Lin; Kuo-Ting

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Kuo-Ting.The latest application filed is for "package structure and manufacturing method thereof".

Company Profile

2.10.10

Lin; Kuo-Ting - Hsinchu County TW
Lin; Kuo-Ting - Hsinchu TW
Lin; Kuo-Ting - Taipei County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Structure And Manufacturing Method Thereof App 20190189494 - Chung; Hsing-Te ; et al.	2019-06-20
Package structure and manufacturing method thereof Grant 10,304,716 - Chung , et al.	2019-05-28
Method of fabricating packaging layer of fan-out chip package Grant 10,121,736 - Lin , et al. November 6, 2	2018-11-06
Method Of Fabricating Packaging Layer Of Fan-out Chip Package App 20180145015 - Lin; Kuo-Ting ; et al.	2018-05-24
Fan-out chip package with dummy pattern and its fabricating method Grant 9,899,307 - Lin , et al. February 20, 2	2018-02-20
Fan-out multi-chip package with plurality of chips stacked in staggered stack arrangement Grant 9,837,384 - Chang , et al. December 5, 2	2017-12-05
Manufacturing method of package structure Grant 9,831,219 - Chuang , et al. November 28, 2	2017-11-28
Manufacturing Method Of Package Structure App 20170309597 - Chuang; Yong-Cheng ; et al.	2017-10-26
Thin fan-out multi-chip stacked packages and the method for manufacturing the same Grant 9,761,568 - Fang , et al. September 12, 2	2017-09-12
Multi-chip package having encapsulation body to replace substrate core Grant 9,716,079 - Chang , et al. July 25, 2	2017-07-25
Fan-out Multi-chip Package And Its Fabricating Method App 20170194293 - CHANG; CHIA-WEI ; et al.	2017-07-06
Fan-out Chip Package And Its Fabricating Method App 20170186678 - LIN; KUO-TING ; et al.	2017-06-29
Thin Fan-out Multi-chip Stacked Packages And The Method For Manufacturing The Same App 20170186737 - FANG; Li-Chih ; et al.	2017-06-29
Structure And Method Of Fan-out Stacked Packages App 20170186711 - FANG; Li-Chih ; et al.	2017-06-29
Method of forming package structure with dummy pads for bonding Grant 9,673,178 - Yuan , et al. June 6, 2	2017-06-06
Package structure and manufacturing method thereof Grant 9,659,911 - Chang , et al. May 23, 2	2017-05-23
Package Structure And Manufacturing Method Thereof App 20170110439 - Yuan; Chia-Hsiang ; et al.	2017-04-20
Multi-chip Package Having Encapsulation Body To Replace Substrate Core App 20170033084 - Chang; Chia-Wei ; et al.	2017-02-02
Communication protocol methods Grant 8,126,100 - Lin , et al. February 28, 2	2012-02-28
Communication Protocol Methods App 20090041133 - Lin; Kuo-Ting ; et al.	2009-02-12

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