| Patent | Date |
|---|
Conductive Bond Structure To Increase Membrane Sensitivty In Mems Device
App 20220219973 - Lin; Hung-Hua ; et al. | 2022-07-14 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20220216052 - Huang; Xin-Hua ; et al. | 2022-07-07 |
Method For Manufacturing A Mems Device By First Hybrid Bonding A Cmos Wafer To A Mems Wafer
App 20220204340 - Lin; Hung-Hua ; et al. | 2022-06-30 |
Undercut-free patterned aluminum nitride structure and methods for forming the same
Grant 11,371,133 - Hsieh , et al. June 28, 2 | 2022-06-28 |
Conductive bond structure to increase membrane sensitivity in MEMS device
Grant 11,292,715 - Lin , et al. April 5, 2 | 2022-04-05 |
Integrate rinse module in hybrid bonding platform
Grant 11,282,697 - Huang , et al. March 22, 2 | 2022-03-22 |
Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
Grant 11,279,615 - Lin , et al. March 22, 2 | 2022-03-22 |
Outgassing Material Coated Cavity For A Micro-electro Mechanical System Device And Methods For Forming The Same
App 20220024756 - CHANG; Kuei-Sung ; et al. | 2022-01-27 |
Undercut-free Patterned Aluminum Nitride Structure And Methods For Forming The Same
App 20220018009 - Hsieh; Yuan-Chih ; et al. | 2022-01-20 |
Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
Grant 11,180,363 - Chang , et al. November 23, 2 | 2021-11-23 |
MEMS devices with an element having varying widths
Grant 11,130,670 - Tsai , et al. September 28, 2 | 2021-09-28 |
Method To Protect Electrodes From Oxidation In A Mems Device
App 20210265557 - Wang; Yi-Ren ; et al. | 2021-08-26 |
Outgassing Material Coated Cavity For A Micro-electro Mechanical System Device And Methods For Forming The Same
App 20210246014 - Chang; Kuei-Sung ; et al. | 2021-08-12 |
Method to protect electrodes from oxidation in a MEMS device
Grant 11,050,012 - Wang , et al. June 29, 2 | 2021-06-29 |
Semiconductor Structure And Manufacturing Method For The Same
App 20210122625 - HSIEH; YUAN-CHIH ; et al. | 2021-04-29 |
Semiconductor arrangement and formation thereof
Grant 10,981,781 - Huang , et al. April 20, 2 | 2021-04-20 |
Conductive Bond Structure To Increase Membrane Sensitivty In Mems Device
App 20200407220 - Lin; Hung-Hua ; et al. | 2020-12-31 |
Method To Protect Electrodes From Oxidation In A Mems Device
App 20200313073 - Wang; Yi-Ren ; et al. | 2020-10-01 |
Method of manufacturing semiconductor structure
Grant 10,781,098 - Lin , et al. Sept | 2020-09-22 |
Integrate rinse module in hybrid bonding platform
Grant 10,665,449 - Huang , et al. | 2020-05-26 |
Semiconductor Arrangement And Formation Thereof
App 20200062587 - Huang; Hsin-Ting ; et al. | 2020-02-27 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20200006052 - Huang; Xin-Hua ; et al. | 2020-01-02 |
Semiconductor arrangement and formation thereof
Grant 10,464,808 - Huang , et al. No | 2019-11-05 |
Method Of Manufacturing Semiconductor Structure
App 20190256352 - LIN; HUNG-HUA ; et al. | 2019-08-22 |
MEMS Devices and Methods of Forming the Same
App 20190248646 - Tsai; Shang-Ying ; et al. | 2019-08-15 |
Method For Manufacturing A Mems Device By First Hybrid Bonding A Cmos Wafer To A Mems Wafer
App 20190241430 - Lin; Hung-Hua ; et al. | 2019-08-08 |
Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
Grant 10,294,098 - Lin , et al. | 2019-05-21 |
Semiconductor structure and manufacturing method thereof
Grant 10,280,076 - Lin , et al. | 2019-05-07 |
Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring
Grant 10,266,390 - Tsai , et al. | 2019-04-23 |
a method for manufacturing a mems device by first hybrid bonding a cmos wafer to a mems wafer
App 20190092627 - Lin; Hung-Hua ; et al. | 2019-03-28 |
Biological sensing structures
Grant 10,119,909 - Lin , et al. November 6, 2 | 2018-11-06 |
Method of selectively removing an anti-stiction layer on a eutectic bonding area
Grant 10,053,361 - Hsieh , et al. August 21, 2 | 2018-08-21 |
Semiconductor Arrangement And Formation Thereof
App 20180022602 - Huang; Hsin-Ting ; et al. | 2018-01-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170297902 - LIN; HUNG-HUA ; et al. | 2017-10-19 |
Method for controlling surface roughness in MEMS structure
Grant 9,776,852 - Hsieh , et al. October 3, 2 | 2017-10-03 |
Semiconductor arrangement and formation thereof
Grant 9,776,858 - Huang , et al. October 3, 2 | 2017-10-03 |
Debonding schemes
