LIN; Hsiao Jung
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIN; Hsiao Jung.The latest application filed is for "bumped pad structure".
- LIN; Hsiao Jung - Taichung TW
- LIN; Hsiao-Jung - New Taipei City TW
- Lin; Hsiao-Jung - New Taipei TW
| Patent | Date |
|---|---|
| Bumped Pad Structure App 20210391286 - LIN; Hsiao Jung ; et al. | 2021-12-16 |
| Heat Dissipation Unit Used In Memory Device App 20140202675 - CHEN; Wei-Hau ; et al. | 2014-07-24 |
| Slidingly-engaged heat-dissipating assembly for memory and memory device having the same Grant 8,411,443 - Chen , et al. April 2, 2 | 2013-04-02 |
| Slidingly-engaged Heat-dissipating Assembly For Memory And Memory Device Having The Same App 20120188707 - CHEN; Wei-Hau ; et al. | 2012-07-26 |
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