| Patent | Date |
|---|
Metal oxide layered structure and methods of forming the same
Grant 11,443,957 - Lin , et al. September 13, 2 | 2022-09-13 |
Atomic Layer Deposition Device
App 20220282373 - LIN; JING-CHENG | 2022-09-08 |
Shower Head Assembly And Atomic Layer Deposition Device
App 20220282376 - LIN; JING-CHENG ; et al. | 2022-09-08 |
Shielding Mechanism And Substrate-processing Device With The Same
App 20220282378 - LIN; JING-CHENG ; et al. | 2022-09-08 |
Laser Lift-off Method For Separating Substrate And Semiconductor-epitaxial Structure
App 20220285218 - LIN; JING-CHENG ; et al. | 2022-09-08 |
Bonded Semiconductor Structures
App 20220277954 - LIN; Jing-Cheng | 2022-09-01 |
Atomic layer deposition equipment capable of reducing precursor deposition and atomic layer deposition process method using the same
Grant 11,427,910 - Lin , et al. August 30, 2 | 2022-08-30 |
Wafer-holding Device And Thin-film-deposition Equipment Using The Same
App 20220270913 - LIN; JING-CHENG ; et al. | 2022-08-25 |
Wafer-holding Device And Deposition Equipment Using The Same
App 20220267901 - LIN; JING-CHENG | 2022-08-25 |
Three dimensional integrated circuit (3DIC) with support structures
Grant 11,424,194 - Wu , et al. August 23, 2 | 2022-08-23 |
Package structures and methods of forming the same
Grant 11,417,580 - Yu , et al. August 16, 2 | 2022-08-16 |
Atomic layer deposition equipment and process method
Grant 11,401,608 - Lin , et al. August 2, 2 | 2022-08-02 |
Dummy structure of stacked and bonded semiconductor device
Grant 11,393,783 - Cheng , et al. July 19, 2 | 2022-07-19 |
Semiconductor device and method of manufacture
Grant 11,393,770 - Lin , et al. July 19, 2 | 2022-07-19 |
Wafer Support And Thin-film Deposition Apparatus Using The Same
App 20220220615 - LIN; JING-CHENG ; et al. | 2022-07-14 |
Semiconductor device and method of manufacture
Grant 11,387,217 - Lin , et al. July 12, 2 | 2022-07-12 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20220199465 - Wu; Chih-Wei ; et al. | 2022-06-23 |
Manufacturing Method And Manufacturing Machine For Reducing Non-radiative Recombination Of Micro Led
App 20220199675 - LIN; JING-CHENG | 2022-06-23 |
Semiconductor Component With Oxidized Aluminum Nitride Film And Manufacturing Method Thereof
App 20220199860 - LIN; JING-CHENG | 2022-06-23 |
Package Structure
App 20220189920 - Liao; Shu-Hang ; et al. | 2022-06-16 |
Semiconductor package
Grant 11,362,046 - Lin , et al. June 14, 2 | 2022-06-14 |
Atomic Layer Deposition Equipment And Process Method
App 20220178022 - LIN; JING-CHENG ; et al. | 2022-06-09 |
Wafer Fixing Mechanism And Wafer Pre-cleaning Machine Using The Wafer Fixing Mechanism
App 20220178021 - YI; CHING-LIANG ; et al. | 2022-06-09 |
Wafer Holder For Generating Stable Bias Voltage And Thin Film Deposition Equipment Using The Same
App 20220181195 - LIN; JING-CHENG ; et al. | 2022-06-09 |
Wafer Fixing Mechanism And Wafer Pre-cleaning Machine Using The Wafer Fixing Mechanism
App 20220181190 - LIN; JING-CHENG ; et al. | 2022-06-09 |
Chip Package Structure With Conductive Shielding Film
App 20220181305 - YU; Chen-Hua ; et al. | 2022-06-09 |
Non-vertical through-via in package
Grant 11,355,406 - Huang , et al. June 7, 2 | 2022-06-07 |
Powder Atomic Layer Deposition Apparatus With Special Cover Lid
App 20220162750 - LIN; JING-CHENG ; et al. | 2022-05-26 |
Substrate Transfer System With Tray Aligner
App 20220165600 - LIN; JING-CHENG ; et al. | 2022-05-26 |
Raised Via for Terminal Connections on Different Planes
App 20220165611 - Yu; Chen-Hua ; et al. | 2022-05-26 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20220157695 - Cheng; Li-Hui ; et al. | 2022-05-19 |
Atomic layer deposition equipment and process method
Grant 11,332,826 - Lin , et al. May 17, 2 | 2022-05-17 |
Bonded semiconductor structures
Grant 11,335,553 - Lin May 17, 2 | 2022-05-17 |
Multi-chip package and method of formation
Grant 11,335,658 - Lin , et al. May 17, 2 | 2022-05-17 |
Powder Atomic Layer Deposition Apparatus For Blowing Powders
App 20220136103 - LIN; JING-CHENG ; et al. | 2022-05-05 |
Substrate transfer system with tray aligner
Grant 11,322,380 - Lin , et al. May 3, 2 | 2022-05-03 |
Atomic Layer Deposition Equipment Capable Of Reducing Precursor Deposition And Atomic Layer Deposition Process Method Using The Same
App 20220119945 - LIN; JING-CHENG ; et al. | 2022-04-21 |
Alignment Mechanism And Alignment Method Of Bonding Machine
App 20220122868 - LIN; JING-CHENG ; et al. | 2022-04-21 |
Atomic Layer Deposition Equipment And Process Method
App 20220119946 - LIN; JING-CHENG ; et al. | 2022-04-21 |
Atomic Layer Deposition Apparatus For Coating On Fine Powders
App 20220106684 - LIN; JING-CHENG ; et al. | 2022-04-07 |
Atomic Layer Deposition Apparatus For Powders
App 20220106682 - LIN; JING-CHENG ; et al. | 2022-04-07 |
Detachable Atomic Layer Deposition Apparatus For Powders
App 20220106686 - LIN; JING-CHENG ; et al. | 2022-04-07 |
Atomic Layer Deposition Apparatus For Coating On Fine Powders
App 20220106685 - LIN; JING-CHENG ; et al. | 2022-04-07 |
Through-substrate vias with improved connections
Grant 11,296,011 - Lin , et al. April 5, 2 | 2022-04-05 |
Integrated fan-out structure with rugged interconnect
Grant 11,282,793 - Lin , et al. March 22, 2 | 2022-03-22 |
Package structure and method of manufacturing the same
Grant 11,270,976 - Liao , et al. March 8, 2 | 2022-03-08 |
