LIN; Kevin Lai

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIN; Kevin Lai.The latest application filed is for "metal lines patterned by bottom-up fill metallization for advanced integrated circuit structure fabrication".

Company Profile

4.1.7

LIN; Kevin Lai - Beaverton OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal Lines Patterned By Bottom-up Fill Metallization For Advanced Integrated Circuit Structure Fabrication App 20220199516 - CHEBIAM; Ramanan V. ; et al.	2022-06-23
Via Connections For Staggered Interconnect Lines App 20220093505 - JEZEWSKI; Christopher J. ; et al.	2022-03-24
Place-and-route Resistance And Capacitance Optimization Using Multi-height Interconnect Trenches And Air Gap Dielectrics App 20210043567 - ANDERS; Mark ; et al.	2021-02-11
Multi-height Interconnect Trenches For Resistance And Capacitance Optimization App 20210043500 - LIN; Kevin Lai ; et al.	2021-02-11
Helmet Structures For Semiconductor Interconnects App 20210043565 - Lin; Kevin Lai ; et al.	2021-02-11
Staggered Lines For Interconnect Performance Improvement And Processes For Forming Such App 20200411427 - LIN; Kevin Lai ; et al.	2020-12-31
Integrating MEMS structures with interconnects and vias Grant 10,457,548 - Lin , et al. Oc	2019-10-29
Integrating Mems Structures With Interconnects And Vias App 20180086627 - LIN; Kevin LAI ; et al.	2018-03-29

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