Lin; Hsiu-Pen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Hsiu-Pen.The latest application filed is for "multilayer structures for electronic device housings".
- Lin; Hsiu-Pen - Taipei TW
- LIN; HSIU-PEN - TAIPEI CITY TW
- LIN; Hsiu-Pen - Chiayi City TW
- Lin; Hsiu-Pen - New Taipei City TW
- Lin; Hsiu-Pen - Taoyuan County TW
- Lin; Hsiu-Pen - Zhongli TW
- Lin; Hsiu-Pen - Zhongli City TW
| Patent | Date |
|---|---|
| Multilayer structures for electronic device housings Grant 10,543,657 - Lin , et al. Ja | 2020-01-28 |
| Multilayer Structures For Electronic Device Housings App 20190016082 - LIN; HSIU-PEN ; et al. | 2019-01-17 |
| Antibody App 20170342217 - LI; Yaw-Kuen ; et al. | 2017-11-30 |
| Dendrimer, Dendrimer Having Functional Group And Antibody App 20160222173 - LI; Yaw-Kuen ; et al. | 2016-08-04 |
| Connector Structure And Electronic Apparatus Using The Same App 20150138727 - Lin; Hsiu-Pen | 2015-05-21 |
| Touch pad module assembly structure Grant 8,456,437 - Chiang , et al. June 4, 2 | 2013-06-04 |
| Touch pad module assembly structure Grant 8,139,347 - Chiang , et al. March 20, 2 | 2012-03-20 |
| Touch Pad Module Assembly Structure App 20110080354 - Chiang; Tsung-Ju ; et al. | 2011-04-07 |
| Touch pad module assembly structure App 20110075336 - Chiang; Tsung-Ju ; et al. | 2011-03-31 |
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