 |
Semiconductor Package And Manufacturing Method Of Semiconductor Package
App 20200365557 - Tsai; Tsung-Fu ; et al. | 2020-11-19 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,825,693 - Lin , et al. November 3, 2 | 2020-11-03 |
Package Structure And Method For Forming The Same
App 20200343198 - TSAI; Tsung-Fu ; et al. | 2020-10-29 |
Structure And Formation Method Of Package Structure With Underfill
App 20200328185 - TSAI; Chen-Hsuan ; et al. | 2020-10-15 |
Laser Device
App 20200194962 - JHANG; Yao-Wun ; et al. | 2020-06-18 |
Method for estimating resistances of a source contact and a drain contact of a MOS transistor
Grant 10,627,442 - Lin , et al. | 2020-04-21 |
Electronic Device And Manufacturing Method Thereof
App 20200091077 - Tsai; Tsung-Fu ; et al. | 2020-03-19 |
Semiconductor Device With Dummy Micro Bumps Between Stacking Dies To Improve Flowability Of Underfill Material
App 20200058519 - TSAI; Tsung-Fu ; et al. | 2020-02-20 |
Transistor device
Grant 10,566,432 - Lin , et al. Feb | 2020-02-18 |
Device And Method Of Analyzing Transistor And Non-transitory Computer Readable Medium
App 20190391206 - LIN; Shih-Ting | 2019-12-26 |
Package-on-package Structure And Manufacturing Method Thereof
App 20190378827 - Lin; Shih-Ting ; et al. | 2019-12-12 |
Solution for Reducing Poor Contact in InFO Package
App 20190333900 - Lin; Jing-Cheng ; et al. | 2019-10-31 |
Transistor device
Grant 10,461,162 - Lin , et al. Oc | 2019-10-29 |
Package-on-package structure and manufacturing method thereof
Grant 10,438,934 - Lin , et al. O | 2019-10-08 |
Carrier Warpage Control For Three Dimensional Integrated Circuit (3dic) Stacking
App 20190267255 - Lin; Jing-Cheng ; et al. | 2019-08-29 |
Solution for reducing poor contact in InFO package
Grant 10,347,612 - Lin , et al. July 9, 2 | 2019-07-09 |
Transistor device
Grant 10,325,991 - Lin , et al. | 2019-06-18 |
Method For Estimating Resistances Of A Source Contact And A Drain Contact Of A Mos Transistor
App 20190178931 - LIN; Shih-Ting ; et al. | 2019-06-13 |
Transistor Device
App 20190173469 - Lin; Shih-Ting ; et al. | 2019-06-06 |
Transistor Device
App 20190172918 - Lin; Shih-Ting ; et al. | 2019-06-06 |
Transistor Device
App 20190172919 - LIN; SHIH-TING ; et al. | 2019-06-06 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,290,513 - Lin , et al. | 2019-05-14 |
Rework process and tool design for semiconductor package
Grant 10,269,762 - Lin , et al. | 2019-04-23 |
Microelectromechanical apparatus having a measuring range selector
Grant 10,203,252 - Hsu , et al. Feb | 2019-02-12 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20180366439 - Lin; Jing-Cheng ; et al. | 2018-12-20 |
Integrated fan-out packages and methods of forming the same
Grant 10,157,888 - Lin , et al. Dec | 2018-12-18 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,153,179 - Lin , et al. Dec | 2018-12-11 |
Carrier Warpage Control For Three Dimensional Integrated Circuit (3dic) Stacking
App 20180337065 - Lin; Jing-Cheng ; et al. | 2018-11-22 |
Integrated Fan-Out Structure with Rugged Interconnect
App 20180337137 - Lin; Shih Ting ; et al. | 2018-11-22 |
Microelectromechanical Apparatus Having A Measuring Range Selector
App 20180188115 - Hsu; Yu-Wen ; et al. | 2018-07-05 |
Laser System And Laser Flare Machining Method
App 20180117710 - LIN; Shih-Ting ; et al. | 2018-05-03 |
Solution for Reducing Poor Contact in InFO Package
App 20180096976 - Lin; Jing-Cheng ; et al. | 2018-04-05 |
Packages, packaging methods, and packaged semiconductor devices
Grant 9,847,315 - Lin , et al. December 19, 2 | 2017-12-19 |