Wafer Support And Equipment For Thin-film Deposition Or Pre-cleaning Using The Same
App 20220068612 - LIN; JING-CHENG ; et al. | 2022-03-03 |
Chip package structure with seal ring structure
Grant 11,264,363 - Yu , et al. March 1, 2 | 2022-03-01 |
Method Of Forming Package Structure
App 20220059515 - LIN; Jing-Cheng ; et al. | 2022-02-24 |
Integrated fan-out packages and methods of forming the same
Grant 11,257,715 - Wu , et al. February 22, 2 | 2022-02-22 |
Raised via for terminal connections on different planes
Grant 11,251,071 - Yu , et al. February 15, 2 | 2022-02-15 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 11,239,138 - Cheng , et al. February 1, 2 | 2022-02-01 |
Molding wafer chamber
Grant 11,205,579 - Lin , et al. December 21, 2 | 2021-12-21 |
Semiconductor device and method of manufacture
Grant 11,205,615 - Tsou , et al. December 21, 2 | 2021-12-21 |
Three dimensional integrated circuits stacking approach
Grant 11,201,135 - Lin , et al. December 14, 2 | 2021-12-14 |
Integrated circuit structure having dies with connectors of different sizes
Grant 11,183,473 - Jeng , et al. November 23, 2 | 2021-11-23 |
Underfill Structure for Semiconductor Packages and Methods of Forming the Same
App 20210358825 - Chen; Yu-Wei ; et al. | 2021-11-18 |
Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination
App 20210351173 - Lin; Jing-Cheng ; et al. | 2021-11-11 |
Method of forming package structure
Grant 11,164,852 - Lin , et al. November 2, 2 | 2021-11-02 |
Method of forming contact holes in a fan out package
Grant 11,164,829 - Hsu , et al. November 2, 2 | 2021-11-02 |
Semiconductor Device And Method
App 20210335701 - Lin; Jing-Cheng ; et al. | 2021-10-28 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 11,158,588 - Tsai , et al. October 26, 2 | 2021-10-26 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 11,158,587 - Tsai , et al. October 26, 2 | 2021-10-26 |
InFO-POP structures with TIVs Having Cavities
App 20210327816 - Lin; Jing-Cheng ; et al. | 2021-10-21 |
Package Structures and Methods of Forming the Same
App 20210327778 - Yu; Chen-Hua ; et al. | 2021-10-21 |
Method of forming contact holes in a fan out package
Grant 11,152,316 - Hsu , et al. October 19, 2 | 2021-10-19 |
Semiconductor package
Grant 11,139,285 - Tsou , et al. October 5, 2 | 2021-10-05 |
Chip packages and methods of manufacture thereof
Grant 11,133,286 - Wu , et al. September 28, 2 | 2021-09-28 |
Integrated circuit stacking approach
Grant 11,121,118 - Lin , et al. September 14, 2 | 2021-09-14 |
Semiconductor package structure with twinned copper
Grant 11,114,405 - Chang , et al. September 7, 2 | 2021-09-07 |
Semiconductor packages and methods of forming the same
Grant 11,107,798 - Yu , et al. August 31, 2 | 2021-08-31 |
Method And Device For Decreasing Generation Of Surface Oxide Of Aluminum Nitride
App 20210262082 - LIN; JING-CHENG ; et al. | 2021-08-26 |
Package-on-package structure and manufacturing method thereof
Grant 11,101,252 - Lin , et al. August 24, 2 | 2021-08-24 |
Method Of Manufacturing Semiconductor Device
App 20210257326 - LIN; JING-CHENG ; et al. | 2021-08-19 |
Semiconductor package
Grant 11,094,639 - Lin , et al. August 17, 2 | 2021-08-17 |
Integrated circuit structure and method for reducing polymer layer delamination
Grant 11,081,475 - Lin , et al. August 3, 2 | 2021-08-03 |
InFO-POP structures with TIVs having cavities
Grant 11,075,168 - Lin , et al. July 27, 2 | 2021-07-27 |
Underfill structure for semiconductor packages and methods of forming the same
Grant 11,075,133 - Chen , et al. July 27, 2 | 2021-07-27 |
Methods and structures for packaging semiconductor dies
Grant 11,069,653 - Mao , et al. July 20, 2 | 2021-07-20 |
Semiconductor package and manufacturing method thereof
Grant 11,069,673 - Cheng , et al. July 20, 2 | 2021-07-20 |
Semiconductor Device And Manufacturing Method Of The Same
App 20210217736 - LIN; JING-CHENG ; et al. | 2021-07-15 |
Semiconductor device
Grant 11,062,987 - Lin , et al. July 13, 2 | 2021-07-13 |
Underfill Structure for Semiconductor Packages and Methods of Forming the Same
App 20210210400 - Chen; Yu-Wei ; et al. | 2021-07-08 |
Semiconductor Assemblies Including Combination Memory And Methods Of Manufacturing The Same
App 20210210500 - Lin; Jing Cheng | 2021-07-08 |
Package Structure and Method
App 20210210399 - Lin; Jing-Cheng ; et al. | 2021-07-08 |
Semiconductor device and method of manufacture
Grant 11,056,471 - Lin , et al. July 6, 2 | 2021-07-06 |
Thermal dissipation through seal rings in 3DIC structure
Grant 11,037,854 - Lin , et al. June 15, 2 | 2021-06-15 |
Interconnect structure for package-on-package devices
Grant 11,037,861 - Hung , et al. June 15, 2 | 2021-06-15 |
3DIC Architecture with Interposer or Bonding Dies
App 20210167018 - Hu; Hsien-Pin ; et al. | 2021-06-03 |
Semiconductor Packages
App 20210159147 - Lin; Jing-Cheng ; et al. | 2021-05-27 |
Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof
Grant 11,018,106 - Lin , et al. May 25, 2 | 2021-05-25 |
Through-Substrate Vias with Improved Connections
App 20210125900 - Lin; Jing-Cheng ; et al. | 2021-04-29 |
Sawing Underfill in Packaging Processes
App 20210125964 - Lu; Szu-Wei ; et al. | 2021-04-29 |
Methods of packaging semiconductor devices including placing semiconductor devices into die caves
Grant 10,964,594 - Lin , et al. March 30, 2 | 2021-03-30 |
Semiconductor device and manufacturing method of the same
