Lin; Kuang Hann

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Kuang Hann.The latest application filed is for "semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers".

Company Profile

0.7.5

Lin; Kuang Hann - Taipei N/A TW

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Patent Activity

Patent	Date
Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers Grant 8,796,840 - Chiang , et al. August 5, 2	2014-08-05
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Grant 8,252,633 - Chiang , et al. August 28, 2	2012-08-28
Semiconductor Assembly That Includes A Power Semiconductor Die Located On A Cell Defined By First And Second Patterned Polymer Layers App 20120168932 - Chiang; Wan-Lan ; et al.	2012-07-05
Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer Grant 8,138,597 - Chiang , et al. March 20, 2	2012-03-20
Subassembly That Includes A Power Semiconductor Die And A Heat Sink Having An Exposed Surface Portion Thereof App 20110171784 - Chiang; Wan-Lan ; et al.	2011-07-14
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Grant 7,915,728 - Chiang , et al. March 29, 2	2011-03-29
Semiconductor Assembly That Includes A Power Semiconductor Die Located On A Cell Defined By First And Second Patterned Polymer Layers App 20110049700 - Chiang; Wan-Lan ; et al.	2011-03-03
Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers Grant 7,838,985 - Chiang , et al. November 23, 2	2010-11-23
Subassembly that includes a power semiconductor die and a heat sink and method of forming same App 20090014863 - Chiang; Wan-Lan ; et al.	2009-01-15
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof App 20090014862 - Chiang; Wan-Lan ; et al.	2009-01-15
Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires Grant 6,927,094 - Chen , et al. August 9, 2	2005-08-09

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