Lin; Jenq-Tain
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Jenq-Tain.The latest application filed is for "novel polyimide copolymer and metal laminate using the same".
- Lin; Jenq-Tain - Ibaraki JP
- Lin; Jenq-Tain - Kitaibaraki JP
- Lin, Jenq-Tain - Kitaibaraki-shi JP
- Lin, Jenq-Tain - Kitaibaraki city JP
| Patent | Date |
|---|---|
| Polyimide copolymer and metal laminate using the same Grant 7,763,321 - Zuo , et al. July 27, 2 | 2010-07-27 |
| Novel polyimide copolymer and metal laminate using the same App 20090133907 - Zuo; Min ; et al. | 2009-05-28 |
| Novel polyimide copolymer and metal laminate using the same App 20090136671 - Zuo; Min ; et al. | 2009-05-28 |
| Polyimide copolymer and metal laminate using the same Grant 7,459,216 - Zuo , et al. December 2, 2 | 2008-12-02 |
| Novel polyimide copolymer and metal laminate using the same App 20040180227 - Zuo, Min ; et al. | 2004-09-16 |
| Polyimide copolymer Grant 6,770,733 - Zuo , et al. August 3, 2 | 2004-08-03 |
| Novel polyimide copolymer App 20030187179 - Zou, Min ; et al. | 2003-10-02 |
| Polyimides, process for producing the same and photosensitive composition containing the same App 20020045127 - Chiang, Lin-Chiu ; et al. | 2002-04-18 |
| Polyimides, process for producing the same and photosensitive composition containing the same Grant 6,077,924 - Chiang , et al. June 20, 2 | 2000-06-20 |
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