Grant 10,964,673 - Lin , et al. March 30, 2 | 2021-03-30 |
Package structure and method
Grant 10,957,616 - Lin , et al. March 23, 2 | 2021-03-23 |
Semiconductor Device and Method of Manufacture
App 20210074683 - Lin; Jing-Cheng ; et al. | 2021-03-11 |
Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
Grant 10,943,873 - Lin , et al. March 9, 2 | 2021-03-09 |
Sawing Underfill in Packaging Processes
App 20210057383 - Lu; Szu-Wei ; et al. | 2021-02-25 |
Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
Grant 10,923,431 - Hu , et al. February 16, 2 | 2021-02-16 |
Front-to-back Bonding With Through-substrate Via (tsv)
App 20210043547 - LIN; Jing-Cheng | 2021-02-11 |
Semiconductor Device and Method of Manufacture
App 20210043581 - Lin; Jing-Cheng ; et al. | 2021-02-11 |
Semiconductor package having thermal conductive pattern surrounding the semiconductor die
Grant 10,916,488 - Lin , et al. February 9, 2 | 2021-02-09 |
Package of integrated circuits having a light-to-heat-conversion coating material
Grant 10,916,450 - Tsou , et al. February 9, 2 | 2021-02-09 |
Alignment marks in substrate having through-substrate via (TSV)
Grant 10,910,267 - Chang , et al. February 2, 2 | 2021-02-02 |
Fan-Out Wafer Level Package Structure
App 20210028097 - Lin; Jing-Cheng | 2021-01-28 |
Integrated Circuit Packages And Methods Of Forming Same
App 20210005464 - Lin; Jing-Cheng ; et al. | 2021-01-07 |
Chip Package Structure With Seal Ring Structure
App 20200411485 - YU; Chen-Hua ; et al. | 2020-12-31 |
Semiconductor device package and method of manufacturing the same
Grant 10,879,194 - Lin , et al. December 29, 2 | 2020-12-29 |
Package Structures and Methods of Forming the Same
App 20200402877 - Yu; Chen-Hua ; et al. | 2020-12-24 |
Release Film as Isolation Film in Package
App 20200402816 - Lin; Jing-Cheng ; et al. | 2020-12-24 |
Package structure and method of forming thereof
Grant 10,872,850 - Cheng , et al. December 22, 2 | 2020-12-22 |
PoP device
Grant 10,867,897 - Chang , et al. December 15, 2 | 2020-12-15 |
Package structures and methods of forming the same
Grant 10,867,965 - Shih , et al. December 15, 2 | 2020-12-15 |
Solution for reducing poor contact in InFO package
Grant 10,861,835 - Lin , et al. December 8, 2 | 2020-12-08 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
App 20200373215 - Wu; Chih-Wei ; et al. | 2020-11-26 |
Fan-Out Package and Methods of Forming Thereof
App 20200373264 - Shih; Wan-Ting ; et al. | 2020-11-26 |
Embedded 3D interposer structure
Grant 10,847,414 - Shih , et al. November 24, 2 | 2020-11-24 |
Front-to-back bonding with through-substrate via (TSV)
Grant 10,847,443 - Lin November 24, 2 | 2020-11-24 |
Sawing underfill in packaging processes
Grant 10,840,215 - Lu , et al. November 17, 2 | 2020-11-17 |
Semiconductor device and method of manufacture
Grant 10,840,218 - Lin , et al. November 17, 2 | 2020-11-17 |
Multi-chip fan out package and methods of forming the same
Grant 10,833,039 - Yu , et al. November 10, 2 | 2020-11-10 |
Protective Layer For Contact Pads In Fan-out Interconnect Structure And Method Of Forming Same
App 20200350280 - Chang; Chin-Chuan ; et al. | 2020-11-05 |
Semiconductor Device Having Reduced Bump Height Variation
App 20200350277 - LIN; Jing-Cheng ; et al. | 2020-11-05 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20200350279 - Tsai; Po-Hao ; et al. | 2020-11-05 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,825,693 - Lin , et al. November 3, 2 | 2020-11-03 |
Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
Grant 10,818,583 - Chen , et al. October 27, 2 | 2020-10-27 |
Semiconductor device and method of manufacture
Grant 10,818,607 - Lin , et al. October 27, 2 | 2020-10-27 |
Patterned carrier wafers and methods of making and using the same
Grant 10,811,298 - Lin October 20, 2 | 2020-10-20 |
Chip package structure with conductive shielding film
Grant 10,804,247 - Yu , et al. October 13, 2 | 2020-10-13 |
Fan-out wafer level package structure
Grant 10,804,187 - Lin October 13, 2 | 2020-10-13 |
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
App 20200321249 - Chang; Hsin ; et al. | 2020-10-08 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20200312791 - Tsai; Po-Hao ; et al. | 2020-10-01 |
Non-Vertical Through-via in Package
App 20200303275 - Huang; Cheng-Lin ; et al. | 2020-09-24 |
Integrated circuit packages and methods of forming same
Grant 10,784,123 - Lin , et al. Sept | 2020-09-22 |
Semiconductor Package And Manufacturing Method Thereof
App 20200294983 - Cheng; Li-Hui ; et al. | 2020-09-17 |
Semiconductor Package
App 20200294936 - Lin; Jing-Cheng ; et al. | 2020-09-17 |
Package structures and methods of forming the same
Grant 10,770,365 - Yu , et al. Sep | 2020-09-08 |
Metal Oxide Layered Structure and Methods of Forming the Same
App 20200279750 - Lin; Jing-Cheng ; et al. | 2020-09-03 |
Semiconductor Packages and Methods of Forming the Same
App 20200279836 - Yu; Chen-Hua ; et al. | 2020-09-03 |
Release film as isolation film in package
Grant 10,763,132 - Lin , et al. Sep | 2020-09-01 |
Bonded Semiconductor Structures
App 20200266051 - LIN; Jing-Cheng | 2020-08-20 |
Protective layer for contact pads in fan-out interconnect structure and method of forming same
Grant 10,748,869 - Chang , et al. A | 2020-08-18 |
Fan-out package and methods of forming thereof
Grant 10,741,511 - Shih , et al. A | 2020-08-11 |
Method of controlling bump height variation
