Lin; Hsiu-Jen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Hsiu-Jen.The latest application filed is for "tools and systems for processing semiconductor devices, and methods of processing semiconductor devices".

Company Profile

56.96.125

Lin; Hsiu-Jen - Zhubei City TW
Lin; Hsiu-Jen - Zhubei TW
Lin; Hsiu-Jen - Hsinchu County TW
LIN; Hsiu-Jen - Chang-Hua County TW
Lin; Hsiu-Jen - Changhua County TW
- Zhubei TW
Lin; Hsiu-Jen - Taipei County TW
Lin; Hsiu-Jen - Jhubei City TW
Lin, Hsiu-Jen - Yilan Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices App 20220302079 - Huang; Kuei-Wei ; et al.	2022-09-22
Warpage control in the packaging of integrated circuits Grant 11,432,372 - Cheng , et al. August 30, 2	2022-08-30
Semiconductor package and method of forming the same Grant 11,417,698 - Chang , et al. August 16, 2	2022-08-16
Manufacturing Method Of Package On Package Structure App 20220254767 - Kuo; Hsuan-Ting ; et al.	2022-08-11
Integrated Fan-Out Packages and Methods of Forming the Same App 20220246590 - Yu; Chen-Hua ; et al.	2022-08-04
Semiconductor Device And Method Of Manufacture App 20220216071 - Chen; Wei-Yu ; et al.	2022-07-07
System for processing semiconductor devices Grant 11,355,471 - Huang , et al. June 7, 2	2022-06-07
Semiconductor Structure And Method Of Fabricating The Same App 20220165675 - Huang; Tzu-Sung ; et al.	2022-05-26
Package Structure App 20220165689 - TAI; Chih-Hsuan ; et al.	2022-05-26
Manufacturing method of package on package structure Grant 11,342,321 - Kuo , et al. May 24, 2	2022-05-24
Reflow Method And System App 20220130795 - Wong; Cheng-Shiuan ; et al.	2022-04-28
Package Structure And Method Of Fabricating The Same App 20220122926 - Pei; Hao-Jan ; et al.	2022-04-21
Integrated fan-out packages and methods of forming the same Grant 11,309,294 - Yu , et al. April 19, 2	2022-04-19
Package structure Grant 11,251,141 - Tai , et al. February 15, 2	2022-02-15
Semiconductor structure and method of fabricating the same Grant 11,244,906 - Huang , et al. February 8, 2	2022-02-08
Semiconductor Structure and Method App 20220028823 - Cheng; Chia-Shen ; et al.	2022-01-27
Package structure and method of fabrcating the same Grant 11,211,341 - Pei , et al. December 28, 2	2021-12-28
Semiconductor Package And Manufacturing Method Thereof App 20210375809 - Liang; Fang-Yu ; et al.	2021-12-02
Semiconductor Structure And Method Of Fabricating The Same App 20210366833 - Huang; Tzu-Sung ; et al.	2021-11-25
Semiconductor Package and Method App 20210351172 - Pei; Hao-Jan ; et al.	2021-11-11
Ratching Wrench App 20210331295 - LIN; Hsiu-Jen	2021-10-28
Package Structure With Warpage-control Element App 20210327840 - PEI; Hao-Jan ; et al.	2021-10-21
Substrate and Package Structure App 20210288012 - Lin; Wei-Hung ; et al.	2021-09-16
Integrated circuit package and method Grant 11,121,089 - Yu , et al. September 14, 2	2021-09-14
Method for manufacturing interconnect structure Grant 11,121,104 - Chen , et al. September 14, 2	2021-09-14
Intelligent Storage System and an Intelligent Storage Method Thereof App 20210263890 - Lin; Hsiu-Jen	2021-08-26
Package Structure App 20210263243 - Chang; Chia-Lun ; et al.	2021-08-26
Package-on-package structures and methods for forming the same Grant 11,101,261 - Huang , et al. August 24, 2	2021-08-24
Iintegrated Fan-out Packages With Embedded Heat Dissipation Structure App 20210233829 - Pei; Hao-Jan ; et al.	2021-07-29
Workpiece Holder, Wafer Chuck, Wafer Holding Method App 20210225684 - Wong; Cheng-Shiuan ; et al.	2021-07-22
Semiconductor package and method Grant 11,069,671 - Pei , et al. July 20, 2	2021-07-20