Integrated Fan-Out Structure with Rugged Interconnect
App 20170352626 - Lin; Shih Ting ; et al. | 2017-12-07 |
Solution for reducing poor contact in info packages
Grant 9,831,224 - Lin , et al. November 28, 2 | 2017-11-28 |
3D packages and methods for forming the same
Grant 9,793,187 - Lin , et al. October 17, 2 | 2017-10-17 |
Rework Process and Tool Design for Semiconductor Package
App 20170125374 - Lin; Shih Ting ; et al. | 2017-05-04 |
Semiconductor devices and packaging methods thereof
Grant 9,514,988 - Lin , et al. December 6, 2 | 2016-12-06 |
Warpage control for flexible substrates
Grant 9,502,271 - Yu , et al. November 22, 2 | 2016-11-22 |
Method of three dimensional integrated circuit assembly
Grant 9,418,876 - Lin , et al. August 16, 2 | 2016-08-16 |
Structure and approach to prevent thin wafer crack
Grant 9,412,662 - Lin , et al. August 9, 2 | 2016-08-09 |
Manufacturing methods for micro-electromechanical system device having electrical insulating structure
Grant 9,382,112 - Hsu , et al. July 5, 2 | 2016-07-05 |
Solution For Reducing Poor Contact In Info Packages
App 20160181231 - Lin; Jing-Cheng ; et al. | 2016-06-23 |
Solution for reducing poor contact in info packages
Grant 9,281,297 - Lin , et al. March 8, 2 | 2016-03-08 |
Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
Grant 9,227,841 - Huang , et al. January 5, 2 | 2016-01-05 |
3D Packages and Methods for Forming the Same
App 20150357255 - Lin; Shih Ting ; et al. | 2015-12-10 |
Mirco-electro-mechanical System Pressure Sensor And Manufacturing Method Thereof
App 20150260593 - Hsu; Yu-Wen ; et al. | 2015-09-17 |
Solution For Reducing Poor Contact In Info Packages
App 20150255432 - Lin; Jing-Cheng ; et al. | 2015-09-10 |
Chip-on-wafer structures and methods for forming the same
Grant 9,123,643 - Lin , et al. September 1, 2 | 2015-09-01 |
3D packages and methods for forming the same
Grant 9,111,912 - Lin , et al. August 18, 2 | 2015-08-18 |
Structure and Approach to Prevent Thin Wafer Crack
App 20150214110 - Lin; Shih Ting ; et al. | 2015-07-30 |
Optical Fiber Laser And Anti-reflection Device, And Manufacturing Method Thereof
App 20150139592 - SU; HSIN-CHIA ; et al. | 2015-05-21 |
Chip-on-Wafer Structures and Methods for Forming the Same
App 20150130055 - Lin; Jing-Cheng ; et al. | 2015-05-14 |
Apparatus for generating pulse train with adjustable time interval
Grant 8,995,054 - Jhang , et al. March 31, 2 | 2015-03-31 |
Packages, Packaging Methods, and Packaged Semiconductor Devices
App 20150061149 - Lin; Shih Ting ; et al. | 2015-03-05 |
Chip-on-wafer structures and methods for forming the same
Grant 8,962,481 - Lin , et al. February 24, 2 | 2015-02-24 |
3D Packages and Methods for Forming the Same
App 20140353838 - Lin; Shih Ting ; et al. | 2014-12-04 |
Reading circuit of gyroscope
Grant 8,857,259 - Hsu , et al. October 14, 2 | 2014-10-14 |
Warpage Control for Flexible Substrates
App 20140302642 - Yu; Chen-Hua ; et al. | 2014-10-09 |
Polarization modulation device and laser system for wideband laser
Grant 8,855,152 - Jhang , et al. October 7, 2 | 2014-10-07 |
Apparatus for generating short-pulse laser using temporally modulated sideband gain
Grant 8,831,052 - Jhang , et al. September 9, 2 | 2014-09-09 |
Apparatus Integrating Microelectromechanical System Device With Circuit Chip And Methods For Fabricating The Same
App 20140248731 - HUANG; Chao Ta ; et al. | 2014-09-04 |
Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
Grant 8,809,972 - Huang , et al. August 19, 2 | 2014-08-19 |
Ultrafast laser generating system and method thereof
Grant 8,774,239 - Jhang , et al. July 8, 2 | 2014-07-08 |