Grant 10,741,520 - Lin , et al. A | 2020-08-11 |
Die-on-interposer assembly with dam structure and method of manufacturing the same
Grant 10,741,467 - Wu , et al. A | 2020-08-11 |
Raised Via for Terminal Connections on Different Planes
App 20200251380 - Kind Code | 2020-08-06 |
Semiconductor Device and Method
App 20200243435 - Lin; Jing-Cheng ; et al. | 2020-07-30 |
Integrated fan-out package structures with recesses in molding compound
Grant 10,720,403 - Tsai , et al. | 2020-07-21 |
Patterned Carrier Wafers And Methods Of Making And Using The Same
App 20200211888 - Lin; Jing Cheng | 2020-07-02 |
Non-vertical through-via in package
Grant 10,699,981 - Huang , et al. | 2020-06-30 |
Alignment marks in substrate having through-substrate via (TSV)
Grant 10,692,764 - Chang , et al. | 2020-06-23 |
Semiconductor package
Grant 10,672,723 - Lin , et al. | 2020-06-02 |
Semiconductor package and manufacturing method thereof
Grant 10,672,752 - Cheng , et al. | 2020-06-02 |
Metal oxide layered structure and methods of forming the same
Grant 10,658,195 - Lin , et al. | 2020-05-19 |
Semiconductor packages and methods of forming the same
Grant 10,658,347 - Yu , et al. | 2020-05-19 |
Semiconductor Device And Manufacturing Method Of The Same
App 20200152610 - LIN; JING-CHENG ; et al. | 2020-05-14 |
Semiconductor Device And Method Of Manufacturing The Same
App 20200152560 - LIN; JING-CHENG ; et al. | 2020-05-14 |
Thermal Dissipation Through Seal Rings in 3DIC Structure
App 20200152543 - Lin; Jing-Cheng ; et al. | 2020-05-14 |
Stacked and Bonded Semiconductor Device
App 20200144212 - Cheng; Li-Hui ; et al. | 2020-05-07 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20200144202 - Tsai; Po-Hao ; et al. | 2020-05-07 |
Bonded semiconductor structures
Grant 10,643,836 - Lin | 2020-05-05 |
Semiconductor Package Structure With Conductive Layer
App 20200135680 - CHANG; Jung-Hua ; et al. | 2020-04-30 |
Redistribution-Layer Fanout Package Stiffener
App 20200135658 - Lin; Jing Cheng | 2020-04-30 |
Package structure
Grant 10,636,748 - Yu , et al. | 2020-04-28 |
Semiconductor Device and Method of Manufacture
App 20200126959 - Lin; Jing-Cheng ; et al. | 2020-04-23 |
Raised via for terminal connections on different planes
Grant 10,629,477 - Yu , et al. | 2020-04-21 |
Redistribution-layer fanout package stiffener
Grant 10,629,547 - Lin | 2020-04-21 |
Semiconductor device and method
Grant 10,622,297 - Lin , et al. | 2020-04-14 |
Semiconductor Package
App 20200091131 - TSOU; HSIEN-JU ; et al. | 2020-03-19 |
Interconnect Structure for Package-on-Package Devices
App 20200083145 - Hung; Jui-Pin ; et al. | 2020-03-12 |
Semiconductor device and method of manufacture
Grant 10,586,763 - Tsou , et al. | 2020-03-10 |
Chip Packages and Methods of Manufacture Thereof
App 20200043892 - Wu; Chih-Wei ; et al. | 2020-02-06 |
Integrated Circuit Structure Having Dies with Connectors of Different Sizes
App 20200043879 - Jeng; Shin-Puu ; et al. | 2020-02-06 |
Multi-die structure and method for forming same
Grant 10,553,569 - Yu , et al. Fe | 2020-02-04 |
Three Dimensional Integrated Circuit (3dic) With Support Structures
App 20200035622 - Wu; Chih-Wei ; et al. | 2020-01-30 |
InFO-POP structures with TIVs Having Cavities
App 20200035608A1 - | 2020-01-30 |
Embedded 3D Interposer Structure
App 20200035554 - Shih; Ying-Ching ; et al. | 2020-01-30 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
App 20200035578 - Wu; Chih-Wei ; et al. | 2020-01-30 |
Methods For Edge Trimming Of Semiconductor Wafers And Related Apparatus
App 20200027773 - Lin; Jing-Cheng | 2020-01-23 |
Package Structure and Method
App 20200027806 - Lin; Jing-Cheng ; et al. | 2020-01-23 |
Hybrid Bonding With Through Substrate Via (tsv)
App 20200027868 - LIN; Jing-Cheng | 2020-01-23 |
Backside redistribution layer (RDL) structure
Grant 10,541,213 - Tsai , et al. Ja | 2020-01-21 |
Semiconductor device and manufacturing method of the same
Grant 10,535,639 - Lin , et al. Ja | 2020-01-14 |
Printing module, printing method and system of forming a printed structure
Grant 10,535,627 - Lin , et al. Ja | 2020-01-14 |
Thermal dissipation through seal rings in 3DIC structure
Grant 10,535,580 - Lin , et al. Ja | 2020-01-14 |
Semiconductor device and method of manufacturing the same
Grant 10,535,591 - Lin , et al. Ja | 2020-01-14 |
Package structures and methods of forming the same
Grant 10,529,690 - Shih , et al. J | 2020-01-07 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 10,529,673 - Tsai , et al. J | 2020-01-07 |
Semiconductor Device and Method of Manufacture
App 20200006225 - Tsou; Hsien-Ju ; et al. | 2020-01-02 |
Method of Forming Contact Holes in a Fan Out Package
App 20200006264 - Hsu; Feng-Cheng ; et al. | 2020-01-02 |
Underfill Structure for Semiconductor Packages and Methods of Forming the Same
App 20200006181 - Chen; Yu-Wei ; et al. | 2020-01-02 |
Semiconductor Packages
App 20200006196 - Lin; Jing-Cheng ; et al. | 2020-01-02 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20200006136 - Wu; Chih-Wei ; et al. | 2020-01-02 |
Method for a stacked and bonded semiconductor device
Grant 10,522,496 - Cheng , et al. Dec | 2019-12-31 |
Package structure, integrated fan-out package and method of fabricating the same
Grant 10,522,476 - Cheng , et al. Dec | 2019-12-31 |
Grinding element, grinding wheel and manufacturing method of semiconductor package using the same
Grant 10,518,387 - Mao , et al. Dec | 2019-12-31 |