Fan-Out Packages and Methods of Forming the Same App 20210202358 - Tsao; Chih-Chiang ; et al.	2021-07-01
Semiconductor Package And Method Of Forming The Same App 20210202562 - Chang; Chia-Lun ; et al.	2021-07-01
Formation method of package structure with warpage-control element Grant 11,049,832 - Pei , et al. June 29, 2	2021-06-29
Package Structure And Method Of Fabrcating The Same App 20210193589 - Pei; Hao-Jan ; et al.	2021-06-24
Substrate and package structure Grant 11,024,594 - Lin , et al. June 1, 2	2021-06-01
Package structure Grant 11,002,927 - Chang , et al. May 11, 2	2021-05-11
Integrated fan-out packages with embedded heat dissipation structure Grant 10,978,370 - Pei , et al. April 13, 2	2021-04-13
Method of singulate a package structure using a light transmitting film on a polymer layer Grant 10,903,090 - Chen , et al. January 26, 2	2021-01-26
Bonding Through Multi-Shot Laser Reflow App 20210013173 - Chen; Wei-Yu ; et al.	2021-01-14
Semiconductor Package and Method App 20210005554 - Huang; Tzu-Sung ; et al.	2021-01-07
Stud bump structure for semiconductor package assemblies Grant 10,879,203 - Chen , et al. December 29, 2	2020-12-29
Semiconductor packages having dummy connectors and methods of forming same Grant 10,867,976 - Chen , et al. December 15, 2	2020-12-15
Electronic device and manufacturing method thereof Grant 10,868,353 - Lu , et al. December 15, 2	2020-12-15
Method Of Singulate A Package Structure Using A Light Transmitting Film On A Polymer Layer App 20200365420 - Chen; Cheng-Ting ; et al.	2020-11-19
Methods of forming connector pad structures, interconnect structures, and structures thereof Grant 10,840,199 - Chang , et al. November 17, 2	2020-11-17
Bonding through multi-shot laser reflow Grant 10,790,261 - Chen , et al. September 29, 2	2020-09-29
Semiconductor package and method Grant 10,784,203 - Huang , et al. Sept	2020-09-22
Method of processing solder bump by vacuum annealing Grant 10,784,221 - Lin , et al. Sept	2020-09-22
Package Structure App 20200294944 - TAI; Chih-Hsuan ; et al.	2020-09-17
Formation Method Of Package Structure With Warpage-control Element App 20200279823 - PEI; Hao-Jan ; et al.	2020-09-03
Package Structure App 20200271873 - Chang; Chia-Lun ; et al.	2020-08-27
Semiconductor processing boat design with pressure sensor Grant 10,734,263 - Ang , et al.	2020-08-04
Integrated Circuit Package and Method App 20200176387 - Yu; Jen-Jui ; et al.	2020-06-04
Package structure and method of forming package structure Grant 10,672,729 - Tai , et al.	2020-06-02
Package structure with warpage-control element Grant 10,658,323 - Pei , et al.	2020-05-19
Manufacturing Method Of Package On Package Structure App 20200152616 - Kuo; Hsuan-Ting ; et al.	2020-05-14
Semiconductor Packages Having Dummy Connectors and Methods of Forming Same App 20200118984 - Chen; Chen-Shien ; et al.	2020-04-16
Electronic Device And Manufacturing Method Thereof App 20200106156 - Lu; Chun-Lin ; et al.	2020-04-02
Methods Of Forming Connector Pad Structures, Interconnect Structures, And Structures Thereof App 20200105693 - Chang; Chia-Lun ; et al.	2020-04-02
Integrated Fan-Out Packages and Methods of Forming the Same App 20200075562 - Yu; Chen-Hua ; et al.	2020-03-05
Integrated fan-out packages with embedded heat dissipation structure Grant 10,566,261 - Pei , et al. Feb	2020-02-18
Warpage Control in the Packaging of Integrated Circuits App 20200045777 - Cheng; Ming-Da ; et al.	2020-02-06
Semiconductor Processing Boat Design With Pressure Sensor App 20200035529 - Ang; Ai-Tee ; et al.	2020-01-30