Grant 9,741,681 - Huang , et al. August 22, 2 | 2017-08-22 |
Method For Controlling Surface Roughness In Mems Structure
App 20170217756 - HSIEH; YUAN-CHIH ; et al. | 2017-08-03 |
Method of improving getter efficiency by increasing superficial area
Grant 9,708,179 - Hsieh , et al. July 18, 2 | 2017-07-18 |
Self-removal anti-stiction coating for bonding process
Grant 9,611,141 - Liu , et al. April 4, 2 | 2017-04-04 |
Debonding Schemes
App 20170077062 - Huang; Xin-Hua ; et al. | 2017-03-16 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20170004964 - Huang; Xin-Hua ; et al. | 2017-01-05 |
Debonding schemes
Grant 9,508,586 - Huang , et al. November 29, 2 | 2016-11-29 |
Biological Sensing Structures
App 20160299068 - Lin; Hung-Hua ; et al. | 2016-10-13 |
Integrate rinse module in hybrid bonding platform
Grant 9,446,467 - Huang , et al. September 20, 2 | 2016-09-20 |
Self-removal Anti-stiction Coating For Bonding Process
App 20160229693 - Liu; Ping-Yin ; et al. | 2016-08-11 |
Method of Selectively Removing an Anti-Stiction Layer on a Eutectic Bonding Area
App 20160185592 - Hsieh; Yuan-Chih ; et al. | 2016-06-30 |
Biological sensing structures
Grant 9,377,401 - Lin , et al. June 28, 2 | 2016-06-28 |
Debonding Schemes
App 20160111316 - Huang; Xin-Hua ; et al. | 2016-04-21 |
Method Of Improving Getter Efficiency By Increasing Superficial Area
App 20160101976 - Hsieh; Yuan-Chih ; et al. | 2016-04-14 |
Wafer level packaging bond
Grant 9,293,445 - Liu , et al. March 22, 2 | 2016-03-22 |
MEMS Devices and Methods of Forming the Same
App 20160046482 - Lin; Hung-Hua ; et al. | 2016-02-18 |
Method of improving getter efficiency by increasing superficial area
Grant 9,242,853 - Hsieh , et al. January 26, 2 | 2016-01-26 |
MEMS devices and methods of forming the same
Grant 9,181,083 - Tsai , et al. November 10, 2 | 2015-11-10 |
Semiconductor Arrangement And Formation Thereof
App 20150239732 - Huang; Hsin-Ting ; et al. | 2015-08-27 |
Method of Improving Getter Efficiency by Increasing Superficial Area
App 20150102432 - Hsieh; Yuan-Chih ; et al. | 2015-04-16 |
Biological Sensing Structures
App 20150044759 - LIN; Hung-Hua ; et al. | 2015-02-12 |
Systems and methods of separating bonded wafers
Grant 8,945,344 - Huang , et al. February 3, 2 | 2015-02-03 |
MEMS Devices and Methods of Forming the Same
App 20150031159 - Tsai; Shang-Ying ; et al. | 2015-01-29 |
Self-removal anti-stiction coating for bonding process
Grant 8,905,293 - Liu , et al. December 9, 2 | 2014-12-09 |
MEMS devices and methods of forming the same
Grant 8,853,801 - Tsai , et al. October 7, 2 | 2014-10-07 |
Biological sensing structures and methods of forming the same
Grant 8,846,129 - Lin , et al. September 30, 2 | 2014-09-30 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20140263586 - Huang; Xin-Hua ; et al. | 2014-09-18 |
Methods for hybrid wafer bonding
Grant 8,802,538 - Liu , et al. August 12, 2 | 2014-08-12 |
Method to prevent metal pad damage in wafer level package
Grant 8,735,260 - Tsai , et al. May 27, 2 | 2014-05-27 |
Wafer Level Packaging Bond
App 20140138853 - Liu; Martin ; et al. | 2014-05-22 |
Wafer level packaging bond
Grant 8,647,962 - Liu , et al. February 11, 2 | 2014-02-11 |
Systems and Methods of Separating Bonded Wafers
App 20140020818 - Huang; Xin-Hua ; et al. | 2014-01-23 |
Power devices having reduced on-resistance and methods of their manufacture
Grant 8,633,086 - Kalnitsky , et al. January 21, 2 | 2014-01-21 |
MEMS Devices and Methods of Forming the Same
App 20130277770 - Tsai; Shang-Ying ; et al. | 2013-10-24 |
Biological Sensing Structures And Methods Of Forming The Same
App 20130208371 - LIN; Hung-Hua ; et al. | 2013-08-15 |
Handling layer for transparent substrate
Grant 8,405,169 - Cheng , et al. March 26, 2 | 2013-03-26 |
Self-removal Anti-stiction Coating For Bonding Process
App 20120148870 - Liu; Ping-Yin ; et al. | 2012-06-14 |
Method To Prevent Metal Pad Damage In Wafer Level Package
App 20120149152 - Tsai; Shang-Ying ; et al. | 2012-06-14 |
Handling Layer For Transparent Substrate
App 20120091598 - Cheng; Chun-Ren ; et al. | 2012-04-19 |
Wafer Level Packaging Bond
App 20110233621 - Liu; Martin ; et al. | 2011-09-29 |
Power Devices Having Reduced On-resistance And Methods Of Their Manufacture
App 20110156217 - Kalnitsky; Alex ; et al. | 2011-06-30 |
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