Manufacturing Methods For Micro-electromechanical System Device Having Electrical Insulating Structure
App 20140186987 - HSU; YU WEN ; et al. | 2014-07-03 |
Apparatus For Generating Short-pulse Laser Using Temporally Modulated Sideband Gain
App 20140153597 - JHANG; Yao-Wun ; et al. | 2014-06-05 |
Apparatus For Generating Pulse Train With Adjustable Time Interval
App 20140153594 - JHANG; Yao-Wun ; et al. | 2014-06-05 |
Chip-on-Wafer Structures and Methods for Forming the Same
App 20140134802 - Lin; Jing-Cheng ; et al. | 2014-05-15 |
Warpage Control for Flexible Substrates
App 20140131897 - Yu; Chen-Hua ; et al. | 2014-05-15 |
Laser Device And Method For Generating Laser Light
App 20140133513 - LIN; Shih-Ting ; et al. | 2014-05-15 |
Micro-electromechanical system device having electrical insulating structure and manufacturing methods
Grant 8,695,426 - Hsu , et al. April 15, 2 | 2014-04-15 |
Carrier Warpage Control for Three Dimensional Integrated Circuit (3DIC) Stacking
App 20140057391 - Lin; Jing-Cheng ; et al. | 2014-02-27 |
Chip-on-Wafer structures and methods for forming the same
Grant 8,643,148 - Lin , et al. February 4, 2 | 2014-02-04 |
Laser Apparatus
App 20130329756 - LIN; SHIH TING ; et al. | 2013-12-12 |
Reading Circuit Of Gyroscope
App 20130160544 - Hsu; Yu-Wen ; et al. | 2013-06-27 |
Ultrafast Laser Generating System And Method Thereof
App 20130141781 - JHANG; YAO WUN ; et al. | 2013-06-06 |
Chip-on-Wafer Structures and Methods for Forming the Same
App 20130134559 - Lin; Jing-Cheng ; et al. | 2013-05-30 |
Laser Apparatus
App 20130107898 - LIN; SHIH TING ; et al. | 2013-05-02 |
Method of Three Dimensional Integrated Circuit Assembly
App 20130056865 - Lin; Jing-Cheng ; et al. | 2013-03-07 |
Fiber laser system
Grant 8,311,065 - Tsai , et al. November 13, 2 | 2012-11-13 |
Micro-electromechanical System Device Having Electrical Insulating Structure And Manufacturing Methods
App 20120160027 - HSU; Yu Wen ; et al. | 2012-06-28 |
Mode Locked Fiber Laser System
App 20120155499 - HUANG; Chien Ming ; et al. | 2012-06-21 |
Optical fiber structure with filtering thin film
Grant 8,204,350 - Lin , et al. June 19, 2 | 2012-06-19 |
Polarization Modulation Device And Laser System For Wideband Laser
App 20120148182 - JHANG; Yao Wun ; et al. | 2012-06-14 |
Fiber Laser System
App 20120147909 - Tsai; Tzong-Yow ; et al. | 2012-06-14 |
Loop Optical System And All-fiber Q-switched Laser Using The Same
App 20120069859 - Lin; Shih-Ting ; et al. | 2012-03-22 |
Apparatus Integrating Microelectromechanical System Device With Circuit Chip And Methods For Fabricating The Same
App 20120001276 - HUANG; Chao Ta ; et al. | 2012-01-05 |
Laser apparatus with all optical-fiber
Grant 7,944,954 - Jhang , et al. May 17, 2 | 2011-05-17 |
All-fiber color laser and light-illuminating method thereof
Grant 7,920,605 - Jhang , et al. April 5, 2 | 2011-04-05 |
Optical Fiber Structure With Filtering Thin Film
App 20110026892 - Lin; Shih-Ting ; et al. | 2011-02-03 |
Fiber laser device
Grant 7,773,640 - Hu , et al. August 10, 2 | 2010-08-10 |
Laser Apparatus With All Optical-fiber
App 20100166027 - Jhang; Yao-Wun ; et al. | 2010-07-01 |
All-fiber Color Laser And Light-illuminating Method Thereof
App 20100142564 - Jhang; Yao-Wun ; et al. | 2010-06-10 |
Fiber Laser Device
App 20100142563 - Hu; Chieh ; et al. | 2010-06-10 |
Laser Surgical Apparatus
App 20100137851 - Lin; Shih-Ting ; et al. | 2010-06-03 |
Cladding Grating And Fiber Side-coupling Apparatus Using The Same
App 20090285528 - CHANG; CHUN LIN ; et al. | 2009-11-19 |
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