Semiconductor package device
Grant 10,522,439 - Liu , et al. Dec | 2019-12-31 |
InFO-POP structures with TIVs having cavities
Grant 10,515,901 - Lin , et al. Dec | 2019-12-24 |
Interconnect structure for package-on-package devices
Grant 10,515,875 - Hung , et al. Dec | 2019-12-24 |
Method for forming chip package structure
Grant 10,515,904 - Lin , et al. Dec | 2019-12-24 |
Semiconductor device and method of manufacture
Grant 10,515,937 - Lin , et al. Dec | 2019-12-24 |
Method for forming semiconductor package structure with twinned copper layer
Grant 10,515,923 - Chang , et al. Dec | 2019-12-24 |
Integrated fan-out packages and methods of forming the same
Grant 10,510,595 - Wu , et al. Dec | 2019-12-17 |
Package structure and method
Grant 10,510,634 - Lin , et al. Dec | 2019-12-17 |
PoP device and method of forming the same
Grant 10,510,732 - Tsou , et al. Dec | 2019-12-17 |
Three dimensional integrated circuit (3DIC) with support structures
Grant 10,510,684 - Wu , et al. Dec | 2019-12-17 |
Package-on-package Structure And Manufacturing Method Thereof
App 20190378827 - Lin; Shih-Ting ; et al. | 2019-12-12 |
Embedded 3D interposer structure
Grant 10,497,616 - Shih , et al. De | 2019-12-03 |
Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly
Grant 10,497,690 - Tsou , et al. De | 2019-12-03 |
Die-on-interposer assembly with dam structure and method of manufacturing the same
Grant 10,490,474 - Wu , et al. Nov | 2019-11-26 |
Fan-Out Package and Methods of Forming Thereof
App 20190355684 - Shih; Wan-Ting ; et al. | 2019-11-21 |
Chip packages and methods of manufacture thereof
Grant 10,483,234 - Wu , et al. Nov | 2019-11-19 |
Semiconductor Device and Method of Manufacture
App 20190348370 - Lin; Jing-Cheng ; et al. | 2019-11-14 |
Integrated circuit structure having dies with connectors of different sizes
Grant 10,475,759 - Jeng , et al. Nov | 2019-11-12 |
Solution for Reducing Poor Contact in InFO Package
App 20190333900 - Lin; Jing-Cheng ; et al. | 2019-10-31 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20190333811 - Wu; Chih-Wei ; et al. | 2019-10-31 |
Hybrid bonding with through substrate via (TSV)
Grant 10,461,069 - Lin Oc | 2019-10-29 |
Through-Substrate Vias with Improved Connections
App 20190326199 - Lin; Jing-Cheng ; et al. | 2019-10-24 |
Package Structure And Method Of Manufacturing The Same
App 20190319008 - Liao; Shu-Hang ; et al. | 2019-10-17 |
Package-on-package structure and manufacturing method thereof
Grant 10,438,934 - Lin , et al. O | 2019-10-08 |
Semiconductor Device And Manufacturing Method Of The Same
App 20190279966 - LIN; JING-CHENG ; et al. | 2019-09-12 |
3DIC Architecture with Interposer for Bonding Dies
App 20190273046 - Hu; Hsien-Pin ; et al. | 2019-09-05 |
Raised Via for Terminal Connections on Different Planes
App 20190273018 - Yu; Chen-Hua ; et al. | 2019-09-05 |
Carrier Warpage Control For Three Dimensional Integrated Circuit (3dic) Stacking
App 20190267255 - Lin; Jing-Cheng ; et al. | 2019-08-29 |
Thermal Dissipation Through Seal Rings in 3DIC Structure
App 20190267305 - Lin; Jing-Cheng ; et al. | 2019-08-29 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20190252296 - Hung; Jui-Pin ; et al. | 2019-08-15 |
Semiconductor Package
App 20190252329 - Lin; Jing-Cheng ; et al. | 2019-08-15 |
Fan-out package and methods of forming thereof
Grant 10,366,960 - Shih , et al. July 30, 2 | 2019-07-30 |
Semiconductor device and method of manufacture
Grant 10,361,161 - Lin , et al. | 2019-07-23 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,354,982 - Tsai , et al. July 16, 2 | 2019-07-16 |
Solution for reducing poor contact in InFO package
Grant 10,347,612 - Lin , et al. July 9, 2 | 2019-07-09 |
Through substrate vias with improved connections
Grant 10,340,205 - Lin , et al. | 2019-07-02 |
Package structure and method of manufacturing the same
Grant 10,340,253 - Liao , et al. | 2019-07-02 |
Method for forming hybrid bonding with through substrate via (TSV)
Grant 10,340,247 - Lin | 2019-07-02 |
Semiconductor Device and Method of Manufacture
App 20190189594 - Lin; Jing-Cheng ; et al. | 2019-06-20 |
Method Of Forming Package Structure
App 20190172818 - LIN; Jing-Cheng ; et al. | 2019-06-06 |
Package Structure and Method
App 20190164860 - Lin; Jing-Cheng ; et al. | 2019-05-30 |
Raised via for terminal connections on different planes
Grant 10,297,494 - Yu , et al. | 2019-05-21 |
3D IC architecture with interposer and interconnect structure for bonding dies
Grant 10,297,550 - Hu , et al. | 2019-05-21 |
Semiconductor Device and Method of Manufacture
App 20190148288 - Tsou; Hsien-Ju ; et al. | 2019-05-16 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,290,513 - Lin , et al. | 2019-05-14 |
Semiconductor device and manufacturing method of the same
Grant 10,290,609 - Lin , et al. | 2019-05-14 |
Thermal dissipation through seal rings in 3DIC structure
Grant 10,290,559 - Lin , et al. | 2019-05-14 |
Multi-Chip Package and Method of Formation
App 20190139922 - Lin; Jing-Cheng ; et al. | 2019-05-09 |
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
App 20190131172 - Chang; Hsin ; et al. | 2019-05-02 |
Semiconductor package
Grant 10,276,516 - Lin , et al. | 2019-04-30 |
Methods Of Packaging Semiconductor Devices And Structures Thereof
App 20190122929 - Lin; Jing-Cheng ; et al. | 2019-04-25 |
Release Film as Isolation Film in Package
App 20190122901 - Lin; Jing-Cheng ; et al. | 2019-04-25 |