Semiconductor Bonding Structures and Methods App 20200035510 - Chen; Meng-Tse ; et al.	2020-01-30
Manufacturing method of package on package structure Grant 10,535,644 - Kuo , et al. Ja	2020-01-14
Manufacturing Method Of Package On Package Structure App 20200006308 - Kuo; Hsuan-Ting ; et al.	2020-01-02
Integrated Fan-out Packages With Embedded Heat Dissipation Structure App 20200006191 - Pei; Hao-Jan ; et al.	2020-01-02
Methods of forming connector pad structures, interconnect structures, and structures thereof Grant 10,515,915 - Chang , et al. Dec	2019-12-24
Warpage control in the packaging of integrated circuits Grant 10,512,124 - Cheng , et al. Dec	2019-12-17
Semiconductor packages having dummy connectors and methods of forming same Grant 10,510,734 - Chen , et al. Dec	2019-12-17
Integrated fan-out packages with embedded heat dissipation structure Grant 10504815 -	2019-12-10
Package-on-Package Structures and Methods for Forming the Same App 20190355710 - Huang; Kuei-Wei ; et al.	2019-11-21
Semiconductor processing boat design with pressure sensor Grant 10,475,679 - Ang , et al. Nov	2019-11-12
Semiconductor Package and Method App 20190296002 - Pei; Hao-Jan ; et al.	2019-09-26
Bonding Through Multi-Shot Laser Reflow App 20190279958 - Chen; Wei-Yu ; et al.	2019-09-12
Package Structure With Warpage-control Element App 20190252340 - PEI; Hao-Jan ; et al.	2019-08-15
Methods Of Forming Connector Pad Structures, Interconnect Structures, And Structures Thereof App 20190244918 - Chang; Chia-Lun ; et al.	2019-08-08
Package-on-package structures and methods for forming the same Grant 10,373,941 - Huang , et al.	2019-08-06
Package on-package structure with epoxy flux residue Grant 10,297,579 - Yu , et al.	2019-05-21
Semiconductor Package and Method App 20190148301 - Huang; Tzu-Sung ; et al.	2019-05-16
Integrated Fan-Out Packages and Methods of Forming the Same App 20190148262 - Pei; Hao-Jan ; et al.	2019-05-16
Package Structure And Manufacturing Method Thereof App 20190139886 - Chen; Wei-Yu ; et al.	2019-05-09
Structure and formation method of chip package with fan-out structure Grant 10,276,536 - Pei , et al.	2019-04-30
Semiconductor packages having dummy connectors and methods of forming same Grant 10,276,548 - Chen , et al.	2019-04-30
Methods of forming connector pad structures, interconnect structures, and structures thereof Grant 10,269,739 - Chang , et al.	2019-04-23
Semiconductor Packages having Dummy Connectors and Methods of Forming Same App 20190115326 - Chen; Chen-Shien ; et al.	2019-04-18
Substrate and Package Structure App 20190096839 - Lin; Wei-Hung ; et al.	2019-03-28
Integrated fan-out package and method of fabricating the same Grant 10,157,862 - Chen , et al. Dec	2018-12-18
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices App 20180358325 - Huang; Kuei-Wei ; et al.	2018-12-13
Semiconductor bonding structures and methods Grant 10,153,180 - Chen , et al. Dec	2018-12-11
Substrate and package structure Grant 10,141,281 - Lin , et al. Nov	2018-11-27
Package on-package process for applying molding compound Grant 10,134,703 - Chen , et al. November 20, 2	2018-11-20
Semiconductor Bonding Structures and Methods App 20180330970 - Chen; Meng-Tse ; et al.	2018-11-15
Structure And Formation Method Of Chip Package With Fan-out Structure App 20180315728 - PEI; Hao-Jan ; et al.	2018-11-01
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices Grant 10,109,612 - Huang , et al. October 23, 2	2018-10-23
Package Structure And Method Of Forming Package Structure App 20180286823 - TAI; Chih-Hsuan ; et al.	2018-10-04
