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Patent applications and USPTO patent grants for Lin; I-Chun.The latest application filed is for "die transfer method and die transfer system thereof".
Patent | Date |
---|---|
Die Transfer Method And Die Transfer System Thereof App 20200023479 - Lin; I-Chun | 2020-01-23 |
Die Transfer Method and Die Transfer System Thereof App 20200027757 - Lin; I-Chun | 2020-01-23 |
Membrane micropump Grant 8,690,550 - Wang , et al. April 8, 2 | 2014-04-08 |
Capillary coating devices and methods Grant 8,257,794 - Wang , et al. September 4, 2 | 2012-09-04 |
Device for adjusting temperature and humidity using wind power Grant 8,074,460 - Wang , et al. December 13, 2 | 2011-12-13 |
Membrane Micropump App 20110158832 - Wang; An-Bang ;   et al. | 2011-06-30 |
Jets device Grant 7,861,944 - Yen , et al. January 4, 2 | 2011-01-04 |
Micro patch coating device and method Grant 7,824,736 - Wang , et al. November 2, 2 | 2010-11-02 |
Integrated Electrophoresis Device And Operation Thereof App 20100140091 - Wang; An-Bang ;   et al. | 2010-06-10 |
Capillary Coating Devices And Methods App 20100047452 - Wang; An-Bang ;   et al. | 2010-02-25 |
Device For Adjusting Temperature And Humidity Using Wind Power App 20090108085 - WANG; An-Bang ;   et al. | 2009-04-30 |
High-precision vortex flow meter Grant 7,487,686 - Wang , et al. February 10, 2 | 2009-02-10 |
Jets Device App 20090001194 - Yen; Ruey-Hor ;   et al. | 2009-01-01 |
High-precision vortex flow meter App 20080141785 - Wang; An-Bang ;   et al. | 2008-06-19 |
Micro patch coating device and method App 20080145537 - Wang; An-Bang ;   et al. | 2008-06-19 |
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