Lin; Hsien-Chieh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Hsien-Chieh.The latest application filed is for "circuit board structures and methods of fabricating the same".

Company Profile

1.11.11

Lin; Hsien-Chieh - Taoyuan TW
LIN; Hsien-Chieh - Taoyuan City TW
Lin; Hsien-Chieh - Taipei TW
Lin; Hsien-Chieh - Taoyuan County N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit board structures and methods of fabricating the same Grant 10,798,828 - Lin October 6, 2	2020-10-06
Circuit Board Structures And Methods Of Fabricating The Same App 20200214145 - LIN; Hsien-Chieh	2020-07-02
Antireflection substrate structure and manufacturing method thereof Grant 10,236,395 - Lin , et al.	2019-03-19
Antireflection Substrate Structure And Manufacturing Method Thereof App 20160079449 - Lin; Chiung-Wei ; et al.	2016-03-17
Antireflection substrate structure and manufacturing method thereof Grant 9,224,893 - Lin , et al. December 29, 2	2015-12-29
Antireflection Substrate Structure And Manufacturing Method Thereof App 20140159187 - Lin; Chiung-Wei ; et al.	2014-06-12
Printed circuit board and method for fabricating the same Grant 8,420,954 - Lin , et al. April 16, 2	2013-04-16
Printed circuit board and method for fabricating the same Grant 8,378,225 - Lin February 19, 2	2013-02-19
Printed circuit board structure Grant 8,243,464 - Lin August 14, 2	2012-08-14
Printed Circuit Board And Method For Fabricating The Same App 20120043127 - LIN; Hsien-Chieh ; et al.	2012-02-23
Side Packaged Type Printed Circuit Board App 20110220403 - Lin; Hsien-Chieh	2011-09-15
Printed Circuit Board Structure App 20110100695 - Lin; Hsien-Chieh	2011-05-05
Printed Circuit Board And Method For Fabricating The Same App 20110036620 - Lin; Hsien-Chieh	2011-02-17
Lot traceable printed circuit board Grant 7,576,287 - Lo , et al. August 18, 2	2009-08-18
Embedded chip package with improved heat dissipation performance and method of making the same Grant 7,528,482 - Huang , et al. May 5, 2	2009-05-05
Solder pad and method of making the same Grant 7,521,800 - Chu , et al. April 21, 2	2009-04-21
Packaging Substrate With Embedded Chip And Buried Heatsink App 20080315398 - Lo; Hsing-Lun ; et al.	2008-12-25
Solder Pad And Method Of Making The Same App 20080251917 - Chu; Chih-Chung ; et al.	2008-10-16
Lot Traceable Printed Circuit Board App 20080149732 - Lo; Hsing-Lun ; et al.	2008-06-26
Embedded Chip Package With Improved Heat Dissipation Performance And Method Of Making The Same App 20080116569 - Huang; Cheng-Hung ; et al.	2008-05-22

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