Printing Module, Printing Method And System Of Forming A Printed Structure
App 20190123015 - Lin; Jing-Cheng ; et al. | 2019-04-25 |
Rework process and tool design for semiconductor package
Grant 10,269,762 - Lin , et al. | 2019-04-23 |
Package on package (PoP) bonding structures
Grant 10,269,778 - Lin , et al. | 2019-04-23 |
Integrated circuit packages and methods of forming same
Grant 10,269,587 - Lin , et al. | 2019-04-23 |
Method of manufacturing a release film as isolation film in package
Grant 10,269,589 - Tsou , et al. | 2019-04-23 |
Apparatus for dicing interposer assembly
Grant 10,269,731 - Wang , et al. | 2019-04-23 |
Interconnect structure for package-on-package devices
Grant 10,269,685 - Hung , et al. | 2019-04-23 |
Method For Forming Chip Package Structure
App 20190115306 - LIN; Jing-Cheng ; et al. | 2019-04-18 |
Package Structures and Methods of Forming the Same
App 20190115272 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Semiconductor Packages and Methods of Forming the Same
App 20190115327 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Package Structures and Methods of Forming the Same
App 20190109119 - Shih; Ying-Ching ; et al. | 2019-04-11 |
Semiconductor Device Structure Comprising a Plurality of Metal Oxide Fibers and Method for Forming the Same
App 20190109098 - Lin; Jing-Cheng ; et al. | 2019-04-11 |
Integrated Circuit Packages and Methods of Forming Same
App 20190109020 - Lin; Jing-Cheng ; et al. | 2019-04-11 |
Multi-Chip Fan Out Package and Methods of Forming the Same
App 20190109118 - Yu; Chen-Hua ; et al. | 2019-04-11 |
Pop Device And Method Of Forming The Same
App 20190103387 - Tsou; Hsien-Ju ; et al. | 2019-04-04 |
InFO-POP structures with TIVs Having Cavities
App 20190103362 - Lin; Jing-Cheng ; et al. | 2019-04-04 |
Semiconductor Device and Method
App 20190096796 - Lin; Jing-Cheng ; et al. | 2019-03-28 |
Method of Manufacturing a Release Film as Isolation Film in Package
App 20190096700 - Tsou; Hsien-Ju ; et al. | 2019-03-28 |
Semiconductor Package, Method For Forming Semiconductor Package, And Method For Forming Semiconductor Assembly
App 20190096868 - TSOU; HSIEN-JU ; et al. | 2019-03-28 |
Package Structure And Method Of Manufacturing The Same
App 20190096851 - Liao; Shu-Hang ; et al. | 2019-03-28 |
Novel Integrated Circuit Stacking Approach
App 20190088620 - Lin; Jing-Cheng ; et al. | 2019-03-21 |
Package structure and method for forming the same
Grant 10,224,293 - Yu , et al. | 2019-03-05 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same
App 20190067148 - Wu; Chih-Wei ; et al. | 2019-02-28 |
Non-Vertical Through-via in Package
App 20190067146 - Huang; Cheng-Lin ; et al. | 2019-02-28 |
Fan-Out Wafer Level Package Structure
App 20190057933 - Lin; Jing-Cheng | 2019-02-21 |
Chip Package Structure
App 20190051635 - YU; Chen-Hua ; et al. | 2019-02-14 |
Semiconductor Device And Method Of Manufacturing The Same
App 20190051589 - LIN; JING-CHENG ; et al. | 2019-02-14 |
Package structure and method of forming thereof
Grant 10,204,889 - Lin , et al. Feb | 2019-02-12 |
Semicondcutor Package And Manufacturing Method Thereof
App 20190043849 - Cheng; Li-Hui ; et al. | 2019-02-07 |
Semiconductor Package
App 20190035738 - LIN; JING-CHENG ; et al. | 2019-01-31 |
Package Structure, Integrated Fan-out Package And Method Of Fabricating The Same
App 20190027446 - Cheng; Li-Hui ; et al. | 2019-01-24 |
Grinding Element, Grinding Wheel And Manufacturing Method Of Semiconductor Package Using The Same
App 20190022827 - Mao; Yi-Chao ; et al. | 2019-01-24 |
Release Film as Isolation Film in Package
App 20190006200 - Lin; Jing-Cheng ; et al. | 2019-01-03 |
Release Film as Isolation Film in Package
App 20190006199 - Tsou; Hsien-Ju ; et al. | 2019-01-03 |
Integrated Circuit Packages and Methods of Forming Same
App 20190006194 - Lin; Jing-Cheng ; et al. | 2019-01-03 |
Semiconductor structure and manufacturing method thereof
Grant 10,170,441 - Wu , et al. J | 2019-01-01 |
Flux residue cleaning system and method
Grant 10,170,295 - Chen , et al. J | 2019-01-01 |
Semiconductor device method of manufacture
Grant 10,170,451 - Lin , et al. J | 2019-01-01 |
Release film as isolation film in package
Grant 10,170,341 - Lin , et al. J | 2019-01-01 |
Method for forming chip package structure with adhesive layer
Grant 10,163,875 - Cheng , et al. Dec | 2018-12-25 |
Multi-chip package and method of formation
Grant 10,163,841 - Lin , et al. Dec | 2018-12-25 |
Semiconductor packages and methods of forming the same
Grant 10,163,872 - Yu , et al. Dec | 2018-12-25 |
Chip package structure including redistribution structure and conductive shielding film
Grant 10,163,813 - Lin , et al. Dec | 2018-12-25 |
Methods of packaging semiconductor devices including placing semiconductor devices into die caves
Grant 10,163,711 - Lin , et al. Dec | 2018-12-25 |
Multi-chip fan out package and methods of forming the same
Grant 10,163,857 - Yu , et al. Dec | 2018-12-25 |
Semiconductor package
Grant 10,163,848 - Lin , et al. Dec | 2018-12-25 |
Alignment marks in substrate having through-substrate via (TSV)
Grant 10,163,706 - Chang , et al. Dec | 2018-12-25 |
Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
Grant 10,163,817 - Lin , et al. Dec | 2018-12-25 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20180366439 - Lin; Jing-Cheng ; et al. | 2018-12-20 |
Integrated fan-out package and method of fabricating the same