Package structure and method of fabricating the same Grant 10,074,615 - Tseng , et al. September 11, 2	2018-09-11
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof App 20180211928 - Chang; Chia-Lun ; et al.	2018-07-26
Package-on-Package Structures and Methods for Forming the Same App 20180197847 - Huang; Kuei-Wei ; et al.	2018-07-12
Semiconductor Processing Boat Design With Pressure Sensor App 20180166308 - Ang; Ai-Tee ; et al.	2018-06-14
Package-on-Package Structure with Epoxy Flux Residue App 20180166421 - Yu; Chen-Hua ; et al.	2018-06-14
Method For Manufacturing Interconnect Structure App 20180151523 - CHEN; MENG-TSE ; et al.	2018-05-31
Package structure and method for manufacturing the same Grant 9,978,716 - Tsao , et al. May 22, 2	2018-05-22
Methods of forming connector pad structures, interconnect structures, and structures thereof Grant 9,935,067 - Chang , et al. April 3, 2	2018-04-03
Package-on-package structures and methods for forming the same Grant 9,935,091 - Huang , et al. April 3, 2	2018-04-03
Semiconductor packaging and manufacturing method thereof Grant 9,935,044 - Lin , et al. April 3, 2	2018-04-03
Dicing in wafer level package Grant 9,929,071 - Cheng , et al. March 27, 2	2018-03-27
Semiconductor Packages having Dummy Connectors and Methods of Forming Same App 20180076184 - Chen; Chen-Shien ; et al.	2018-03-15
Semiconductor processing boat design with pressure sensor Grant 9,911,633 - Ang , et al. March 6, 2	2018-03-06
Systems for processing semiconductor devices, and methods of processing semiconductor devices Grant 9,888,527 - Lin , et al. February 6, 2	2018-02-06
Manufacturing method of interconnect structure Grant 9,881,888 - Chen , et al. January 30, 2	2018-01-30
Package-on-package structure with epoxy flux residue Grant 9,881,903 - Yu , et al. January 30, 2	2018-01-30
Stud Bump Structure For Semiconductor Package Assemblies App 20180005973 - CHEN; Meng-Tse ; et al.	2018-01-04
Package-on-package Structure With Epoxy Flux Residue App 20170345794 - Yu; Chen-Hua ; et al.	2017-11-30
Package Structure And Method For Manufacturing The Same App 20170317054 - TSAO; Chih-Chiang ; et al.	2017-11-02
Stud bump structure for semiconductor package assemblies Grant 9,768,137 - Chen , et al. September 19, 2	2017-09-19
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof App 20170154862 - Chang; Chia-Lun ; et al.	2017-06-01
Packages and methods for forming the same Grant 9,627,369 - Chen , et al. April 18, 2	2017-04-18
Warpage Control in the Packaging of Integrated Circuits App 20170098571 - Cheng; Ming-Da ; et al.	2017-04-06
Package on package interconnect structure Grant 9,607,921 - Lu , et al. March 28, 2	2017-03-28
Dicing in Wafer Level Package App 20170062300 - Cheng; Chia-Shen ; et al.	2017-03-02
Methods of forming connector pad structures, interconnect structures, and structures thereof Grant 9,570,410 - Chang , et al. February 14, 2	2017-02-14
Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof App 20170033065 - Chang; Chia-Lun ; et al.	2017-02-02
Interconnection Joints Having Variable Volumes In Package Structures And Methods Of Formation Thereof App 20170025382 - Kuo; Hsuan-Ting ; et al.	2017-01-26
Interconnection joints having variable volumes in package structures and methods of formation thereof Grant 9,536,865 - Kuo , et al. January 3, 2	2017-01-03
Warpage control in the packaging of integrated circuits Grant 9,538,582 - Cheng , et al. January 3, 2	2017-01-03
Integrated fan-out structure and method Grant 9,524,956 - Pei , et al. December 20, 2	2016-12-20
