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name:-0.014730930328369
name:-0.0484299659729
name:-0.0040309429168701
Lin; Keng-Jen Patent Filings

Lin; Keng-Jen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Keng-Jen.The latest application filed is for "semiconductor device and method for fabricating the same".

Company Profile
4.15.11
  • Lin; Keng-Jen - Kaohsiung City TW
  • Lin; Keng-Jen - Kaohsiung TW
  • Lin; Keng-Jen - Taipei N/A TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device And Method For Fabricating The Same
App 20220069127 - Chen; Chun-Yu ;   et al.
2022-03-03
Method for processing semiconductor device
Grant 10,460,925 - Ting , et al. Oc
2019-10-29
Semiconductor device and manufacturing method thereof
Grant 10,366,991 - Ting , et al. July 30, 2
2019-07-30
Semiconductor Device And Manufacturing Method Thereof
App 20190221562 - Ting; Hsu ;   et al.
2019-07-18
Method for forming semiconductor device
Grant 10,347,640 - Tsai , et al. July 9, 2
2019-07-09
Method For Processing Semiconductor Device
App 20190006172 - Ting; Hsu ;   et al.
2019-01-03
Method for forming a semiconductor structure
Grant 10,043,888 - Lin , et al. August 7, 2
2018-08-07
Method For Forming A Semiconductor Structure
App 20180182862 - Lin; Yi-Hui ;   et al.
2018-06-28
Method for filling gaps of semiconductor device and semiconductor device formed by the same
Grant 9,847,247 - Huang , et al. December 19, 2
2017-12-19
FinFET device on silicon-on-insulator and method of forming the same
Grant 9,793,174 - Huang , et al. October 17, 2
2017-10-17
Method For Filling Gaps Of Semiconductor Device And Semiconductor Device Formed By The Same
App 20170243780 - Huang; Ping-Wei ;   et al.
2017-08-24
Method for filling gaps of semiconductor device and semiconductor device formed by the same
Grant 9,685,319 - Huang , et al. June 20, 2
2017-06-20
Gate and gate forming process
Grant 9,570,578 - Lin , et al. February 14, 2
2017-02-14
Method of forming patterned hard mask layer
Grant 9,543,408 - Lin , et al. January 10, 2
2017-01-10
Method For Filling Gaps Of Semiconductor Device And Semiconductor Device Formed By The Same
App 20160365245 - Huang; Ping-Wei ;   et al.
2016-12-15
Method for forming a stacked layer structure
Grant 9,418,853 - Wang , et al. August 16, 2
2016-08-16
Gate And Gate Forming Process
App 20160233092 - Lin; Keng-Jen ;   et al.
2016-08-11
Manufacturing method of semiconductor structure
Grant 9,356,125 - Hsiao , et al. May 31, 2
2016-05-31
Method for fabricating shallow trench isolation structure
Grant 9,130,014 - Lin , et al. September 8, 2
2015-09-08
Method for manufacturing shallow trench isolation
Grant 9,117,878 - Lin , et al. August 25, 2
2015-08-25
Method For Fabricating Shallow Trench Isolation Structure
App 20150140780 - Lin; Keng-Jen ;   et al.
2015-05-21
Method For Forming Isolation Structure
App 20140213034 - Chang; Chia-Lung ;   et al.
2014-07-31
Method For Manufacturing Semiconductor Structure
App 20140162431 - Lin; Keng-Jen ;   et al.
2014-06-12
Use of exfoliated clay nanoplatelets and method for encapsulating cations
Grant 8,513,519 - Lin , et al. August 20, 2
2013-08-20
Use of exfoliated clay nanoplatelets and method for encapsulating cations
App 20110031429 - Lin; King-Fu ;   et al.
2011-02-10

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