LIN; Meng-Liang
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIN; Meng-Liang.The latest application filed is for "package structure with fan-out feature".
- LIN; Meng-Liang - Hsinchu TW
- Lin; Meng-Liang - Hsin-Chu TW
| Patent | Date |
|---|---|
| Package Structure With Fan-out Feature App 20220310468 - LIN; Meng-Liang ; et al. | 2022-09-29 |
| Semiconductor devices and methods of manufacturing Grant 11,430,776 - Wu , et al. August 30, 2 | 2022-08-30 |
| Structure and formation method of package structure with fan-out structure Grant 11,430,739 - Tsai , et al. August 30, 2 | 2022-08-30 |
| Fan-out package with cavity substrate Grant 11,380,666 - Tsai , et al. July 5, 2 | 2022-07-05 |
| Dual-sided Routing in 3D SiP Structure App 20220199541 - Tsai; Po-Hao ; et al. | 2022-06-23 |
| Structure and formation method of chip package with fan-out feature Grant 11,362,010 - Lin , et al. June 14, 2 | 2022-06-14 |
| Dual-sided routing in 3D SiP structure Grant 11,322,447 - Tsai , et al. May 3, 2 | 2022-05-03 |
| Formation Method Of Chip Package With Fan-out Feature App 20220108956 - TSAI; Po-Hao ; et al. | 2022-04-07 |
| Structure and formation method of chip package with fan-out feature Grant 11,239,173 - Tsai , et al. February 1, 2 | 2022-02-01 |
| Semiconductor Devices And Methods Of Manufacturing App 20210391317 - Wu; Yi-Wen ; et al. | 2021-12-16 |
| Method For Forming Package Structure App 20210384125 - TSAI; Po-Hao ; et al. | 2021-12-09 |
| Fan-Out Package with Controllable Standoff App 20210351118 - Tsai; Po-Hao ; et al. | 2021-11-11 |
| Fan-out packages and methods of forming the same Grant 11,164,754 - Tsai , et al. November 2, 2 | 2021-11-02 |
| Package structure with dam structure and method for forming the same Grant 11,101,214 - Tsai , et al. August 24, 2 | 2021-08-24 |
| Semiconductor Package And Method Of Manufacturing The Same App 20210242117 - Hung; Shih-Ting ; et al. | 2021-08-05 |
| Fan-out package with controllable standoff Grant 11,075,151 - Tsai , et al. July 27, 2 | 2021-07-27 |
| Structure And Formation Method Of Chip Package With Fan-out Feature App 20210118757 - LIN; Meng-Liang ; et al. | 2021-04-22 |
| Dual-sided Routing in 3D SiP Structure App 20210050295 - Tsai; Po-Hao ; et al. | 2021-02-18 |
| Fan-Out Package with Cavity Substrate App 20210035966 - Tsai; Po-Hao ; et al. | 2021-02-04 |
| Integrated Circuit Package and Method App 20210013053 - Tsai; Po-Hao ; et al. | 2021-01-14 |
| Fan-out package with cavity substrate Grant 10,804,254 - Tsai , et al. October 13, 2 | 2020-10-13 |
| Structure And Formation Method Of Chip Package With Fan-out Feature App 20200312773 - TSAI; Po-Hao ; et al. | 2020-10-01 |
| Integrated circuit package and method Grant 10,790,162 - Tsai , et al. September 29, 2 | 2020-09-29 |
| Package Structure And Method For Forming The Same App 20200211962 - TSAI; Po-Hao ; et al. | 2020-07-02 |
| Structure And Formation Method Of Package Structure With Fan-out Structure App 20200135653 - TSAI; Po-Hao ; et al. | 2020-04-30 |
| Fan-Out Packages And Methods Of Forming The Same App 20200105544 - Tsai; Po-Hao ; et al. | 2020-04-02 |
| Integrated Circuit Package and Method App 20200105663 - Tsai; Po-Hao ; et al. | 2020-04-02 |
| Fan-Out Package with Cavity Substrate App 20200006307 - Tsai; Po-Hao ; et al. | 2020-01-02 |
| Chip Package Structure With Molding Layer And Method For Forming The Same App 20200006176 - TSAI; Po-Hao ; et al. | 2020-01-02 |
| Fan-out Package with Controllable Standoff App 20200006214 - Tsai; Po-Hao ; et al. | 2020-01-02 |
| Methods of forming multiple conductive features in semiconductor devices in a same formation process Grant 10,446,522 - Lin , et al. Oc | 2019-10-15 |
| Semiconductor Devices And Method Of Forming The Same App 20160307862 - Lin; Meng-Liang ; et al. | 2016-10-20 |
| Bump structures for semiconductor package Grant 9,343,419 - Yu , et al. May 17, 2 | 2016-05-17 |
| Bump Structures For Semiconductor Package App 20140167254 - Yu; Chen-Hua ; et al. | 2014-06-19 |
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