Lin; Po-Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Po-Wen.The latest application filed is for "composition and solution for temporary bonding".
- Lin; Po-Wen - Kaohsiung TW
- Lin; Po Wen - Taipei TW
- Lin; Po-Wen - Chia-i TW
| Patent | Date |
|---|---|
| Composition and solution for temporary bonding Grant 10,633,569 - Chang , et al. | 2020-04-28 |
| Composition And Solution For Temporary Bonding App 20190292429 - Chang; Hsiu-Ming ; et al. | 2019-09-26 |
| Method Of Transferring Micro Device App 20190103274 - Chang; Hsiu-Ming ; et al. | 2019-04-04 |
| Useful Process For Screening Immune Response Modifier App 20170115278 - Lin; Yong Chi ; et al. | 2017-04-27 |
| Electromagnetic Shielding Film And Circuit Board With Electromagnetic Shielding Function App 20160286698 - Chang; Hsiu-Ming ; et al. | 2016-09-29 |
| Immunovir and Components, Immunovir A, B, C, D Utility and Useful Processes App 20160033480 - Lin; Yong Chi ; et al. | 2016-02-04 |
| Composite optical film Grant 8,786,951 - Wang , et al. July 22, 2 | 2014-07-22 |
| Composite Optical Film App 20120008212 - WANG; Hsung-Hsing ; et al. | 2012-01-12 |
| Optical Element App 20110058257 - LIN; PO-WEN ; et al. | 2011-03-10 |
| Composite Optical Film App 20100086743 - Wang; Hsung-Hsing ; et al. | 2010-04-08 |
| Polymerizable Composition And Its Uses App 20100028660 - YEH; Kun-Ming ; et al. | 2010-02-04 |
| Method for fabricating microelectronic product with attenuated bond pad corrosion Grant 6,849,533 - Chang , et al. February 1, 2 | 2005-02-01 |
| Method for fabricating microelectronic product with attenuated bond pad corrosion App 20040147105 - Chang, Chih-Kung ; et al. | 2004-07-29 |
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