Lin; Hsing-Yen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Hsing-Yen.The latest application filed is for "heat dissipation structure of horizontal optical-communication sub-assembly".

Company Profile

2.3.7

Lin; Hsing-Yen - Taoyuan TW
LIN; HSING-YEN - Taoyuan City TW
LIN; Hsing-Yen - Zhongli City TW
LIN; Hsing-Yen - Taoyuan County TW
Lin; Hsing-Yen - Zhongli TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat dissipation structure of horizontal optical-communication sub-assembly Grant 10,656,355 - Law , et al.	2020-05-19
Heat Dissipation Structure Of Horizontal Optical-communication Sub-assembly App 20190361181 - LAW; PI-CHENG ; et al.	2019-11-28
Assembly Of Semiconductor And Highly Thermally Conductive Heat-dissipating Substrates App 20180248336 - LIN; Hsing-Yen ; et al.	2018-08-30
Optical Communication Module Configured For Enhancing Optical Coupling Efficiency App 20180188457 - Law; Pi-Cheng ; et al.	2018-07-05
Optical Communication Module Configured For Enhancing Optical Coupling Efficiency App 20180188458 - LAW; Pi-Cheng ; et al.	2018-07-05
Composite Heat-dissipating Substrate App 20180190520 - LIN; Hsing-Yen ; et al.	2018-07-05
Heat-dissipating Semiconductor Assembly App 20180191131 - Lin; Hsing-Yen ; et al.	2018-07-05
Optical transmitter with a heat dissipation structure Grant 9,991,674 - Law , et al. June 5, 2	2018-06-05
Optical Transmitter With A Heat Dissipation Structure App 20180019569 - LAW; Pi-Cheng ; et al.	2018-01-18
Flexible printed circuit and printed circuit board soldered structure Grant 9,854,674 - Chen , et al. December 26, 2	2017-12-26

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