Lin; Han-Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Han-Wen.The latest application filed is for "integrated antenna package structure and manufacturing method thereof".

Company Profile

5.5.6

Lin; Han-Wen - Hsinchu County TW
Lin; Han-Wen - Chiayi TW
LIN; Han-Wen - Hsinchu City TW
LIN; Han-Wen - Chiayi City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Antenna Package Structure And Manufacturing Method Thereof App 20200328497 - Lin; Han-Wen ; et al.	2020-10-15
Manufacturing method of package structure Grant 10,796,931 - Lin , et al. October 6, 2	2020-10-06
Manufacturing Method Of Package Structure App 20200126815 - Lin; Han-Wen ; et al.	2020-04-23
Package structure and manufacturing method thereof Grant 10,438,931 - Lin , et al. O	2019-10-08
Package Structure And Manufacturing Method Thereof App 20190013214 - Lin; Han-Wen ; et al.	2019-01-10
Test method for a redistribution layer Grant 10,079,218 - Lin , et al. September 18, 2	2018-09-18
Package Structure And Manufacturing Method Thereof App 20180204822 - Lin; Han-Wen ; et al.	2018-07-19
Test method for a redistribution layer Grant 10,002,848 - Lin , et al. June 19, 2	2018-06-19
Electric connecting structure comprising preferred oriented Cu.sub.6Sn.sub.5 grains and method for fabricating the same Grant 8,952,267 - Chen , et al. February 10, 2	2015-02-10
Circuit Board With Twinned Cu Circuit Layer And Method For Manufacturing The Same App 20140103501 - CHEN; Chih ; et al.	2014-04-17
Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same App 20130302646 - CHEN; Chih ; et al.	2013-11-14

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