Lin; Pang-Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Pang-Chun.The latest application filed is for "fabrication method of packaging substrate".

Company Profile

0.19.17

Lin; Pang-Chun - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication method of packaging substrate Grant 9,455,159 - Wang , et al. September 27, 2	2016-09-27
Package on package structure and fabrication method thereof Grant 9,362,217 - Lin , et al. June 7, 2	2016-06-07
Semiconductor package and fabrication method thereof Grant 9,318,354 - Lin , et al. April 19, 2	2016-04-19
Fabrication Method Of Packaging Substrate App 20160013074 - Wang; Wei-Ping ; et al.	2016-01-14
Fabrication method of semiconductor package having electrical connecting structures Grant 9,177,837 - Lin , et al. November 3, 2	2015-11-03
Packaging substrate and fabrication method thereof Grant 9,171,741 - Wang , et al. October 27, 2	2015-10-27
Method of fabricating semiconductor package Grant 9,029,203 - Lin , et al. May 12, 2	2015-05-12
Package On Package Structure And Fabrication Method Thereof App 20150091150 - Lin; Pang-Chun ; et al.	2015-04-02
Semiconductor package structure Grant 8,981,575 - Lin , et al. March 17, 2	2015-03-17
Package structure Grant 8,873,244 - Lin , et al. October 28, 2	2014-10-28
Semiconductor Package And Fabrication Method Thereof App 20140284803 - Lin; Pang-Chun ; et al.	2014-09-25
Packaging Substrate, Semiconductor Package And Fabrication Methods Thereof App 20140239475 - Lin; Pang-Chun ; et al.	2014-08-28
Fabrication Method Of Semiconductor Package Having Electrical Connecting Structures App 20140206146 - Lin; Pang-Chun ; et al.	2014-07-24
Semiconductor package having electrical connecting structures and fabrication method thereof Grant 8,716,861 - Lin , et al. May 6, 2	2014-05-06
Method Of Fabricating Semiconductor Package App 20130344661 - Lin; Pang-Chun ; et al.	2013-12-26
Semiconductor package and method of fabricating the same Grant 8,525,336 - Lin , et al. September 3, 2	2013-09-03
Semiconductor Package Structure App 20130200508 - Lin; Pang-Chun ; et al.	2013-08-08
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof App 20130161802 - Lin; Pang-Chun ; et al.	2013-06-27
Packaging Substrate And Fabrication Method Thereof App 20130115738 - Wang; Wei-Ping ; et al.	2013-05-09
Semiconductor Package And Method Of Fabricating The Same App 20130093086 - Lin; Pang-Chun ; et al.	2013-04-18
Semiconductor package structure Grant 8,421,199 - Lin , et al. April 16, 2	2013-04-16
Semiconductor package having electrical connecting structures and fabrication method thereof Grant 8,390,118 - Lin , et al. March 5, 2	2013-03-05
Semiconductor Carrier, Package And Fabrication Method Thereof App 20130009311 - Lin; Pang-Chun ; et al.	2013-01-10
Fabrication method of semiconductor package structure Grant 8,304,268 - Lin , et al. November 6, 2	2012-11-06
Semiconductor Package Structure App 20110156227 - Lin; Pang-Chun ; et al.	2011-06-30
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof App 20110156252 - Lin; Pang-Chun ; et al.	2011-06-30
Fabrication Method Of Semiconductor Package Structure App 20110159643 - Lin; Pang-Chun ; et al.	2011-06-30
Package Structure App 20110157851 - Lin; Pang-Chun ; et al.	2011-06-30
Package structure fabrication method Grant 7,934,313 - Lin , et al. May 3, 2	2011-05-03

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