Lin; Geraldine Tsui Yee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Geraldine Tsui Yee.The latest application filed is for "integrated circuit package and process for fabricating the same".
- Lin; Geraldine Tsui Yee - Tung Tau Est N/A HK
- LIN; Geraldine Tsui Yee - Hong Kong HK
| Patent | Date |
|---|---|
| Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion Grant 9,520,306 - Lin , et al. December 13, 2 | 2016-12-13 |
| Integrated Circuit Package And Process For Fabricating The Same App 20160013075 - LIN; Geraldine Tsui Yee ; et al. | 2016-01-14 |
| Integrated circuit package having a plurality of spaced apart pad portions Grant 8,330,270 - Lin , et al. December 11, 2 | 2012-12-11 |
| Cavity-type integrated circuit package Grant 7,732,914 - McLellan , et al. June 8, 2 | 2010-06-08 |
| Integrated circuit package with partially exposed contact pads and process for fabricating the same Grant 7,411,289 - McLellan , et al. August 12, 2 | 2008-08-12 |
| Integrated circuit package and process for fabricating the same Grant 7,091,581 - McLellan , et al. August 15, 2 | 2006-08-15 |
| Process for dressing molded array package saw blade Grant 6,903,304 - McLellan , et al. June 7, 2 | 2005-06-07 |
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