LIN; Ping-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIN; Ping-Hao.The latest application filed is for "photosensor having gate-all-around structure and method for forming the photosensor".
- LIN; Ping-Hao - Hsinchu TW
- LIN; Ping-Hao - Tainan City TW
- Lin; Ping-Hao - Tainan TW
- Lin; Ping-Hao - Taichung TW
| Patent | Date |
|---|---|
| Photosensor Having Gate-all-around Structure And Method For Forming The Photosensor App 20220271076 - CHANG; P.C. ; et al. | 2022-08-25 |
| Pixel Array And Method For Manufacturing The Same App 20220165771 - FANG; Chun-Lin ; et al. | 2022-05-26 |
| Cmos Image Sensor Having Indented Photodiode Structure App 20220077206 - Wei; Chia-Yu ; et al. | 2022-03-10 |
| Semiconductor Device, Semiconductor Image Sensor, And Method Of Manufacturing The Same App 20220020787 - HUANG; Li-Wen ; et al. | 2022-01-20 |
| CMOS image sensor having indented photodiode structure Grant 11,183,523 - Wei , et al. November 23, 2 | 2021-11-23 |
| Protection Structures for Bonded Wafers App 20210242080 - Weng; Ssu-Chiang ; et al. | 2021-08-05 |
| Protection structures for bonded wafers Grant 11,004,733 - Weng , et al. May 11, 2 | 2021-05-11 |
| Embedded Light Shield Structure For Cmos Image Sensor App 20210098519 - Hsu; Shih-Hsun ; et al. | 2021-04-01 |
| CMOS image sensor having indented photodiode structure Grant 10,790,321 - Wei , et al. September 29, 2 | 2020-09-29 |
| Cmos Image Sensor Having Indented Photodiode Structure App 20200058689 - Wei; Chia-Yu ; et al. | 2020-02-20 |
| Protection Structures for Bonded Wafers App 20200006128 - Weng; Ssu-Chiang ; et al. | 2020-01-02 |
| Method Of Forming Semiconductor Structure App 20190148146 - Lin; Ping-Hao ; et al. | 2019-05-16 |
| Cmos Image Sensor Having Indented Photodiode Structure App 20190103428 - Wei; Chia-Yu ; et al. | 2019-04-04 |
| Heterostructure device Grant 10,204,998 - Yang , et al. Feb | 2019-02-12 |
| Through Substrate Via Structure For Noise Reduction App 20170358493 - FANG; Chun-Lin ; et al. | 2017-12-14 |
| Through substrate via structure for noise reduction Grant 9,842,774 - Fang , et al. December 12, 2 | 2017-12-12 |
| Heterostructure Device App 20170117376 - Yang; Ya-Yu ; et al. | 2017-04-27 |
| Heterostructure field-effect transistor Grant 9,577,048 - Yang , et al. February 21, 2 | 2017-02-21 |
| Integrated circuit and fabricating method thereof Grant 9,082,617 - Su , et al. July 14, 2 | 2015-07-14 |
| Integrated Circuit And Fabricating Method Thereof App 20150171069 - SU; Po-Yuan ; et al. | 2015-06-18 |
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