Lin; Li-Jen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Li-Jen.The latest application filed is for "fine-pitch pillar bump layout structure on chip".
- Lin; Li-Jen - HsinChu TW
- Lin; Li-Jen - HsinChu City TW
- Lin; Li-Jen - Kaohsiung TW
| Patent | Date |
|---|---|
| Semiconductor device and method of forming a dual UBM structure for lead free bump connections Grant 9,711,438 - Lin , et al. July 18, 2 | 2017-07-18 |
| Fine-pitch Pillar Bump Layout Structure On Chip App 20150048499 - TAI; Kuo-Jui ; et al. | 2015-02-19 |
| Semiconductor Device and Method of Forming a Dual UBM Structure for Lead Free Bump Connections App 20140264850 - Lin; Li-Jen ; et al. | 2014-09-18 |
| Semiconductor device and method of forming a dual UBM structure for lead free bump connections Grant 8,759,209 - Lin , et al. June 24, 2 | 2014-06-24 |
| Electric scooter Grant D602,815 - Lin , et al. October 27, 2 | 2009-10-27 |
| Motorcycle Grant D599,710 - Chen , et al. September 8, 2 | 2009-09-08 |
| NCAGE Code | 5A3F6 | LIN LI JEN!DBA OHANA PACIFIC BUILDER |
| CAGE Code | 5A3F6 | LIN, LI JEN OHANA PACIFIC BUILDER |
| DUNS | 829165120 | LIN, LI JEN |
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