Semiconductor Processing Boat Design with Pressure Sensor App 20160358797 - Ang; Ai-Tee ; et al.	2016-12-08
Substrate and Package Structure App 20160358878 - LIN; WEI-HUNG ; et al.	2016-12-08
Package-on-Package Structures and Methods for Forming the Same App 20160351554 - Huang; Kuei-Wei ; et al.	2016-12-01
Stacked dies with wire bonds and method Grant 9,508,703 - Yu , et al. November 29, 2	2016-11-29
Dicing in wafer level package Grant 9,484,227 - Cheng , et al. November 1, 2	2016-11-01
Semiconductor processing boat design with pressure sensor Grant 9,427,818 - Ang , et al. August 30, 2	2016-08-30
Substrate and package structure Grant 9,425,157 - Lin , et al. August 23, 2	2016-08-23
Semiconductor Packaging And Manufacturing Method Thereof App 20160218055 - LIN; HSIU-JEN ; et al.	2016-07-28
Interconnect Structure And Manufacturing Method Thereof App 20160211234 - CHEN; MENG-TSE ; et al.	2016-07-21
Reflow process and tool Grant 9,373,603 - Ang , et al. June 21, 2	2016-06-21
Semiconductor packaging and manufacturing method thereof Grant 9,355,927 - Lin , et al. May 31, 2	2016-05-31
Integrated Fan-Out Structure and Method App 20160126226 - Pei; Hao-Jan ; et al.	2016-05-05
Semiconductor interconnect structure Grant 9,331,038 - Chen , et al. May 3, 2	2016-05-03
System and method for fine pitch PoP structure Grant 9,281,288 - Lin , et al. March 8, 2	2016-03-08
Packaging methods and packaged semiconductor devices Grant 9,263,412 - Lin , et al. February 16, 2	2016-02-16
Package on package structure and method of manufacturing the same Grant 9,230,935 - Lin , et al. January 5, 2	2016-01-05
Stacked Dies With Wire Bonds and Method App 20150318264 - Yu; Chen-Hua ; et al.	2015-11-05
Reflow Process and Tool App 20150249062 - Ang; Ai-Tee ; et al.	2015-09-03
Substrate And Package Structure App 20150243620 - LIN; WEI-HUNG ; et al.	2015-08-27
Packages and Methods for Forming the Same App 20150243642 - Chen; Meng-Tse ; et al.	2015-08-27
Semiconductor Processing Boat Design With Pressure Sensor App 20150206779 - Ang; Ai-Tee ; et al.	2015-07-23
Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices App 20150201462 - Lin; Hsiu-Jen ; et al.	2015-07-16
Packaging methods and structures for semiconductor devices Grant 9,082,636 - Lin , et al. July 14, 2	2015-07-14
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices App 20150171051 - Huang; Kuei-Wei ; et al.	2015-06-18
Semiconductor Packaging And Manufacturing Method Thereof App 20150145130 - LIN; HSIU-JEN ; et al.	2015-05-28
Packages and methods for forming the same Grant 9,030,022 - Chen , et al. May 12, 2	2015-05-12
Package on Package Structure and Method of Manufacturing the Same App 20150108638 - Lin; Chun-Cheng ; et al.	2015-04-23
Semiconductor Bonding Structures and Methods App 20150091193 - Chen; Meng-Tse ; et al.	2015-04-02
Interconnect Structure And Manufacturing Method Thereof App 20150061115 - CHEN; MENG-TSE ; et al.	2015-03-05
Packaging Methods and Structures for Semiconductor Devices App 20150044819 - Lin; Chih-Wei ; et al.	2015-02-12
Package-on-Package Process for Applying Molding Compound App 20150008581 - Chen; Meng-Tse ; et al.	2015-01-08
Package-on-package process for applying molding compound Grant 8,927,391 - Chen , et al. January 6, 2	2015-01-06
Packaging Methods and Packaged Semiconductor Devices App 20140367867 - Lin; Wei-Hung ; et al.	2014-12-18
Package on package structure and method of manufacturing the same Grant 8,901,726 - Lin , et al. December 2, 2	2014-12-02
Packaging methods and structures for semiconductor devices Grant 8,884,431 - Lin , et al. November 11, 2	2014-11-11
