Lin; Heny
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Heny.The latest application filed is for "adaptable molded leadframe package and related method".
- Lin; Heny - Irvine CA
| Patent | Date |
|---|---|
| Adaptable molded leadframe package and related method Grant 9,892,997 - Lin , et al. February 13, 2 | 2018-02-13 |
| Adaptable Molded Leadframe Package and Related Method App 20170301613 - Lin; Heny ; et al. | 2017-10-19 |
| Semiconductor package for III-nitride transistor stacked with diode Grant 9,530,774 - Lin , et al. December 27, 2 | 2016-12-27 |
| III-nitride device and FET in a package Grant 9,312,245 - Lin , et al. April 12, 2 | 2016-04-12 |
| Semiconductor Package for III-Nitride Transistor Stacked with Diode App 20150162326 - Lin; Heny ; et al. | 2015-06-11 |
| III-nitride transistor stacked with diode in a package Grant 8,963,338 - Lin , et al. February 24, 2 | 2015-02-24 |
| III-Nitride Device and FET in a Package App 20150008445 - Lin; Heny ; et al. | 2015-01-08 |
| III-nitride transistor stacked with FET in a package Grant 8,847,408 - Lin , et al. September 30, 2 | 2014-09-30 |
| III-Nitride Transistor Stacked with FET in a Package App 20120223321 - Lin; Heny ; et al. | 2012-09-06 |
| III-Nitride Transistor Stacked with Diode in a Package App 20120223322 - Lin; Heny ; et al. | 2012-09-06 |
| Die-on-leadframe (dol) With High Voltage Isolation App 20070257343 - Hauenstein; Henning M. ; et al. | 2007-11-08 |
| Semiconductor half-bridge module with low inductance App 20060290689 - Grant; William ; et al. | 2006-12-28 |
| Half-bridge power module with insert molded heatsinks Grant 7,149,088 - Lin , et al. December 12, 2 | 2006-12-12 |
| Non-isolated heatsink(s) for power modules Grant 7,042,730 - Vaysse , et al. May 9, 2 | 2006-05-09 |
| Half-bridge power module with insert molded heatsinks App 20050280998 - Lin, Heny ; et al. | 2005-12-22 |
| Non-isolated heatsink(s) for power modules App 20040095729 - Vaysse, Bertrand ; et al. | 2004-05-20 |
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