loadpatents
name:-0.0025770664215088
name:-0.0065829753875732
name:-0.00077104568481445
Lin; Jeng S. Patent Filings

Lin; Jeng S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Jeng S..The latest application filed is for "copper-nickel-silicon two phase quench substrate".

Company Profile
0.5.1
  • Lin; Jeng S. - Morristown NJ
  • Lin; Jeng S. - Clay NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper-nickel-silicon two phase quench substrate
Grant 6,764,556 - Myojin , et al. July 20, 2
2004-07-20
Copper-nickel-silicon two phase quench substrate
App 20040112566 - Myojin, Shinya ;   et al.
2004-06-17
Thick amorphous metal strip having improved ductility and magnetic properties
Grant 6,103,396 - Das , et al. August 15, 2
2000-08-15
Preparation of 1-N-[.omega.-amino-.alpha.-hydroxyalkanoyl]kanamycin polysilylates and products
Grant 4,424,343 - Cron , et al. * January 3, 1
1984-01-03
Preparation of 1-N-[.omega.-amino-.alpha.-hydroxyalkanoyl]aminoglycoside polysilylated antibiotics and products obtained therefrom
Grant 4,347,354 - Cron , et al. August 31, 1
1982-08-31
Esterification process using methoxymethyl-P-toluenesulfonate
Grant 4,247,461 - Lin , et al. January 27, 1
1981-01-27

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