Methods for metal bump die assembly Grant 8,853,002 - Lin , et al. October 7, 2	2014-10-07
Package-on-Package Structures and Methods for Forming the Same App 20140264856 - Huang; Kuei-Wei ; et al.	2014-09-18
Methods for Metal Bump Die Assembly App 20140193952 - Lin; Hsiu-Jen ; et al.	2014-07-10
Package On Package Structure And Method Of Manufacturing The Same App 20140159233 - Lin; Chun-Cheng ; et al.	2014-06-12
System and Method for Fine Pitch PoP Structure App 20140151878 - Lin; Cheng-Chung ; et al.	2014-06-05
Forming wafer-level chip scale package structures with reduced number of seed layers Grant 8,735,273 - Lu , et al. May 27, 2	2014-05-27
Die-bonded LED Grant 8,716,737 - Lin , et al. May 6, 2	2014-05-06
System and method for fine pitch PoP structure Grant 8,674,496 - Lin , et al. March 18, 2	2014-03-18
Warpage Control in the Packaging of Integrated Circuits App 20140027431 - Cheng; Ming-Da ; et al.	2014-01-30
Method For Bonding Led Wafer, Method For Manufacturing Led Chip And Bonding Structure App 20130334561 - LIN; Hsiu-Jen ; et al.	2013-12-19
Stud Bump Structure For Semiconductor Package Assemblies App 20130285238 - CHEN; Meng-Tse ; et al.	2013-10-31
System and Method for Fine Pitch PoP Structure App 20130214401 - Lin; Cheng-Chung ; et al.	2013-08-22
Metal bump formation Grant 8,501,615 - Cheng , et al. August 6, 2	2013-08-06
Package on Package Interconnect Structure App 20130181338 - Lu; Wen-Hsiung ; et al.	2013-07-18
Method Of Processing Solder Bump By Vacuum Annealing App 20130143364 - LIN; Hsiu-Jen ; et al.	2013-06-06
Methods for Performing Reflow in Bonding Processes App 20130122652 - Lin; Hsiu-Jen ; et al.	2013-05-16
Methods for performing reflow in bonding processes Grant 8,440,503 - Lin , et al. May 14, 2	2013-05-14
Apparatus and Methods for Molded Underfills in Flip Chip Packaging App 20130115735 - Chen; Meng-Tse ; et al.	2013-05-09
Semiconductor Package Having Solder Jointed Region With Controlled Ag Content App 20130099371 - CHENG; Ming-Da ; et al.	2013-04-25
Packages and Methods for Forming the Same App 20130099385 - Chen; Meng-Tse ; et al.	2013-04-25
Packaging Methods and Structures for Semiconductor Devices App 20130062761 - Lin; Chih-Wei ; et al.	2013-03-14
Forming Wafer-Level Chip Scale Package Structures with Reduced number of Seed Layers App 20130009307 - Lu; Wen-Hsiung ; et al.	2013-01-10
Led Module And Packaging Method Thereof App 20130005055 - Lin; Jian-Shian ; et al.	2013-01-03
Metal Bump Formation App 20120322255 - Cheng; Ming-Da ; et al.	2012-12-20
Package-on-Package Process for Applying Molding Compound App 20120299181 - Chen; Meng-Tse ; et al.	2012-11-29
Die-bonded Led App 20120256228 - Lin; Hsiu Jen ; et al.	2012-10-11
Method of forming metal pillar Grant 8,242,011 - Lim , et al. August 14, 2	2012-08-14
LED module and packaging method thereof Grant 8,235,551 - Lin , et al. August 7, 2	2012-08-07
Die-bonding method of LED chip and LED manufactured by the same Grant 8,236,687 - Lin , et al. August 7, 2	2012-08-07
Method Of Forming Metal Pillar App 20120178251 - LIM; Zheng-Yi ; et al.	2012-07-12
Multi-stack Package Led App 20110156071 - Cheng; Chia Shen ; et al.	2011-06-30
Die-bonding Method Of Led Chip And Led Manufactured By The Same App 20110127563 - Lin; Hsiu Jen ; et al.	2011-06-02
Method Of Manufacturing Light Emitting Diode Package App 20110111539 - Lai; Chieh-Lung ; et al.	2011-05-12
Led Module And Packaging Method Thereof App 20100157595 - Lin; Jian-Shian ; et al.	2010-06-24
Ratchet wrench with a grip App 20040255724 - Lin, Hsiu-Jen	2004-12-23