Grant 10,157,870 - Wu , et al. Dec | 2018-12-18 |
Semiconductor packages and manufacturing method thereof
Grant 10,157,850 - Wu , et al. Dec | 2018-12-18 |
Integrated fan-out packages and methods of forming the same
Grant 10,157,888 - Lin , et al. Dec | 2018-12-18 |
Die-to-die gap control for semiconductor structure and method
Grant 10,157,879 - Lin , et al. Dec | 2018-12-18 |
Metal oxide layered structure and methods of forming the same
Grant 10,153,175 - Lin , et al. Dec | 2018-12-11 |
Package structures and methods of forming the same
Grant 10,153,222 - Yu , et al. Dec | 2018-12-11 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,153,179 - Lin , et al. Dec | 2018-12-11 |
Semiconductor Package Structure With Conductive Line And Method For Forming The Same
App 20180350765 - CHANG; Jung-Hua ; et al. | 2018-12-06 |
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
App 20180350756 - Tsai; Po-Hao ; et al. | 2018-12-06 |
Integrated Fan-Out Package Structures with Recesses in Molding Compound
App 20180350770 - Tsai; Po-Hao ; et al. | 2018-12-06 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20180342466 - LIN; JING-CHENG ; et al. | 2018-11-29 |
Semiconductor device and method
Grant 10,141,253 - Lin , et al. Nov | 2018-11-27 |
Thermal dissipation through seal rings in 3DIC structure
Grant 10,141,239 - Lin Nov | 2018-11-27 |
Integrated Fan-Out Structure with Rugged Interconnect
App 20180337137 - Lin; Shih Ting ; et al. | 2018-11-22 |
Carrier Warpage Control For Three Dimensional Integrated Circuit (3dic) Stacking
App 20180337065 - Lin; Jing-Cheng ; et al. | 2018-11-22 |
Metal Oxide Layered Structure and Methods of Forming the Same
App 20180337062 - Lin; Jing-Cheng ; et al. | 2018-11-22 |
Solder bump for ball grid array
Grant 10,134,701 - Chang , et al. November 20, 2 | 2018-11-20 |
Semiconductor package and manufacturing method thereof
Grant 10,134,719 - Cheng , et al. November 20, 2 | 2018-11-20 |
Mechanisms for forming package structure
Grant 10,128,226 - Lin , et al. November 13, 2 | 2018-11-13 |
Packaging methods and packaged semiconductor devices
Grant 10,128,175 - Lin , et al. November 13, 2 | 2018-11-13 |
Semicondcutor Package
App 20180315733 - Lin; Jing-Cheng ; et al. | 2018-11-01 |
Packaged semiconductor device and method of fabricating a packaged semiconductor device
Grant 10,115,675 - Lin , et al. October 30, 2 | 2018-10-30 |
Die-on-interposer assembly with dam structure and method of manufacturing the same
Grant 10,115,650 - Wu , et al. October 30, 2 | 2018-10-30 |
Non-vertical through-via in package
Grant 10,115,647 - Huang , et al. October 30, 2 | 2018-10-30 |
Thermal dissipation through seal rings in 3DIC structure
Grant 10,115,653 - Lin October 30, 2 | 2018-10-30 |
Semiconductor Device and Method of Manufacture
App 20180308828 - Lin; Jing-Cheng ; et al. | 2018-10-25 |
Method For Forming Chip Package Structure With Adhesive Layer
App 20180308825 - CHENG; Li-Hui ; et al. | 2018-10-25 |
3DIC stacking device and method of manufacture
Grant 10,109,613 - Lin , et al. October 23, 2 | 2018-10-23 |
Fan-out wafer level package structure
Grant 10,109,567 - Lin October 23, 2 | 2018-10-23 |
Packaged semiconductor devices and packaging devices and methods
Grant 10,109,573 - Lin , et al. October 23, 2 | 2018-10-23 |
Package Structure
App 20180301424 - Yu; Chen-Hua ; et al. | 2018-10-18 |
Embedded 3D Interposer Structure
App 20180301376 - Shih; Ying-Ching ; et al. | 2018-10-18 |
Semiconductor Device And Manufacturing Method Thereof
App 20180301431 - LIN; JING-CHENG ; et al. | 2018-10-18 |
Chip package structure and method for forming the same
Grant 10,103,125 - Yu , et al. October 16, 2 | 2018-10-16 |
Semiconductor device and method of manufactures
Grant 10,103,132 - Lin , et al. October 16, 2 | 2018-10-16 |
Hybrid Bonding With Through Substrate Via (tsv)
App 20180286846 - LIN; Jing-Cheng | 2018-10-04 |
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer
App 20180286839 - Tsai; Po-Hao ; et al. | 2018-10-04 |
Package Structure And Method Of Forming Thereof
App 20180286793 - CHENG; Li-Hui ; et al. | 2018-10-04 |
Semiconductor package
Grant 10,090,253 - Lin , et al. October 2, 2 | 2018-10-02 |
Integrated fan-out structure with guiding trenches in buffer layer
Grant 10,083,946 - Tsai , et al. September 25, 2 | 2018-09-25 |
Metal bump joint structure
Grant 10,083,928 - Lin September 25, 2 | 2018-09-25 |
Fan-out POP structure with inconsecutive polymer layer
Grant 10,083,913 - Tsai , et al. September 25, 2 | 2018-09-25 |
Semiconductor Package Device
App 20180269124 - LIU; NAI-WEI ; et al. | 2018-09-20 |
Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
Grant 10,079,225 - Lin , et al. September 18, 2 | 2018-09-18 |
Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
Grant 10,079,159 - Lin , et al. September 18, 2 | 2018-09-18 |
Semiconductor Package
App 20180247900 - Lin; Jing-Cheng ; et al. | 2018-08-30 |
Integrated fan-out package structures with recesses in molding compound
Grant 10,062,662 - Tsai , et al. August 28, 2 | 2018-08-28 |
Method of Forming Contact Holes in a Fan Out Package
App 20180240764 - Hsu; Feng-Cheng ; et al. | 2018-08-23 |
PoP Device
App 20180233441 - Chang; Chin-Chuan ; et al. | 2018-08-16 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 10,049,989 - Tsai , et al. August 14, 2 | 2018-08-14 |
Embedded 3D interposer structure
