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Patent applications and USPTO patent grants for Lin; Huamao.The latest application filed is for "bonding method using porosified surfaces for making stacked structures".
Patent | Date |
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Bonding method using porosified surfaces for making stacked structures Grant 9,272,899 - Kotlanka , et al. March 1, 2 | 2016-03-01 |
Bonding Method Using Porosified Surfaces For Making Stacked Structures App 20150115453 - KOTLANKA; Rama Krishna ;   et al. | 2015-04-30 |
Bonding method using porosified surfaces for making stacked structures Grant 8,940,616 - Kotlanka , et al. January 27, 2 | 2015-01-27 |
Bonding Method Using Porosified Surfaces For Making Stacked Structures App 20140030847 - KOTLANKA; Rama Krishna ;   et al. | 2014-01-30 |
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