Lin; Sean

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Sean.The latest application filed is for "design interfaces for assisted defect recognition systems".

Company Profile

2.6.7

Lin; Sean - Hopkins MN
Lin; Sean - Hsinchu TW
Lin; Sean - Watervliet NY
Lin; Sean - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Design Interfaces For Assisted Defect Recognition Systems App 20220108129 - Lin; Sean ; et al.	2022-04-07
Dual Robot Control Systems For Non-destructive Evaluation App 20210372952 - Schlecht; Joseph ; et al.	2021-12-02
Semiconductor chip holder Grant 10,879,098 - Liao , et al. December 29, 2	2020-12-29
Semiconductor Chip Holder App 20200090970 - Liao; Tsung-Jen ; et al.	2020-03-19
Solution based etching of titanium carbide and titanium nitride structures Grant 9,831,100 - Foster , et al. November 28, 2	2017-11-28
Wireless viewing of digital pathology specimens Grant 9,439,565 - Chai , et al. September 13, 2	2016-09-13
Particle removal with minimal etching of silicon-germanium App 20160181087 - Foster; John ; et al.	2016-06-23
Copper based nitride liner passivation layers for conductive copper structures Grant 9,318,436 - Zhang , et al. April 19, 2	2016-04-19
Solution Based Etching of Titanium Carbide and Titanium Nitride Structures App 20150371872 - Foster; John ; et al.	2015-12-24
Methods Of Forming Copper-based Nitride Liner/passivation Layers For Conductive Copper Structures And The Resulting Device App 20140361435 - Zhang; Xunyuan ; et al.	2014-12-11
Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device Grant 8,859,419 - Zhang , et al. October 14, 2	2014-10-14
Methods Of Forming Copper-based Nitride Liner/passivation Layers For Conductive Copper Structures And The Resulting Device App 20140217588 - Zhang; Xunyuan ; et al.	2014-08-07
Methods of forming conductive copper-based structures using a copper-based nitride seed layer without a barrier layer and the resulting device Grant 8,753,975 - Zhang , et al. June 17, 2	2014-06-17

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