Grant 10,049,928 - Shih , et al. August 14, 2 | 2018-08-14 |
Backside Redistribution Layer (RDL) Structure
App 20180218985 - Tsai; Po-Hao ; et al. | 2018-08-02 |
Protective Layer for Contact Pads in Fan-out Interconnect Structure and Method of Forming Same
App 20180219000 - Chang; Chin-Chuan ; et al. | 2018-08-02 |
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
App 20180211901 - Hung; Jui-Pin ; et al. | 2018-07-26 |
Raised Via for Terminal Connections on Different Planes
App 20180211912 - Yu; Chen-Hua ; et al. | 2018-07-26 |
Packaged semiconductor devices and packaging methods thereof
Grant 10,032,662 - Liao , et al. July 24, 2 | 2018-07-24 |
Three Dimensional Integrated Circuit (3dic) With Support Structures
App 20180197826 - Wu; Chih-Wei ; et al. | 2018-07-12 |
Semiconductive packaging device and manufacturing method thereof
Grant 10,020,275 - Lin , et al. July 10, 2 | 2018-07-10 |
CIS chips and methods for forming the same
Grant 10,020,344 - Yu , et al. July 10, 2 | 2018-07-10 |
Wafer-level packaging mechanisms
Grant 10,008,463 - Lin , et al. June 26, 2 | 2018-06-26 |
Semiconductor device and method of manufacture
Grant 10,008,485 - Lin , et al. June 26, 2 | 2018-06-26 |
Method for forming hybrid bonding with through substrate via (TSV)
Grant 9,991,244 - Lin June 5, 2 | 2018-06-05 |
Chip Package Structure And Method For Forming The Same
App 20180151540 - YU; Chen-Hua ; et al. | 2018-05-31 |
Package Structure And Method Of Forming Thereof
App 20180151546 - LIN; Jing-Cheng ; et al. | 2018-05-31 |
Front-to-back Bonding With Through-substrate Via (tsv)
App 20180145011 - LIN; Jing-Cheng | 2018-05-24 |
Semiconductor package device and manufacturing method thereof
Grant 9,978,657 - Liu , et al. May 22, 2 | 2018-05-22 |
Bonding method including adjusting surface contours of a bonding system
Grant 9,978,628 - Lin , et al. May 22, 2 | 2018-05-22 |
Package Structures And Methods Of Forming The Same
App 20180138101 - Yu; Chen-Hua ; et al. | 2018-05-17 |
Package Structures And Methods Of Forming The Same
App 20180138151 - Shih; Ying-Ching ; et al. | 2018-05-17 |
Semiconductor Device and Method
App 20180138116 - Lin; Jing-Cheng ; et al. | 2018-05-17 |
Chip Package Structure And Method For Forming The Same
App 20180138130 - LIN; Jing-Cheng ; et al. | 2018-05-17 |
Method of forming a semiconductor package
Grant 9,960,125 - Lin , et al. May 1, 2 | 2018-05-01 |
End point detection in grinding
Grant 9,960,088 - Mao , et al. May 1, 2 | 2018-05-01 |
PoP device
Grant 9,953,907 - Chang , et al. April 24, 2 | 2018-04-24 |
Integrated fan-out package structures with recesses in molding compound
Grant 9,953,955 - Tsai , et al. April 24, 2 | 2018-04-24 |
Pillar design for conductive bump
Grant 9,953,948 - Hsieh , et al. April 24, 2 | 2018-04-24 |
Semiconductor Device And Manufacturing Method Of The Same
App 20180108638 - LIN; JING-CHENG ; et al. | 2018-04-19 |
Bonded Semiconductor Structures
App 20180108524 - LIN; Jing-Cheng | 2018-04-19 |
Semiconductor Device and Method of Manufacture
App 20180102345 - Lin; Jing-Cheng ; et al. | 2018-04-12 |
Solution for Reducing Poor Contact in InFO Package
App 20180096976 - Lin; Jing-Cheng ; et al. | 2018-04-05 |
Semiconductor Package
App 20180082954 - LIN; JING-CHENG ; et al. | 2018-03-22 |
Fan-Out Package and Methods of Forming Thereof
App 20180033747 - Shih; Wan-Ting ; et al. | 2018-02-01 |
Semiconductor Devices, Methods of Manufacture Thereof, and Semiconductor Device Packages
App 20180012830 - Chen; I-Ting ; et al. | 2018-01-11 |
Method For Forming Hybrid Bonding With Through Substrate Via (tsv)
App 20180005977 - LIN; Jing-Cheng | 2018-01-04 |
Semicondcutor Package And Manufacturing Method Thereof
App 20180006005 - Cheng; Li-Hui ; et al. | 2018-01-04 |
Multi-Die Structure and Method for Forming Same
App 20170373048 - Yu; Chen-Hua ; et al. | 2017-12-28 |
Packaged Semiconductor Device And Method Of Fabricating A Packaged Semiconductor Device
App 20170373016 - Lin; Jing-Cheng ; et al. | 2017-12-28 |
Integrated Fan-Out Structure with Rugged Interconnect
App 20170352626 - Lin; Shih Ting ; et al. | 2017-12-07 |
Packaged Semiconductor Devices and Packaging Devices and Methods
App 20170338177 - Lin; Jing-Cheng ; et al. | 2017-11-23 |
Semiconductor Device and Method of Manufacture
App 20170338185 - Lin; Jing-Cheng ; et al. | 2017-11-23 |
De-bonding and Cleaning Process and System
App 20170326866 - Shih; Ying-Ching ; et al. | 2017-11-16 |
Through-Substrate Vias with Improved Connections
App 20170317011 - Lin; Jing-Cheng ; et al. | 2017-11-02 |
Solder Bump for Ball Grid Array
App 20170317044 - Chang; Jung-Hua ; et al. | 2017-11-02 |
Thermal Dissipation Through Seal Rings in 3DIC Structure
App 20170317004 - Lin; Jing-Cheng | 2017-11-02 |
Chip Packages and Methods of Manufacture Thereof
App 20170301649 - Wu; Chih-Wei ; et al. | 2017-10-19 |
Mechanisms For Forming Package Structure
App 20170301663 - LIN; Jing-Cheng ; et al. | 2017-10-19 |
Methods and Structures for Packaging Semiconductor Dies
App 20170301648 - Mao; Yi-Chao ; et al. | 2017-10-19 |
Multi-Chip Fan Out Package and Methods of Forming the Same
App 20170294409 - Yu; Chen-Hua ; et al. | 2017-10-12 |
Molding Wafer Chamber
App 20170278723 - Lin; Jing-Cheng ; et al. | 2017-09-28 |
Package on Package (PoP) Bonding Structures
App 20170271311 - Lin; Jing-Cheng ; et al. | 2017-09-21 |
Copper bump structures having sidewall protection layers
Grant 08922004 - | 2014-12-30 |
| 