Lin; Peng Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Peng Cheng.The latest application filed is for "laser encapsulation of multiple dissimilar devices on a substrate".

Company Profile

0.13.7

Lin; Peng Cheng - Cupertino CA
Lin; Peng Cheng - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser Encapsulation Of Multiple Dissimilar Devices On A Substrate App 20140177188 - Stephanou; Philip Jason ; et al.	2014-06-26
Wraparound assembly for combination touch, handwriting and fingerprint sensor Grant 8,724,038 - Ganapathi , et al. May 13, 2	2014-05-13
Metal Thin Shield On Electrical Device App 20130032385 - Lin; Peng Cheng ; et al.	2013-02-07
Wraparound Assembly For Combination Touch, Handwriting And Fingerprint Sensor App 20120092350 - Ganapathi; Srinivasan Kodaganallur ; et al.	2012-04-19
Flex Design and Attach Method for Reducing Display Panel Periphery App 20110254758 - Lin; Peng Cheng ; et al.	2011-10-20
System and method of preventing damage to metal traces of flexible printed circuits Grant 7,643,305 - Lin January 5, 2	2010-01-05
Groove On Cover Plate Or Substrate App 20090323170 - Lin; Peng Cheng	2009-12-31
System And Method Of Preventing Damage To Metal Traces Of Flexible Printed Circuits App 20090231816 - Lin; Peng Cheng	2009-09-17
Device and method for reducing thermal cycling in a semiconductor package Grant 5,901,043 - Lin , et al. May 4, 1	1999-05-04
Electronic system circuit package directly supporting components on isolated subsegments Grant 5,504,370 - Lin , et al. April 2, 1	1996-04-02
Stacked multi-chip modules and method of manufacturing Grant 5,502,289 - Takiar , et al. March 26, 1	1996-03-26
Stacked multi-chip modules and method of manufacturing Grant 5,495,398 - Takiar , et al. February 27, 1	1996-02-27
Electronic package for isolated circuits Grant 5,491,360 - Lin February 13, 1	1996-02-13
Lead frame including an inductor or other such magnetic component Grant 5,428,245 - Lin , et al. June 27, 1	1995-06-27
Stacked multi-chip modules and method of manufacturing Grant 5,422,435 - Takiar , et al. June 6, 1	1995-06-06
Method of placing a semiconductor with die collet having cavity wall recess Grant 5,415,331 - Lin May 16, 1	1995-05-16
Die collet with cavity wall recess Grant 5,348,316 - Lin September 20, 1	1994-09-20
Device and method for reducing thermal cycling in a semiconductor package Grant 5,339,216 - Lin , et al. August 16, 1	1994-08-16

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