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Patent applications and USPTO patent grants for Lin; Jhun-Sou.The latest application filed is for "bleed element with overmolded seal for evaporative emissions canister".
Patent | Date |
---|---|
Bleed element with overmolded seal for evaporative emissions canister Grant 8,881,710 - Lin , et al. November 11, 2 | 2014-11-11 |
Bleed Element With Overmolded Seal for Evaporative Emissions Canister App 20130291839 - Lin; Jhun-Sou ;   et al. | 2013-11-07 |
System and method for analyzing a component Grant 6,778,864 - Bugli , et al. August 17, 2 | 2004-08-17 |
Design evaluation system Grant 6,778,870 - Li , et al. August 17, 2 | 2004-08-17 |
System and method for designing a component Grant 6,741,899 - Wu , et al. May 25, 2 | 2004-05-25 |
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